권호 표지

한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference) (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)

  • 반년간

과학기술표준분류

  • 전기/전자 ＞ 전기전자부품

한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나

  1. 강남기;박세훈;박종철 1
    PDF
  2. 윤상근 27
    PDF
  3. 황태경 37
    PDF
    Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster
  4. 김동식 49
    PDF
  5. 정영희 67
    PDF
  6. 최종우 81
    PDF
  7. 윤혜선 101
    PDF
  8. 방효재 115
    PDF
    [ ${\blacktriangleright$ ] Various Factors to affect TC Reliability of 4 array RES has been Investigated through Simulation Tool and Daisy Chain Board Test ${\blacktriangleright$ Solder Joint Crack Mechanism of 4 array RES has been Examined Also, It has been Examined Thoroughly What Influence Each Factors gibes to TC Reliability and Why Those Factors gives an Influence to it ${\blacktriangleright$ BGA Type RES is Suggested to Improve TC Reliability (Patented) ${\blacktriangleright$ Through this Study, Best Design Parameter has been Optimized to Increase TC Reliability of 4 Array RES
  9. 함석진 129
    PDF
    [ ${\square}$ ] A mathematical model has been developed and used to analyze the limits of He fine leak test. ${\square}$ Uncertainties inherent in using the MIL-STD-883 guidelines for hermeticity evaluation of small packages have been demonstrated. ${\square}$ A new methodology to quantitatively characterize hermeticity has been developed.