한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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4 Array Resistor의 TC 신뢰성에 영향을 미치는 Factor에 관한 연구

Study on Factors to affect TC Reliability of 4 array Resistor

  • 발행 : 2007.04.04
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초록

[ ${\blacktriangleright$ ] Various Factors to affect TC Reliability of 4 array RES has been Investigated through Simulation Tool and Daisy Chain Board Test ${\blacktriangleright$ Solder Joint Crack Mechanism of 4 array RES has been Examined Also, It has been Examined Thoroughly What Influence Each Factors gibes to TC Reliability and Why Those Factors gives an Influence to it ${\blacktriangleright$ BGA Type RES is Suggested to Improve TC Reliability (Patented) ${\blacktriangleright$ Through this Study, Best Design Parameter has been Optimized to Increase TC Reliability of 4 Array RES

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