Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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High Technology and Latest Trends of WBG Power Semiconductors

WBG 전력반도체 최신 기술 및 동향

  • Lee, Jeong-Hyun (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Do-hyun (Lightweight Materials Technology Center, Gyeongbuk Technopark) ;
  • Oh, Seung-jin (Duksan Hi-Metal Co. Ltd) ;
  • Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
  • 이정현 (서울시립대학교 신소재공학과) ;
  • 정도현 (경북테크노파크 경량소재융복합기술센터) ;
  • 오승진 ((주)덕산하이메탈) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2018.12.12
  • Accepted : 2018.12.28
  • Published : 2018.12.31
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Abstract

Recently, electric semiconductors became an issue because of efficient use of energy and compaction of electronics. Silicon electric semiconductors are difficult to put into it because of its physical limitations. Hence, the study of WBG (Wideband Gap) semiconductors like SiC and GaN began. These devices received attention because it can be miniaturized and worked at high temperatures over $300^{\circ}C$. WBG MOSFET electric semiconductors can show performance like silicon IGBT. This can solve the current problem of IGBT tail. The current study shows the technical principles and issues related to SiC and GaN power semiconductors. WBG devices can achieve high performance compared to silicon, but its performance can't be fully utilized because of lack in bonding technology. Therefore, this review introduces research on WBG devices and their packaging issues.

Keywords

MOKRBW_2018_v25n4_17_f0001.png 이미지

Fig. 1. Structure of power devices.1)

MOKRBW_2018_v25n4_17_f0002.png 이미지

Fig. 2. Market of power semiconductor.3)

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Fig. 3. Comparison of Si, SiC and GaN.4)

MOKRBW_2018_v25n4_17_f0004.png 이미지

Fig. 4. Comparison of power loss.18)

MOKRBW_2018_v25n4_17_f0005.png 이미지

Fig. 5. Comparison of ROHM inverter and existing inverter.19)

MOKRBW_2018_v25n4_17_f0006.png 이미지

Fig. 6. SEM images of sintered Ag joint using Ag particle paste.23)

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