The Development of Pattern Classification for Inner Defects in Semiconductor Packages by Self-Organizing Map

자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발

  • 김재열 (조선대학교 기계공학부) ;
  • 윤성운 (조선대학교 기계공학부) ;
  • 김훈조 (광주인력개발원 기계설계제작과) ;
  • 김창현 (조선대하교 대학원 정밀기계공학과) ;
  • 양동조 (조선대학교 대학원 정밀기계공학과) ;
  • 송경석 (조선대학교 대학원 광응용공학과)
  • Published : 2003.04.01

Abstract

In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

Keywords

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