• Title/Summary/Keyword: x-ray photoelectron

Search Result 1,472, Processing Time 0.035 seconds

Growth environments depends interface and surface characteristics of yttria-stabilized zirconia thin films

  • Bae, Jong-Seong;Park, Su-Hwan;Park, Sang-Sin;Hwang, Jeong-Sik;Park, Seong-Gyun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2011.02a
    • /
    • pp.309-309
    • /
    • 2011
  • There have been large research activities on the high quality oxide films for the realization oxide based electronics. However, the interface interdiffusion prohibits achieving high quality oxide films, when the oxide films are grown on non-oxide substrates. In the case of Si substrates, there exist lattice mismatch and interface interdiffusion when oxide films deposited on direct Si surface. In this presentation, we report the interface characteristics of yttria-stabilized zirconia films grown on silicon substrates. From x-ray reflectivity analysis we found that the film thickness and interface roughness decreased as the growth temperature increased, indicating that the growth mechanism varies and the chemical reaction is limited to the interface as the growth condition varies. Furthermore, the packing density of the film increased as the growth temperature increased and the film thickness decreased. X-ray photoelectron spectroscopy analysis of very thin films revealed that the amount of chemical shift increased as the growth temperature increased. Intriguingly, the direction of the chemical shift of Zr was opposite to that of Si due to the second nearest neighbor interaction.

  • PDF

Contamination structure and process on SUS 316 under UHV, HV and air (초고진공, 고진공, 대기압에서 SUS 316의 오염 구조와 오염 과정 연구)

  • 서지근;이규장;신용현;홍승수;정광화
    • Journal of the Korean Vacuum Society
    • /
    • v.6 no.1
    • /
    • pp.1-8
    • /
    • 1997
  • The contamination structure and process on SUS 316 under various exposure conditions were investigated using x-ray photoelectron spectroscopy. The metal-oxide, metal-H-oxides, CO, COH, and $C_xH_y$ are the main components of contaminants on the SUS surface. The compositional profiles of the contaminants are shown to be $C_xH_y$/CO(COH)/metal-oxide on SUS. The contamination proceeds in two steps. The oxidation of the metallic constituents followed by adsorption of hydrocarbons. Under UHV conditions the contamination is mainly due to the oxidation, and, as the exposure time increases, the oxidation continues. In HV or higher pressure, most of the oxides are formed almost immediately after exposure and as the exposure time increases the contamination of hydrocarbons continues to grow. For the SUS sample exposed to atmosphere, the metal oxide is distributed deep inside the surface with an exponentially decreasing concentration, and its thickness is nearly in the order of photoelectron mean free path. It is also seen that the Fe oxide is segregated over Cr oxide in the highly oxidized samples.

  • PDF

Surface Etching of TiO2 Thin Films Using High Density Cl2/Ar Plasma

  • Woo, Jong-Chang;Joo, Young-Hee;Kim, Chang-Il
    • Transactions on Electrical and Electronic Materials
    • /
    • v.16 no.6
    • /
    • pp.346-350
    • /
    • 2015
  • In this study, we carried out an investigation of the etch characteristics of TiO2 thin films and the selectivity of TiO2 to SiO2 in adaptive coupled C12/Ar plasma. The maximum etch rate of the TiO2 thin film was 136±5 nm/min at a gas mixing ratio of C12/Ar (75%:25%). The X-ray photoelectron spectroscopy (XPS) analysis showed the efficient destruction of oxide bonds by the ion bombardment as well as the accumulation of low volatile reaction products on the etched surface.

Application of X-ray photoelectron spectroscopy (XPS) in ionic liquids

  • Park, Ju-Yeon;Seo, Cho-Hyeon;Seo, Seong-Yong;Gang, Yong-Cheol
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2015.08a
    • /
    • pp.117-117
    • /
    • 2015
  • Availability of X-ray photoelectron spectroscopy (XPS) for the identification of ionic liquids (ILs) was tested. Commercially available ionic liquids (1-butyl-3-methyl imidazolium tetrafluoroborate ([BMIM] $BF_4$), (1-butyl-3-methyl imidazolium trifluoromethanesulfonate ([BMIM] OTf), (1-butyl-3-methyl imidazolium hexafluorophosphate ([BMIM] $PF_6$), 1-hexyl-3-imidazolium hexafluorophosphate ([HMIM] $PF_6$), and 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide ([EMIM] $Tf_2N$) were qualitatively and semi-quantitatively analyzed with XPS. In order to confirm whether the results of XPS were correct, conventional method such as a nuclear magnetic resonance (NMR) was performed. After the XPS results were convinced by NMR, we synthesized ILs (1-(4-sulfonic acid) butyl-3-butylimidazolium trifluoromethanesulfonate ([SBBIM] OTf), 1-(4-sulfonic acid) propyl-3-methylimidazolium trifluoromethanesulfonate ([SPMIM] OTf), and 1-(4-sulfonic acid) propyl-3-butylimidazolium trifluoromethanesulfonate ([SPBIM] OTf) and analyzed it with XPS and NMR as well. It was successful the usage of XPS to analyze ILs without any purification processes.

  • PDF

Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis

  • Kim, Nam-Hoon;Seo, Yong-Jin;Ko, Pil-Ju;Lee, Woo-Sun
    • Transactions on Electrical and Electronic Materials
    • /
    • v.6 no.4
    • /
    • pp.164-168
    • /
    • 2005
  • Effects of high-temperature slurry were investigated on the chemical mechanical polishing (CMP) performance of tetra-ethyl ortho-silicate (TEOS) film with silica and ceria slurries by the surface analysis of X-ray photoelectron spectroscopy (XPS). The pH showed a slight tendency to decrease with increasing slurry temperature, which means that the hydroxyl $(OH^-)$ groups increased in slurry as the slurry temperature increased and then they diffused into the TEOS film. The surface of TEOS film became hydro-carbonated by the diffused hydroxyl groups. The hydro-carbonated surface of TEOS film could be removed more easily. Consequently, the removal rate of TEOS film improved dramatically with increasing slurry temperature.

The effect of chemical kinetics of slurry components on Cu CMP (화학반응속도가 Cu CMP에 미치는 영향)

  • Jung, Won-Duck;Chang, One-Moon;Park, Sung-Min;Jeong, Hae-Do
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2006.11a
    • /
    • pp.372-373
    • /
    • 2006
  • Chemical kinetics affects Cu CMP results (removal rate, Non uniformity etc.) Because Cu is removed by chemical action. Key factors in chemical kinetics are process temperature and concentration of slurry components. In this study, Hydrogen peroxide and citric acid were selected as a oxidant and a complexing agent and Slurry were made by mixing this components. In order to study effects of Chemical Kinetics, X-ray photoelectron spectroscopy (XPS) were performed on Cu sample after etching test as concentration of citric acid and slurry temperature. Finally Cu CMP was performed as same conditions.

  • PDF

Dissociation of Thymine by Low-Energy Electrons

  • Cho, Hyuck;Noh, Hyung-Ah
    • Journal of Radiation Protection and Research
    • /
    • v.45 no.1
    • /
    • pp.11-15
    • /
    • 2020
  • Background: There have been various studies to investigate the mechanisms of DNA damage from low-energy electrons. To understand the mechanism of these strand breaks, it is necessary to investigate the dissociation mechanism of the DNA constituents, that is, bases, sugars, and phosphates. Materials and Methods: We studied the dissociation of thymine base upon interaction with low-energy electrons. For this experiment, thymine powder was pressed onto the indium base and irradiated by 5 eV electrons. Results and Discussion: Non-irradiated and irradiated thymine samples were compared and analyzed using the X-ray photoelectron spectroscopic technique to analyze the dissociation patterns of the molecular bonds after low-energy electron irradiation of thymine. Conclusion: With 5 eV electron irradiation, C-C and N-C = O bonds are the primary dissociations that occur in thymine molecules.

Materials Stabilized Liquid Crystal Molecules on Chemically Modulated Polystyrene Surface Using Various Ion Beam Exposure Time

  • Han, Jeong-Min;Hwang, Hyun-Suk
    • Transactions on Electrical and Electronic Materials
    • /
    • v.11 no.6
    • /
    • pp.285-287
    • /
    • 2010
  • This paper introduces homogeneous liquid crystal (LC) orientations on chemically modulated polystyrene (PS) surfaces using various ion beam (IB) exposure times. Transparent PS was replaced with conventional polyimide material. As a non-contact process, the IB bombardment process induced LC orientation parallel to the IB process. Through x-ray photoelectron spectroscopy, it was shown that the chemical compositional changes of the IB-irradiated PS surfaces were determined as a function of IB exposure time. Using this analysis, the optimal IB bombardment condition was determined at an IB exposure time of up to 15 seconds. Moreover, thermal stability on IB-irradiated PS surfaces were carried out which showed that a relatively high IB exposure time induced a thermally stable LC alignment property.

Non-Destructive Evaluation for Material of Thermal Barrier Coatings (단열 코팅재료의 비파괴 평가기법)

  • Lee Chul-Ku;Kim Tae-Hyung
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.14 no.1
    • /
    • pp.44-51
    • /
    • 2005
  • Material degradation is a multibillion-dollar problem which affects all the industries amongst others. The last decades have seen the development of newer and more effective techniques such as Focused-ion beam(FIB), Transmission electron microscopy(TEM), Secondary-ion mass spectroscopy(SIMS), auger electron spectroscopy(AES), X-ray Photoelectron spectroscopy(XPS) , Electrochemical impedance spectroscopy(EIS), Photo- stimulated luminescence spectroscopy(PSLS), etc. to study various forms of material degradation. These techniques are now used routinely to obtain information on the chemical state, depth profiling, composition, stress state, etc. to understand the degradation behavior. This paper describes the use of these techniques specifically applied to materials degradation and failure analysis.

Surface Analysis of Papers Treated with N-chloro-polyacrylamide Using X-ray Photoelectron Spectroscopy: Mechanism of Wet Strength Development

  • Chen Shaoping;Wu Zonghua;Tanaka Hiroo
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
    • /
    • 1999.04b
    • /
    • pp.276-281
    • /
    • 1999
  • The surfaces of sheets added with N-chloro-polyacrylamide (N-Cl-PAM) are analyzed using X-ray photoelectron spectroscopy (XPS) to clarify the chemical bonding involved in the paper strength development induced by N-Cl-PAM. The comparison of the observed N1s chemical shift of the sheet with those of the paper strength additives and the model compound, 1-butyryl-3-propyl urea, illustrated the presence of covalent bonds of alkyl acyl urea and urethane on the fiber surfaces. Thus the formation of the covalent bonds by N-Cl-PAM themselves and by N-Cl-PAM with cellulose and hemicellulose may be an explanation for much higher effectiveness of N-Cl-PAM on the improvement of wet strength of paper than A-PAM.