• Title/Summary/Keyword: wetting tension

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Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders (웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성)

  • Jeon, Wook Sang;Rajendran, Sri Harini;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.1-6
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    • 2019
  • Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

Wettability Analysis of Solders using Wetting Balance Test (Wetting Balance Test를 이용한 솔더의 젖음성 분석)

  • Jung, Do-hyun;Lim, Dong-uk;Baek, Bum-gyu;Yim, Song-hee;Yoon, Jong-hyuk;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.1-9
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    • 2017
  • Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

Wetting Property and Reflectivity of Sn-3.5Ag Solder by Plating for LED Lead Frame (LED용 리드프레임 상의 Sn-3.5Ag 솔더 도금의 젖음성 및 반사율)

  • Kee, Se Ho;Xu, Zengfeng;Kim, Won Joong;Jung, Jae Pil
    • Korean Journal of Metals and Materials
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    • v.50 no.8
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    • pp.563-568
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    • 2012
  • The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

Effect of Nonionic Surfactant Solutions on Wetting and Absorbancy of PET Fabric 1. Mixtures and Dilutions of Span 20 and Tween 20 (비이온계 계면활성제 수용액이 PET직물의 습윤특성에 미치는 영향 제1보 : Span 20과 Tween 20의 혼합계와 희석계)

  • 김천희
    • Journal of the Korean Society of Clothing and Textiles
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    • v.27 no.9_10
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    • pp.1153-1159
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    • 2003
  • The effects of changing aqueous solution properties by nonionic surfactants on wetting behavior and water retention properies of hydrophobic PET (polyethylene terephthalate) fabric were reported. The aqueous solution properties were diversified by mixing and diluting two nonionic surfactants, i.e., sorbitan monolaurate (Span 20) and polyoxyethylene(20) sorbitan monolaurate (Tween 20). The surface wetting properties ($cos{\theta}$) of PET fabric were greatly improved by adding $10^{-1}g/dl$ Tween 20 and further improved by mixing Span 20 to the system. The water retention properties (W) of PET fabric were also greatly increased by addition of $10^{-1}g/dl$ Tween 20. In diluted surfactant systems, the $cos{\theta}'s$ were increased with decreasing surface tension of aqueous liquids. The ratios of aqueous liquid retained in the pore structure to liquid retention capacity (W/H) were also increased with decreasing surface tension, however, W/H values were dramatically increased right after critical micelle concentration (cmc). The existence of micelles was important for the retention of aqueous liquids in the fabric. The critical surface tension of PET fabric used was found to be 28.7dyne/cm.

A Study on Wettability and Defects Behavior of Flow-soldered Joint using Low Residue Flux (저잔사 플럭스를 사용한 플로우 솔더링부의 젖음성 및 결함거동에 관한 연구)

  • 최명기;이창열;정재필;서창제;신영의
    • Journal of Welding and Joining
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    • v.16 no.6
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    • pp.77-85
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    • 1998
  • Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

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The Wetting Property of Indium Solder (인듐 솔더의 젖음특성)

  • 김대곤;이창배;정승부
    • Journal of Welding and Joining
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    • v.20 no.5
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    • pp.106-112
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    • 2002
  • In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

Durability of CFRP strengthened RC beams under wetting and drying cycles of magnesium sulfate attack

  • Rahmani, Hamid;Alipour, Soha;Mansoorkhani, Ali Alipour
    • Advances in concrete construction
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    • v.8 no.1
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    • pp.39-45
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    • 2019
  • Durability of strengthened reinforced concrete (RC) beams with CFRP sheets under wetting and drying cycles of magnesium sulfate attack is investigated in this research. Accordingly, 18 RC beams were designed and made where 10 of them were strengthened by CFRP sheets at their tension side. Magnesium sulfate attack and wetting and drying cycles with water and magnesium sulfate solution were considered as exposure conditions. Finally, flexural performance of the beams was measured before and after 5 months of exposure. Results indicated that the bending capacity of the strengthened RC beams was reduced about 10% after 5 months of immersion in the magnesium sulfate solution. Wetting and drying cycles of magnesium sulfate solution reduced the bending capacity of the strengthened RC beams about 7%. Also, flexural capacity reduction of the strengthened RC beams in water and under wetting and drying cycles of water was negligible.

Germination Enhancer and Wetting Agent for Quick Establishment of Kentucky bluegrass Cultivars

  • Lee, Sang-Kook
    • Weed & Turfgrass Science
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    • v.6 no.4
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    • pp.313-321
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    • 2017
  • Wetting agent is designed to reduce the surface tension of the liquid and spread more easily across or penetrate into the soil against water repellency. The effect of wetting agent to seed germination is not clear. Using germination enhancer is one of the methods to increase the germination speed of turfgrass seeds and to shorten establishment period. The objective of the study was to evaluate germination enhancer and wetting agent for quick establishment of various Kentucky bluegrass cultivars. The germination enhancer was used at two levels of 0.3 and $0.6ml\;kg^{-1}$ as low and high, respectively. Two levels of wetting agent were of 0.46, and $0.92ml\;m^{-2}$ as low and high, respectively. Germination enhancer has no synergistic effect with wetting agent. When quick establishment is required, selection of cultivar would be more effective instead of using germination enhancer and wetting agent. Among Kentucky bluegrass cultivars, 'Award' had the greatest turfgrass coverage for establishment and the greatest turfgrass color and quality based on the result of the study. When quick establishment is required, selection of cultivar would be more effective instead of using germination enhancer and wetting agent.

Wetting Phenomena between Sealing Glass and Free Cutting Steel (접합유리와 쾌삭강간의 Wetting 현상)

  • Kim, Heung;Kim, Chong-Hee
    • Journal of the Korean Ceramic Society
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    • v.19 no.1
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    • pp.24-34
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    • 1982
  • The effect of the several variables on wetting of AISIB1113 steel by molten glass was studied by Sessible-drop method. Experimental variables were temperature, firing atmospheres, Fe2O3 addition to the sealing glass and steel surface conditions. The degree of wetting in terms of contact angles between molten glass and metal tested at different test conditions was analyzed by using Young's equation. The results showed that contact angles in H2 atmosphere in the glass metal systems were high but in N2 atmosphere, were small for studied glass metal systems. Especially, when the glass drop was in contact with oxidized steel in N2 atmosphere, The best adherence with contact angle of approximately 9°was obtained. In the case of Fe2O3 addition in glass contact angles subtantially increased due to the increase of surface tension of glass. Wetting phenomena were also discussed under the basis of these experimental results.

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Improvement of Liquid Wetting and Retention Properties of Wool Fabric in Nonionic Surfactant Solutions (비이온계 계면활성제 수용액에서 모직물의 표면적심과 액체보유력 향상)

  • Kim, Chun-Hee
    • Textile Coloration and Finishing
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    • v.21 no.2
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    • pp.7-13
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    • 2009
  • The effects of 0.1g/dl nonionic surfactant solutions on liquid wetting and retention properties of wool fabric are reported. The 10 different nonionic surfactants (Span 20, Tween 20, 40, 60, 80, 21, 61, 81, 65, 85), wool cloth (EMPA 217), and wool soiled cloth (EMPA 107) are used in the study. Both EMPA 217 and 107 have water contact angle($\Theta$)>$90^{\circ}$, which indicates that water spreading over a fabric surface and penetration into the fabric rarely occur. However, EMPA 217 and 107 are easily wetted with perchloroethylene(PCE) having very low values of $\Theta$'s and high values of liquid retention. Water wetting properties are greatly improved by adding nonionic surfactants into the system. Generally, hydrophilic surfactants which have low number of carbon atoms or unsaturated hydrophobic structures are effective in improving water wetting of wool fabrics. The water retention of EMPA 217 and 107 in surfactant solutions have positive relations with $cos{\Theta}$, adhesion tension, and work of adhesion. 40.3% pore volume of EMPA 217 and 26.1% pore volume of EMPA 217 can be filled with water even when we assume $cos{\Theta}=1$ (${\Theta}=0^{\circ}$).