Browse > Article
http://dx.doi.org/10.6117/kmeps.2017.24.2.001

Wettability Analysis of Solders using Wetting Balance Test  

Jung, Do-hyun (Department of Materials Science and Engineering, University of Seoul)
Lim, Dong-uk (Department of Materials Science and Engineering, University of Seoul)
Baek, Bum-gyu (KD One Co. Ltd.)
Yim, Song-hee (KD One Co. Ltd.)
Yoon, Jong-hyuk (KD One Co. Ltd.)
Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.2, 2017 , pp. 1-9 More about this Journal
Abstract
Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.
Keywords
wetting balance test; soldering; wettability; surface tension; miniaturization;
Citations & Related Records
연도 인용수 순위
  • Reference
1 J. Y. Park, J. S. Ha, C. S. Kang, K. S. Shin, M. I. Kim, and J. P. Jung, "Study on the soldering in partial melting state (1) analysis of surface tension and wettability", J. Electron. Mater., 29(10), 1145 (2000).   DOI
2 J. Y. Park, C. S. Kang, and J. P. Jung, "The Analysis of the Withdrawal Force Curve of the Wetting Curve Using 63Sn-37Pb and 96.5Sn-3.5Ag Eutectic Solders", J. Electron. Mater., 28(11), 1256 (1999).   DOI
3 A. Sharma, H. R. Sohn, and J. P. Jung, "Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy", Met. Mater. Trans., A, 47(A), 494(2016).
4 G. Takyi, and P. Bernasko, "Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes", Int. J. Mater. Sci. Appl., 4(3), 165 (2015).   DOI
5 M. Ramli, M. Salleh, M. Derman, R. Said, N. Nasir, and N. Saud, "Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder", Key Eng. Mater., 700, 152 (2016).   DOI
6 R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thomson, and M. Christopher, "The Changing Automotive Environment: High-Temperature Electronics", IEEE Trans. on Electron. Packag. Manuf., 27(3), 164 (2004).   DOI
7 J. Y. Park, C. S. Kang, H. J. Han, and J. P. Jung, "Analysis of the Wetting Curve and It's Application to the Prediction of Ball Shape of BGA Package", J. Weld. Join., 2(1), 243 (1999).
8 S. M. Hong, J. Y. Park, C. B. Park, J. P. Jung, and C. S. Kang, "A Study on the Wetting Properties of UBM-coated Si-wafer", J. Microelectron. Packag. Soc., 7(2), 55 (2000).
9 S. M. Hong, J. Y. Park, M. I. Kim, J. P. Jung, and C. S. Kang, "The Fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders", J. Kor. Weld. Soc., 18(6), 74 (2000).
10 S. M. Hong, J. Y. Park, C. B. Park, J. P. Jung, and C. S. Kang, "The Fluxless Wetting Properties of TSM-coated Glass Substrate to the Pb-free Solders", J. Microelectron. Packag. Soc., 7(2), 47 (2000).
11 A. W. Adamson, and A. P. Gast, "Capillarity", Phys. Chem. Surf., 6th edition, 23-25, John Wiley & Sons, New York (1997).
12 J. A. Duis, and E. Meuler, "Measurement of the solderability of components", Philips Tech. Rev., 28(12), 362 (1967).
13 D. Mackay, "The solderability of component surfaces quantitative assessment by surface tension methods", Proc. INTERNEPCON 70, 170 (1970).
14 J. A. deVore, "Practical quantitative solderability testing", Proceed. IEEE 1989 Nation. Aerosp. and Electron. Conf., 4, 2027 (1989).
15 JFE Techno-Research Corporation, "Solder wettability test", http://www.jfe-tec.co.jp/en/electronic-component/case/case03.html
16 http://www.mtarr.co.uk/courses/topics/0149_stst/index.html
17 C. Lea, "Quantitative Solderability Measurement of Electronic Components Part 2: An Index of Solderability", Solder. Surf. Mount Tech., 2(1), 14 (1990).   DOI
18 C. Y. Ho, and J. G. Duh, "Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn-3.0Ag-0.5Cu solder", Mat. Lett., 92, 278 (2013).   DOI
19 J. L. Jellison, D. R. Johnson, and F. M. Hosking, IEEE Transactions on Parts, Hyb. Packag. PHP-12, 126 (1978).
20 C. Lea, "Quantitative Solderability Measurement of Electronic Components Part 1: The Wetting Balance", Solder. Surf. Mount Tech., 2(1), 8 (1990).   DOI
21 A. Siewiorek, A. Kudyba, N. Sobczak, M. Homa, Z. Huber, Z. Adamek, and J. Wojewoda-Budka, "Effect of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy", J. Mat. Eng. Perf., 22(8), 2247 (2013).
22 P. Xue, S. Xue, Y. Shen, F. Long, and H. Zhu, "Wettability and interfacial whiskers of Sn-9Zn-0.5Ga-0.08Nd solder with Sn, SnBi and Au/Ni coatings", J. Mat. Sci.: Mat. in Electron., 25(8), 3520 (2014).   DOI
23 J. H. Lee, Y. M. Kim, J. H. Hwang, and Y. H. Kim, "Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders", J. Allo. Compo., 567, 10 (2013).   DOI
24 K. H. Kim, J. Koike, J. W. Yoon, and S. H. Yoo, "Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints", J. Electron. Mat., 45(12), 6184 (2016).   DOI
25 A. J. Mayhew, and K. S. Monger, "Solderability by Meniscometry", Proc. INTERNEPCON 72, 53 (1972).
26 P. T. Viance, "A Overview of the Menicsometer/Wetting Balance Technique for Wettability Measurements", Met. Sci. Join., TMS, 265 (1991).
27 J. Y. Park, J. P. Jung, and C. S. Kang, "The Analysis of the Withdrawal Force Curve of the Wetting Balance Curve", IEEE Trans. on compo. Package. Tech., 22(3), 372 (1999).   DOI