• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.563-568
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• 2012

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

• The Journal of the Korean dental association
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• v.41 no.1 s.404
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• pp.35-41
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• 2003

Wettability of addition silicone impression material is very important property for making an accurate restoration. This study examined theimpression quality in clinical condition and the wettability of impression material. Three commercially available addition silicone impression material (Imprint; 3M, USA, Examix; GC, Japan, Perfect; Handae, Korea) were studied. A total of 90 putty/wash impressions of semi-dried premolars and wet molar teeth were examined for void production in impression body. The percentae of the sulcus reproduction ability of each material was calculated from the sulcus depths of cross-sectioned casts from the impressions with stereomicroscope. Three impression materials were used to produce die stone casts from vcid entrapment die. Voids in the stone casts were counted with the stereomicroscpe. From the experiment, the following results were obtained: 1. In direct observation, Imprint showed greatest numbers of void in impression body (P<.001).However, correlations were not found between sulcus reproduction and void production. 2. Sulcus reproduction ability of additional silicone impression material was diminished in order of Imprint, Examix, Perfect. The significant difference was found between Imprint and other material (P<.001). 3. In void entrapment laboratory test, void productions was diminished in order of Examix, Imprint, Perfect. All voids in casts were less in delayed poured cast than immediately poured cast. 4. Especially, the stone pouring time of Perfect impression material should be delayed.

• Journal of Korean Ophthalmic Optics Society
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• v.10 no.2
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• pp.119-126
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• 2005

The purpose of this study was analyzed to compare on the physical characters of two companies of color contact lenses. Artificial tear solution was used for measuring the rate of protein deposits and wettability. The surface roughness of lenses was measured by SEM(scanning electron microscope, Japan) and AFM(atomic force microscope, MultimodeTM, USA). As a results, The color contact lenses was not different from general soft contact lenses in a respect of other properties. However, the colored contact lenses showed a severe crack on the surface under SEM observation. There was no irregularity on the surface of the colored contact lenses in AFM photograph. The dyes were deposited in inside of lenses by microscope observation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Korean Journal of Materials Research
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• v.26 no.7
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• pp.376-381
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• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1027-1033
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• 2007

In this research, the polishing pad for W CMP has been analyzed to understand stabilization of polishing performance. For stabilization of process, the polishing pad condition is one of important factors. The polishing pad plays a key role in polishing process, because it contact with reacted surface of wafer[1]. The physical property of pad surface is ruled by conditioning tool which makes roughness and profile of pad surface. Pad surface affects on polishing performance such as RR(Removal Rate) and uniformity in CMP. The stabilized pad surface has stable roughness. And its surface has high level of wettability which can increase the probability of abrasive adhesion on pad. The result of this research is that the reduction of break-in and dummy polishing process were achieved by artificial machining to make stable pad surface. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied. Because, this type of pad is the most conventional type.

• Textile Coloration and Finishing
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• v.35 no.2
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• pp.121-127
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• 2023

In this study, a comprehensive investigation was conducted on the morphological and property changes of laser-induced nanocarbon (LINC) as a function of laser process parameters. LINC was formed on the surfaces of polyimide films with different backbone structures under various process conditions, including laser power, scan speed, and resolution. Three different forms of LINC electrodes (i.e., continuous 3D porous graphene, wooly nanocarbon fibers, line cut) were formed depending on the laser power and scan speed. Furthermore, heteroatom doping induced from the chemical structure of the polyimide during laser patterning was found to be effective in modifying the electrical properties of LINC electrodes. The LINC surfaces exhibited different microstructures depending on the laser beam resolution under constant laser power and scan speed, allowing for controllable surface wettability. The correlation between the chemical structure of the polymer substrate, laser process parameters, and carbonized surface properties in this study is expected to be utilized as fundamental understanding for the manufacturing of next-generation carbon-based electronic devices.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.3
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• pp.105-110
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• 2015

The fiber-reinforced endodontic posts were prepared using a photocurable resin and a glass fiber. The mechanical property of the posts increased with increasing density of glass fiber and the micro-pores in the post were removed by a vacuum impregnation process. To improve the interfacial adhesion between glass fiber and polymer, silane coupling agent was used. The surface treatment of glass fiber increased the surface wettability of resing on glass fiber and increased the adhesion property with resin, consequently improved the mechanical property of posts.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.55-62
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• 2000

The wetting balance test was performed in an attempt to estimate the wetting properties of the UBM-coated Si-wafer on one side to the Sn-Pb solder. The wetting curves of the one and both side-coated UBM layers had the similar shape and the parameters characterizing the curve shape showed the similar transition tendency to the temperature. The wetting property estimation was possible with the new wettability indices from the wetting curves of one side-coated specimen; $F_{min}$, $F_{s}t_{s}$ and $t_s$. For UBM of Si-chip, Au/Cu/Cr UBM was better than Au/Ni/Ti in the point of wetting time. The contact angle of the one side coated Si-plate to the Sn-Pb solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.18-26
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• 2015

para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.