DOI QR코드

DOI QR Code

Effect of Tin Addition on the Melting Temperatures and Mechanical Properties of Al-Si-Cu Brazing Filler Metals

저온 브레이징용 Al-Si-Cu 합금의 Sn 첨가에 따른 융점 및 기계적 특성 변화 연구

  • Kim, Min Sang (Department of Materials Science and Engineering, Hanyang University) ;
  • Park, Chun Woong (Department of Materials Science and Engineering, Hanyang University) ;
  • Byun, Jong Min (Department of Materials Science and Engineering, Hanyang University) ;
  • Kim, Young Do (Department of Materials Science and Engineering, Hanyang University)
  • Received : 2016.05.17
  • Accepted : 2016.06.16
  • Published : 2016.07.27

Abstract

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.

Keywords

References

  1. A. Sharma, Y. S. Shin and J. P. Jung, J. Weld. Joining, 33, 1 (2015).
  2. R. S. Timsit and B. J. Janeway, Weld. Res., 119s-128s (1994).
  3. W. Dai, S. Xue, J. Lou and S. Wang, Mater. Trans., 53, 1638 (2012). https://doi.org/10.2320/matertrans.M2012110
  4. I. C. Yeo and I. C. Kang, J. Korean Powder Metall. Inst., 22, 21 (2015). https://doi.org/10.4150/KPMI.2015.22.1.21
  5. G. J. Jang, K. T. Kim, S. S. Yang, Y. J. Kim and Y. H, Park, J. Korean Powder Metall. Inst., 21, 460 (2014). https://doi.org/10.4150/KPMI.2014.21.6.460
  6. Y. Sugiyama, Weld. Int., 3, 700 (1989). https://doi.org/10.1080/09507118909446642
  7. N. Hayasaka, Y. Koga, K. Shimomura, Y. Yoshida and H. Okano, Jpn. J. Appl. Phys., 30, 1571 (1991). https://doi.org/10.1143/JJAP.30.1571
  8. T. Hattori, S. Sakai, A. Sakamoto and C. Fujiwara, Weld. J., 73, 233s-240s (1994).
  9. L. C. Tsao, M. J. Chiang, W. H. Lin, M. D. Cheng and T. H. Chuang, Mater. Charact., 48, 341 (2002). https://doi.org/10.1016/S1044-5803(02)00276-0
  10. T. L. Su, S. S. Wang, L. C. Tsao, S. Y. Chang, T. H. Chuang and M. S. Yeh, J. Mater. Eng. Perform., 11, 187 (2002). https://doi.org/10.1361/105994902770344259
  11. S. Kanae, K. Minoru and T. Yo, J. Jpn. Inst. L. Metals, 43, 533 (1993). (in Japan) https://doi.org/10.2464/jilm.43.533
  12. Y. Shi, L. Shao, J. Huang and Y. Gu, Mater. Sci. Technol., 29, 1118 (2013). https://doi.org/10.1179/1743284713Y.0000000291
  13. L. C. Tsao, W. P. Weng, M. D. Cheng, C. W. Tsao and T. H. Chuang, J. Mater. Eng. Perform., 11, 360 (2002). https://doi.org/10.1361/105994902770343863
  14. L. C. Tsao, T. C. Tsai, C. S. Wu and T. H. Chuang, J. Mater. Eng. Perform., 10, 705 (2001). https://doi.org/10.1361/105994901770344584
  15. T. H. Chuang, M. S. Yeh, L. C. Tsao, T. C. Tsai and C. S. Wu, Metall. Mater. Trans. A, 31A, 2239 (2000).
  16. H. R.,Kotadia, E. Doernberg, J. B. Pater, Z. Fan and R. Schmid-fetzer, Metall. Mater. Trans. A, 40A, 2202 (2009).
  17. P. Franke and D. Neuschutz, Binary Systems (Part 5: Binary systems supplement 1), 1-4, Springer Berlin Heidelberg, Germany (2007).