• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.1034-1037
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• 2002

Wet wire drawing process is used to produce fine wire in the industrial field. The production of fine eire by using wet wire drawing process with appropriate dies pass schedule would be impossible without understanding of relationship between process parameters such as material properties, dies reduction, friction conditions, drawing speed etc. However, up to new, dies pass schedule of wet wire drawing process has performed by trial and error of expert. Therefore, this study investigates the relationship between process parameters quantitatively and analyzes a conventional wet wire drawing process. Using the results, the conventional pass schedule can be redesigned to reduce the wire breakage during wet wire drawing. To verily the result of this study, the wet wire drawing experiment was performed. And the results between conventional process and redesigned pass schedule were compared. As the comparison of results, the wire breakage was considerably reduced in the redesigned pass schedule more than conventional pass schedule.

• Transactions of Materials Processing
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• v.14 no.8 s.80
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• pp.689-695
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• 2005

Multi-pass wet wire drawing process is used to produce fine wire in the industrial field. The production of fine wire through multi-pass wet wire drawing process with appropriate dies pass schedule would be impossible without understanding the relationship among many process parameters such as material properties, dies reduction, friction conditions, drawing speed etc However, in the industrial field, dies pass schedule of multi-pass wet wire drawing process has been executed by trial and error of experts. This study investigated the relationship among many process parameters quantitatively to obtain the important process information fur the appropriate pass schedule of multi-pass wet wire drawing process. Therefore, it is possible to predict the many important process parameters of multi-pass wet wire drawing process such as dies reduction, machine reduction, drawing force, backtension force, slip rate, slip velocity rate, power etc. The validity of the analyzed drawing force was verified by FE simulation and multi-pass wet wire drawing experiment. Also, pass redesign was performed based on the analyzed results, and the wire breakage between the original pass schedule and the redesigned pass schedule was compared through experiment.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.11a
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• pp.71-77
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• 2002

The Production of fine wire through wet wire drawing process with appropriate pass schedule would be impossible without understanding of relationship among many process parameters. Therefore, this paper investigates the relationship among process parameters of wet wire drawing process. In this study, it is possible to obtain the important basic data that can be used in the pass schedule of multi-pass wet wire drawing process. In order to verify the effectiveness of the analysis, pass redesign was performed based on the result of analysis to reduce the wire breakage. The wire breakage between the conventional pass schedule and the redesigned pass schedule was compared by the FE analysis and the wet win drawing experiment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.8
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• pp.715-718
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.352-354
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• 1995

The optical and electrical properties of High Speed AlGaAs infrared LED by using metal wet etch process instead of metal lift-off process are investigated. The power out increases when metal contact is patterned by wet etch process. Forward voltage and Reverse voltage for metal wet etch process represent higher value than the metal lift-off process. The aging effect of power out also indicates good results with wet etch process. The wet etch process for metal contact reveals reliable LED device properties.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.126-134
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• 2003

This paper investigates the multi-pass wet wire drawing process considering the slip between the wire and the capstan. The production of fine wire through multi-pass wet wire drawing process would be impossible without backtension. The backtension is affected by many process parameters, such as slip, dies reduction, coiling number of wire at the capstan, machine reduction, characteristic of lubricant etc. Up to date, die design and dies pass schedule of multi-pass wet wire drawing process have been performed by trial and error of expert in the industrial field. In this study, an analysis program which can perform the analysis and considering the effect of slip at each capstan was developed. The effects of many important parameters (drawing force, backtension force, needed power, slip rate, slip velocity rate etc.) on multi-pass wet wire drawing process can be predicted by this developed program. It is possible to obtain the important basic data which can be used in the pass schedule of multi-pass wet wire drawing process by using this developed program.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.216-219
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• 2001

The production of fine wire through multi-pass wet wire drawing process would be impossible with no backtension at inlet of dies. Backtension is affected by many process parameters, such as dies reduction, coiling number of wire at capstan, machine constant, slip between wire and capstan, characteristic of lubricant and so on. Up to date, dies design and dies pass schedule of multi-pass wet wire drawing process have performed by trial and error of expert in the Industrial field without consideration of quantitative relation among process variables. Thus study investigates the multi-pass wet wire drawing process considering the relation among process variables, such as dies reduction, coiling number of wire at capstan, machine constant, slip between wire and capstan, etc. And analysis program which can analyze many important process values(drawing force, backtension force, slip rate, slip velocity rate, etc) for die design and dies pass schedule of multi-pass wet wire drawing process was developed.

• Journal of Powder Materials
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• v.17 no.2
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• pp.113-122
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• 2010

Two kinds of oxide-dispersion-strengthened (ODS) 316L stainless steel were manufactured using a wet mixing process(wet) and a mechanical alloying method (MA). An MA 316L ODS was prepared by a mixing of metal powder and a mechanical alloying process. A wet 316L ODS was manufactured by a wet mixing with 316L stainless steel powder. A solution of yttrium nitrate was dried after being in the wet 316L ODS alloy. The results showed that carbon and oxygen were effectively reduced during the degassing process before the hydroisostatic process (HIP) in both alloys. It appeared that the effect of HIP treatment on increase in impact energy was pronounced in the MA 316L ODS alloy. The MA 316L ODS alloy showed a higher yield strength and a smaller elongation, when compared to the wet 316L ODS alloy. This seemed to be attributed to the enhancement of bonding between oxide and matrix particles from HIP and to the presence of a finer oxide of about 20 nm from the MA process in the MA 316L ODS alloy.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.77-81
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• 2020

Silicon wafer etching in micro electro mechanical systems (MEMS) fabrication is challenging to form 3-D structures. Well known Si-wet etch of silicon employs potassium hydroxide (KOH), tetramethylammonium hydroxide (TMAH) and sodium hydroxide (NaOH). However, the existing silicon wet etching process has a fatal disadvantage that etching of the back side of the wafer is hard to avoid. In this study, a wet etching bath for 150 mm wafers was designed to prevent back-side etching of silicon wafer, and we demonstrated the optimized process recipe to have anisotropic wet etching of silicon wafer without any damage on the backside. We also presented the design of wet bath for 300 mm wafer processing as a promising process development.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.427-430
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• 2005

Improving the productivity of steel cord is required due to the increase in demand for it, even though steel cord being used as a reinforcement of a tire has been produced at multi-pass wet wire drawing process over 1000m/min. To improve the productivity, if just increase drawing speed, it causes temperature rise, fracture arisen by embrittlement during drawing process. To increase drawing speed affecting productivity, the variation of wire temperature during multi-pass wet wire drawing process is investigated in this study. In result, the multi-pass wet wire drawing process is redesigned. The redesigned wet drawing process with 27 passes efficiently controls wire temperature during drawing process. It, therefore, enables drawing process to be possible at ultra high speed with 2000m/min. It becomes possible to improve the productivity of steel cord in this paper because the increase in drawing speed could be achieved.