• Korean Journal of Materials Research
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• v.14 no.12
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• pp.870-875
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• 2004

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was $45.1^{\circ}C$ in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was $2.51^{\circ}C/W$ in the air vent hole typed Wave Heat Sink, and it changed to $2.65^{\circ}C/W\;and\;2.16^{\circ}C/W$ with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

• Korean Journal of Materials Research
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• v.14 no.7
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• pp.522-528
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• 2004

Heat analysis of the plate type and wave type heat sink were carried out by using computational simulation. The heat resistance and air flow of two heat sink models were analysed according to natural and forced convection condition and positions of fan. When a fan was at the position of z-axis and y-axis in forced convection, the heat resistances of plate type heat sink were $0.17^{\circ}C/W$, and $0.28^{\circ}C/W$ respectively. In the case of wave type heat sink, they were $0.18^{\circ}C/W$ and $0.53^{\circ}C/W$. As the air flow velocities were averagely $0.386\;m/s\~3.269\;m/s$, air flow velocity of plate type heat sink was faster than that of wave type. In this experiment, it was observed that the plate type heat sink showed a good ability of heat radiation comparing with wave type one.

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.829-832
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• 2005

Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was $0.17^{\circ}C/W$(forced convection) and $0.48^{\circ}C/W$(natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1724-1728
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• 2014

Heat sink has been used to help an electrical device operate in normal temperature condition. But heat sink radiates unwanted electromagnetic wave, which may cause electromagnetic interference problem. A resistance loaded grounding technique is proposed to reduce electromagnetic wave radiation by a heat sink. Numerical simulations are accomplished to find optimal loading resistance. Also electromagnetic fields radiated by from a heat sink are measured and compared with the simulation results. The test results verify the usefulness of the proposed technique.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.1-6
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• 2009

We fabricated Gunn diodes with a double heat sink which has anode heat sink as well as cathode heat sink for efficient heat dissipation. We compared the DC characteristics of a double heat sink diode with a conventional cathode heat sink Gunn diode. It was shown that the Gunn diode with a single heat sink has the threshold voltage of 3 V, the peak current of 744 mA and the breakdown voltage of 4.8 V. Also, the Gunn diode with a double heat sink showed the threshold voltage of 2.5 V, the peak current of 778 mA and the breakdown voltage over 5 V.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.775-779
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• 2004

For improvement of heat dissipation performance, heat analysis is conducted on the newly designed heat sinks under two convection conditions by using computational fluid dynamics(CFD). Three types of heat sink, plate, wave and top vented wave, are used, and convection conditions are the variations of gravity direction at natural convection and of fan location at forced convection. The results of analysis showed that the heat resistances of top vented wave heat sink were $0.17^{\circ}C$/W(forced convection) and $0.48^{\circ}C$/W(natural convection). In the case of natural convection, gravity direction affected heat flow change, and protection against heat performance was superior in case of z-axis gravity direction. Under the forced convection, all the heat sinks revealed superior thermal characteristics in the fan position of z-axis rather than y-axis. In this study, it was observed that the top vented wave type heat sink showed the best ability of heat radiation comparing with the others.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• 전자공학회논문지 IE
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• v.48 no.2
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• pp.12-18
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• 2011

In this paper, did numerical simulation to confirm LED module for lighting and protection against heat special quality of heat sink device. Analysis was gone dividing on case that emitting light side turns normalcy department considering that eat of device according to usage and case that turn down looking being street lamp of 200 W or security appointment lighting device analysis case, and also, volume of thermal element divides on big case and small case and analyzed. Confirmed that can do so that may discharge LED's thermal value to outside enough in analysis wave and current heat sink shape, and investigated that difference of protection against heat performance according to position of device and size of thermal element appears.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2286-2291
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• 2008

Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.4
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• pp.572-582
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• 2001

A method of metal-hydride thermal conversion that is an alternative to the traditional method is proposed and investigated. The unit heat pump consists of reactors of two different metal-hydrides are distributed inside parallel channels filled with porous media. The channels are blown through with a heat-transfer agent. Thermal conversion develops as a set of successive heat waves. By a numerical-modeling method it is shown that the maximum thermal effect is attained in synchronous motion of the heat wave and the heat source (or sink) that accompanies the phase transition in the succession of unit metal-hydride pumps. The results are presented in a form convenient for prediction of the thermal and energy efficiency of the proposed thermal-conversion method in real devices.