• Korean Journal of Artificial Intelligence
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• v.3 no.1
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• pp.1-4
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• 2015

These days, men live better lives owing to economic growth. They are interested in basic desire such as clothing, food and dwelling. This study investigated food and/or eating. Men like to take better quality food to be healthy. They can hear food problems easily by news to satisfy desire. On October 13, 2014, Dongsuh Food Company was prohibited to distribute a serial product named 'Post Almond Flake' (Statistics Korea). Dongsuh Food was found to produce finished product by mixing contaminants without inspection of colon bacillus, and Crown Confectionery was found to produce 'Organic farming wafer' and 'Organic farming choco wafer' from March 2009 to early August, 2016 cognizing rejection at inspection not to inform Ministry of Health and to sell product amounting to 3.1 billion KRW .

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.7-8
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• 2006

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.5
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• pp.505-512
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• 2012

In this study, an inspection system based on an optical scanning mechanism is developed for the inspection of silicon wafers in solar cells. In particular, a structured hybrid illumination system that can satisfy the illumination requirement for the detection of various defects is designed. In the hybrid illumination system, the optimum illumination conditions are selected by considering the design of experiment in master glass and silicon wafer. The illumination conditions available are B-high, BG-high, BR-high, and BGR-high for master glass and R-middle-B-medium for silicon wafers. By using the illumination conditions for silicon wafers, numerous surface defects like pinhole, scratch, and chipping, can be accurately detected. The hybrid illumination system is expected to be widely used for the inspection of silicon wafers in solar cells.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.86-87
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• 2007

The dispersive method of white-light interferometry is proper for in-line 3-D inspection of dielectric thin-film thickness to be used in the semiconductor and flat-panel display industry. This research is the measurement application of CMP patterned wafer. The results describe 3-D and 2-D profile of the step height during polishing time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1545-1546
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1523-1524
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• 2013

• Proceedings of the KAIS Fall Conference
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• 2010.05a
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• pp.108-112
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• 2010

Confocal Imaging System is an essential machine for a wide range of inspection wafer. For concurrent and fast acquiring the image data of four channels, the new image acquisition system used the protocol of camera-link standard with the full mode of configuration in interconnection with a frame grabber integrated in a computer, which is popularly used for many cameras, so the programming environment of image processing is optional such as Visual C++, Matlab. In addition, many conventional methods were coordinately used for contribution to build the high quality of images for precise processing analog signals of PhotoMutiplier Tubes(PMTs), accurate control of scanning device, sensitivity of PMTs, and laser source. The prototype of new image acquisition system, could meet the goal of development, it is used in LSCM for high content screening to investigation the processes of elements of living specimens at the same time by simultaneous grab image data on 4 PMTs channels.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.22-28
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• 2017

The result of stripping process for the removal of the post etch/ash Photoresist (PR) residue on an aluminum patterned wafer by using supercritical $CO_2$ ($sc-CO_2$) mixture, was investigated by scanning of electron microscope (SEM) inspection of wafer, measuring the cloud points and visual observation of the state of $sc-CO_2$ mixtures. It was found that $sc-CO_2$ mixtures were made by mixing additives and $sc-CO_2$ should form homogeneous and transparent phase (HTP) in order to effectively and uniformly remove the post etch/ash PR residue on the aluminum patterned wafer using them. The additives were formulated by mixing and co-solvents like an amine compound and fluorosurfactants used as HTP agents, and the PR residue on the wafer were able to be rapidly and effectively removed using the $sc-CO_2$ mixture of HTP. The five kinds of additives were formulated by the recipe of mixing co-solvents and surfactants, which were able to remove PR residue on the wafer by mixing with $sc-CO_2$ at the stripping temperature range from 40 to $80^{\circ}C$. The five kinds of $sc-CO_2$ mixtures which were named as PR removers were made, which were able to form HTP within the above described stripping temperature. The cloud points of $sc-CO_2$ mixtures were measured to find correlation between them and HTP.