• Title/Summary/Keyword: w

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ON w-COPURE FLAT MODULES AND DIMENSION

  • Bouba, El Mehdi;Kim, Hwankoo;Tamekkante, Mohammed
    • Bulletin of the Korean Mathematical Society
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    • v.57 no.3
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    • pp.763-780
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    • 2020
  • Let R be a commutative ring. An R-module M is said to be w-flat if Tor R1 (M, N) is GV -torsion for any R-module N. It is known that every flat module is w-flat, but the converse is not true in general. The w-flat dimension of a module is defined in terms of w-flat resolutions. In this paper, we study the w-flat dimension of an injective w-module. To do so, we introduce and study the so-called w-copure (resp., strongly w-copure) flat modules and the w-copure flat dimensions for modules and rings. The relations between the introduced dimensions and other (classical) homological dimensions are discussed. We also study change of rings theorems for the w-copure flat dimension in various contexts. Finally some illustrative examples regarding the introduced concepts are given.

THE REPRESENTATION AND PERTURBATION OF THE W-WEIGHTED DRAZIN INVERSE

  • Xu, Zhaoliang;Wang, Guorong
    • Journal of applied mathematics & informatics
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    • v.23 no.1_2
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    • pp.113-126
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    • 2007
  • Let A and E be $m{\times}n$ matrices and W an $n{\times}m$ matrix, and let $A_{d,w}$ denote the W-weighted Drazin inverse of A. In this paper, a new representation of the W-weighted Drazin inverse of A is given. Some new properties for the W-weighted Drazin inverse $A_{d,w}\;and\;B_{d,w}$ are investigated, where B=A+E. In addition, the Banach-type perturbation theorem for the W-weighted Drazin inverse of A and B are established, and the perturbation bounds for ${\parallel}B_{d,w}{\parallel}\;and\;{\parallel}B_{d,w}-A_{d,w}{\parallel}/{\parallel}A_{d,w}{\parallel}$ are also presented. When A and B are square matrices and W is identity matrix, some known results in the literature related to the Drazin inverse and the group inverse are directly reduced by the results in this paper as special cases.

A Study on Software Product-Line Architecture Design Process (소프트웨어 제품계열 아키텍처 설계 프로세스)

  • Oh, Young-Bae
    • Journal of Information Technology Services
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    • v.4 no.2
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    • pp.47-59
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    • 2005
  • S/W product line is a S/W product or a set of S/W system, which has common functions. We can develop a specific S/W product, which satisfiesrequirements of a particular market segment and a mission in a specific domain by reusing the core asset such as the developed S/W architecture through the S/W product line. S/W development methodology based on the S/W product line can develop a S/W more easily and fast by reusing the developed S/W core asset. An advanced country of S/W technology selects S/W product line as a core field of S/W production technology, and support technology development. In case of USA, CMU/SEI (Carnegie Mellon University / Software Engineering Institute) developed product-line framework 4.0 together with the industry and the Ministry of National Defense. Europe is supporting the development of product line technology through ITEA(IT for European Advancement) program. In this paper, we aim to construct reference architecture of S/W product line for production of the S/W product line.

A Study on CdTe Thin Film by RF Power Change (RF Power변화에 의한 CdTe 박막에 관한 연구)

  • Jung-Cheul Park
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.16 no.4
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    • pp.187-192
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    • 2023
  • This paper deposited CdTe thin films on ITO glass substrates using sputtering equipment while changing RF power. As a result of measuring the thickness of the thin film, 1481Å at 100W, 2985Å at 150W, and 4684Å at 200W. And the mobility was measured as 8.43 cm2/Vs for 100W, 7.91 cm2/Vs for 150W, and 6.57 cm2/Vs for 200W. It can be seen that the thickness and mobility of the thin film are inversely proportional. As a result of confirming the transmittance, the transmittance was 84% at 905nm for 100W, the transmittance was 71% at 825nm for 150W, and 77% at 874nm for 200W. At 100 W, the thickness of the thin film was thin, so the transmittance was measured to be high. In other words, the correlation between transmittance and thickness can be seen. As a result of measuring the FHWM and particle size by changing the RF Power, 100W was calculated as 0.18, 150W was calculated as 0.19, and 200W was calculated as 0.73. The size of the particles was formed at 8.47Å at 100W, 7.98Å at 150W, and 8.7Å, which is the largest at 200W. In conclusion, it was found that the FHWM and particle size were inversely proportional.

Changes in Perceived Intensities of Pungency of Ramen Soup (라면에서 나타나는 매운 감각 인지 강도의 변화)

  • Imm, Bue-Young;Shon, Sang-Soo;Kim, Kyung-Nam
    • Korean Journal of Food Science and Technology
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    • v.35 no.4
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    • pp.623-627
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    • 2003
  • The intensity of pungency of capsicum solutions (30 Scoville Unit and 50 Scoville Unit) was decreased when a pork extract paste was mixed with the capsicum solutions. Three types of flavor enhancers, 0.5% (w/w) monosodium glutamate, 0.5% (w/w) IG (IMP : GMP = 0.5 : 0.5) and 0.5% (w/w) $Aromild^{\circledR}$ (yeast extract) decreased pungency of hot ramen soup including chilli pepper. 10% (w/w) sucrose decreased pungency of 0.66 ppm capsicum, and 0.66 ppm capsicum decreased sweetness of 10% (w/w) sucrose. Pungency of hot ramen soup was also affected by types of noodles which is boiled in the soup. The intensity of pungency of the ramen soup with fried noodles was lower than the soup with dried or fresh noodles.

Fabrication of diamond/W-Cu functionally graded material by microwave sintering

  • Wei, Chenlong;Cheng, Jigui;Zhang, Mei;Zhou, Rui;Wei, Bangzheng;Yu, Xinxi;Luo, Laima;Chen, Pengqi
    • Nuclear Engineering and Technology
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    • v.54 no.3
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    • pp.975-983
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    • 2022
  • A four-layered W/Cu functionally graded material (FGM) (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W60% + Cu40%, wt.% fraction) and a four-layered diamond/W-Cu FGM (W90% + Cu10%/W80% + Cu20%/W70% + Cu30%/W55% + Cu40% + diamond5%, wt.% fraction) were fabricated by microwave sintering. The thermal conductivity and thermal shock resistance of diamond/W-Cu FGM and W-Cu FGM were investigated. The morphologies of the diamond particles and different FGMs were analyzed using AFM, SEM, EDS, and TEM. The results show that a 200 nm rough tungsten coating was formed on the surface of the diamond. The density of the tungsten-coated diamond/W-Cu FGM, obtained by microwave sintering at 1200 ℃ for 30 min, was 94.66%. The thermal conductivity of the fourlayered diamond/W-Cu FGM was 220 W·m-1·K-1, which is higher than that of the four-layered W/Cu FGM (209 W m-1 K-1). This indicates that adding an appropriate amount of tungsten-coated diamond to the high Cu layer W/Cu FGM improves the thermal conductivity of the composite. The diamond/W-Cu FGM sintered at 1200 ℃ for 10 min exhibited better thermal shock resistance than diamond/W-Cu FGM sintered at 1100 ℃ for 10 min.

A Study on Preparation of Water in Oil in Water (W1/O/W2) Emulsion Containing Titrated Extract of Centella asiatica (센텔라 아시아티카 정량추출물을 함유한 Water in Oil in Water (W1/O/W2) 에멀젼 제조에 관한 연구)

  • Seo, Dong Hoan;Lee, Hong Seon;Yoon, Jong Hyuk;Kim, Youn Joon;Byun, Sang Yo
    • Journal of the Society of Cosmetic Scientists of Korea
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    • v.41 no.4
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    • pp.303-313
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    • 2015
  • Titrated extract of Centella asiatica (TECA), which is poorly soluble in water is well known for wound healing and anti wrinkle agent. This study was conducted to find the optimum condition for the preparation of water in oil in water ($W_1/O/W_2$) emulsion containing TECA. Solubility of TECA were measured by UV spectrophotometer. 2.55 g of TECA was dissolved in solution composed of dipropylene glycol (40.0 g), ethanol (20.0 g), and water (10.0 g). Factors affecting stability of the emulsions ($W_1/O$, $W_1/O/W_2$) was investigated. The optimum conditions for the preparation of $W_1/O$ emulsion was composed of dipropylene glycol : ethanol : water : TECA in a weight ratio of 40.0 : 20.0 : 10.0 : 2.5 for water phase and squalane : cetyl PEG/PPG-10/1 dimethicone : cetearyl alcohol in a weight ratio of 22.5 : 4.0 : 2.5 for oil phase. The optimum conditions for the preparation of $W_1/O/W_2$ multiple emulsion was composed of water : $W_1/O$ emulsion : polysorbate 80 : carbomer : triethanolamine in a weight ratio of 55.8 : 40.0 : 4.0 : 0.1 : 0.1.

A Study on Influence of Smartphones Business Factors on Customer Satisfaction and Customer Loyalty (스마트폰 비즈니스의 구성요인이 고객만족과 고객충성도에 미치는 영향)

  • Lee, Joong-Bae;Baek, Dong-Hyun
    • The Journal of Society for e-Business Studies
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    • v.22 no.2
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    • pp.19-38
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    • 2017
  • The core of the smartphone business environment is changing from H/W to S/W and with it the paradigm of an enterprise's base of competition is changing from H/W to service. In accordance with this paradigm, in this study we have determined H/W, S/W and telecommunication service as smartphone business factors. The purpose of this study is to first analyze the influence business factors has on consumer satisfaction and customer loyalty. Secondly, to analyze the influence switching cost has on customer loyalty. As a result, the factor that has a notable influence on customer satisfaction turned out to be the H/W factor. On the other hand S/W factor and communication service turned out to have very little influence. In addition, the factors influencing customer loyalty turned out to be H/W factor and S/W factor. Telecommunication service did not have much of an influence. Customer satisfaction turned out to act as mediation effect between H/W factor and customer loyalty. Like the result of other preceding researches, switching cost turned out to have a significant influence on customer loyalty. This study differs from other studies in that while other existing studies analyzed H/W, S/W and communication service separately, this study analyzed the influence H/W, S/W and communication service as a whole has on customer satisfaction and customer loyalty. We speculate that the results of this study would provide some insight both in an academic and practical level for stagnant smartphone industry.

ON 𝜙-w-FLAT MODULES AND THEIR HOMOLOGICAL DIMENSIONS

  • Zhang, Xiaolei;Zhao, Wei
    • Bulletin of the Korean Mathematical Society
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    • v.58 no.4
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    • pp.1039-1052
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    • 2021
  • In this paper, we introduce and study the class of 𝜙-w-flat modules which are generalizations of both 𝜙-flat modules and w-flat modules. The 𝜙-w-weak global dimension 𝜙-w-w.gl.dim(R) of a commutative ring R is also introduced and studied. We show that, for a 𝜙-ring R, 𝜙-w-w.gl.dim(R) = 0 if and only if w-dim(R) = 0 if and only if R is a 𝜙-von Neumann ring. It is also proved that, for a strongly 𝜙-ring R, 𝜙-w-w.gl.dim(R) ≤ 1 if and only if each nonnil ideal of R is 𝜙-w-flat, if and only if R is a 𝜙-PvMR, if and only if R is a PvMR.

THE CLASS OF WEAK w-PROJECTIVE MODULES IS A PRECOVER

  • Kim, Hwankoo;Qiao, Lei;Wang, Fanggui
    • Bulletin of the Korean Mathematical Society
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    • v.59 no.1
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    • pp.141-154
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    • 2022
  • Let R be a commutative ring with identity. Denote by w𝒫w the class of weak w-projective R-modules and by w𝒫w the right orthogonal complement of w𝒫w. It is shown that (w𝒫w, w𝒫w) is a hereditary and complete cotorsion theory, and so every R-module has a special weak w-projective precover. We also give some necessary and sufficient conditions for weak w-projective modules to be w-projective. Finally it is shown that when we discuss the existence of a weak w-projective cover of a module, it is enough to consider the w-envelope of the module.