• 한국정밀공학회지
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• 제15권1호
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• Journal of Mechanical Science and Technology
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• 제20권3호
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• pp.409-417
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• 2006

Polymer nanofibers can be generated by a electrospinning process. The process involves electrically charged jet of polymer solutions evolving from a droplet. The jet stretches in vertical direction due to the difference between charged particle and constant current located at the collector, while the Coulomb and viscoelastic forces start to contribute to radial and azimuthal (torsional) stretching. In this paper, the unstable dynamics of the liquid polymer jet is examined experimentally and theoretically. A complex viscoelastic rheological model has been adopted to analyze the behavior of a charged liquid jet. The model includes complex phenomena of stress relaxation of the liquid jet resulting from the competing force components. The experimental data of the jet paths captured by high-speed videocamera also confirm the similar behavior with the predictions.

• Journal of Pharmaceutical Investigation
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• 제29권4호
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• pp.295-307
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• 1999

Using a Rheometries Fluids Spectrometer (RFS II), the dynamic viscoelastic properties of aqueous poly(ethylene oxide) (PEO) solutions in small amplitude oscillatory shear flow fields have been measured over a wide range of angular frequencies. The angular frequency dependence of the storage and loss moduli at various molecular weights and concentrations was reported in detail, and the result was interpreted using the concept of a Deborah number De. In addition, the experimentally determined critical angular frequency at which the storage and loss moduli become equivalent was compared with the calculated characteristic time (or its inverse value), and their physical significance in analyzing the dynamic viscoelastic behavior was discussed. Finally, the relationship between steady shear flow and dynamic viscoelstic properties was examined by evaluating the applicability of some proposed models that describe the correlations between steady flow viscosity and dynamic viscosity, dynamic fluidity, and complex viscosity. Main results obtained from this study can be summarized as follows: (1) At lower angular frequencies where De<1, the loss modulus is larger than the storage modulus. However, such a relation between the two moduli is reversed at higher angular frequencies where De>l, indicating that the elastic behavior becomes dominant to the viscous behavior at frequency range higher than a critical angular frequency. (2) A critical angular frequency is decreased as an increase in concentration and/or molecular weight. Both the viscous and elastic properties show a stronger dependence on the molecular weight than on the concentration. (3) A characteristic time is increased with increasing concentration and/or molecular weight. The power-law relationship holds between the inverse value of a characteristic time and a critical angular frequency. (4) Among the previously proposed models, the Cox-Merz rule implying the equivalence between the steady flow viscosity and the magnitude of the complex viscosity has the best validity. The Osaki relation can be regarded to some extent as a suitable model. However, the DeWitt, Pao and HusebyBlyler models are not applicable to describe the correlations between steady shear flow and dynamic viscoelastic properties.

• 한국유변학회:학술대회논문집
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• 한국유변학회 2000년도 추계 학술발표회 논문집
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• pp.3-6
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• 2000

• 한국유변학회:학술대회논문집
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• 한국유변학회 2001년도 춘계 학술발표회 논문집
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• pp.25-28
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• 2001

• 한국자동차공학회논문집
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• 제22권6호
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• pp.104-112
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• 2014

Generally, numerical approaches of evaluation for vehicle seat comfort have been studied without considering time-dependent characteristics and the only seating moment have been considered in seat design. However, the comfort not only at the seating moment but also in the long-term should be evaluated because the passengers are sitting repeatedly on the seat to drive the vehicle for hours. So, the aim of this paper is to carry out a quantitative evaluation of the time-dependent mechanical characteristics of seat foams and to suggest a process for predicting the viscoelastic deformation of seat foam in response to long-term driving. To characterize the seat materials, uniaxial compression and tension tests were carried out for the seat foam and stress relaxation tests were performed for evaluating the viscoelastic behavior of the seat foam. A unit solid element model was used to verify the reliability of the material model with respect to the compression behavior of the seat foam. It is not straightforward to evaluate the time-dependent compression of foams using the explicit solver because the viscoelastic material model is limited. To use the explicit solver, the material model must be modified using stress-degradation data. Normalized stress relaxation moduli were added to the stress-strain curves obtained under static conditions to achieve a time-dependent set of stress-strain relations that were compatible with the implicit solver. There was good agreement between the analysis results and experimental data.

• Journal of Biosystems Engineering
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• 제15권3호
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• pp.207-218
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• 1990

Grains display characteristics of both elastic bodies and viscous fluids when they are subjected to mechanical treatments in harvesting, handling, and processing. This viscoelastic behavior of grains when mechanically stressed must be fully understood to establish maximum machine efficiency and have a minimum degree of grain damage and the highest quality of the final product. The studies were conducted to examine the effect of the moisture content, the loading rate and the initial deformation on the stress relaxation behavior of whole kernel of rough rice, and develop the rheological model to represent its stress relaxation behavior. The following results were obtained from the study. 1. Moisture content had the greatest influence on the initial portion of the relaxation curve. With elapsing time the lower moisture content resulted in the lower residual stress for the Japonica-type rough rice and vice versa for the Indica-type rough rice. But within the ranges of moisture content tested, the degree of stress relaxation per unit strain on the Indica-type rough rice was a little higher than those on the Japonica-type rough rice. 2. The slower loading rate resulted in less initial stress. The decreasing trend of residual stress for all the samples tested with increasing loading rate was shown. 3. The higher initial deformation for all the samples resulted in less initial stress. The increasing of amount of stress relaxation per unit strain with increase of initial stress indicated that viscoelastic properties of rough rice depended not only upon duration of load applied but also initial stress applied. This means that rough rice is nonlinear viscoelastic material. 4. The compression stress relaxation properties of rough rice kernel can be described by a generalized Maxwell model representing by the Maxwell elements.

• Korea-Australia Rheology Journal
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• 제14권3호
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• pp.129-138
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• 2002

A cationic surfactant, cetyltrimethylammonium $\rho$-toluenesufonate (CTA$\rho$TS), forms long threadlike micelles in aqueous solution. The threadlike micelles make concentrated entanglement networks, so that the solution shows pronounced viscoelastic behavior as concentrated polymer systems do. However, a mechanism for a process responsible for the longest relaxation time of the threadlike micellar system is different from that of semi-dilute to concentrated polymer systems. The threadlike micellar system exhibits unique viscoelasticity described by a Maxwell model. The longest relaxation time of the threadlike micellar system is not a function of the concentration of CTA$\rho$TS, but changes with that of $\rho$-toluenesufonate ($\rho$$TS^{-}$) ions in the bulk aqueous phase supplied by adding sodium $\rho$-toluenesulfonate (NapTS). The rates of molecular motions in the threadlike micelles are not influenced by the concentration of $\rho$$TS^{-}$ anions, therefore, molecular motions in the threadlike micelles (micro-dynamics) are independent of the longest relaxation mechanism (macro-dynamics). A nonionic surfactant, oleyldimethylamineoxide (ODAO), forms long threadlike micelles in aqueous solution without any additives. The aqueous threadlike micellar system of ODAO also shows Maxwell type viscoelastic behavior. However, the relaxation mechanism for the longest relaxation process in the system should be different from that in the threadlike micellar systems of CTA$\rho$TS, since the system of ODAO does not contain additive anions. Because increase in the average degree of protonation of head groups of ODAO molecules in micelles due to adding hydrogen bromide causes the relaxation time remarkably longer, changes in micro-structure and micro-dynamics in the threadlike micelle are closely related to macro-dynamics in contrast with the threadlike micellar system of CTA$\rho$TS.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.360-361
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• 2005

Rapid progress in IC fabrication technology has strong demand in polishing of silicon wafer to meet the tight specification of nanotopography and surface roughness. One of the important issues in Si CMP is the stabilization of polishing pad. If a polishing pad is not stabilized before main Si wafer polishing process, good polishing result can not be expected. Therefore, new pad must be subjected into break-in process using dummy wafers for a certain period of time to enhance its performance. After the break-in process, the main Si wafer polishing process must be performed. In this study, the characteristics of break-in process were investigated in Si wafer polishing. Viscoelastic behavior, temperature variation of pad and friction were measured to evaluate the break-in phenomenon. Also, it is found that the characteristic of the break-in seems to be related to viscoelastic behavior of pad.

• 대한기계학회논문집B
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• 제36권4호
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• pp.431-438
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• 2012

고밀도 폴리에틸렌(HDPE)과 같은 고분자재료의 기계적 거동은 시간과 온도에 의존적이다. 따라서 근위경골절골술(HTO)용 X-밴드 플레이트에 적용되는 HDPE의 각기 다른 변형률속도에 따른 인장거동에 대한 연구는 매우 중요하다. 일반적으로 엔지니어링 응력-변형률곡선에 기반을 둔 폴리메트릭 물질의 변형거동은 입자넥킹의 소성변형을 동반한 높은 비균질성을 나타내므로 매우 복잡한 거동을 나타낸다. 본 연구에서는 1~500%/min의 9가지 변형률속도를 적용하여 그에 따른 점탄성 거동을 평가하였다. 그 결과, 저속 변형률속도에서는 최대인장응력이 증가하고 변형률은 감소하였으나 고속 변형률속도에서는 점탄성거동이 급변하는 교차점(Ts)이 발생하였다. 또한 전이점($P_{st}$)에 의해 구해진 전이응력(${\sigma}_{ts}$)은 고속 변형률속도에서 최대인장응력(${\sigma}_{ult}$)보다 저하됨을 관찰할 수 있었고, 초기 모듈러스와 전이점에서의 시컨트 모듈러스의 비인 ${\beta}$를 이용하여 저속과 고속 변형률속도에서의 점탄성 거동을 평가한 결과 고속 변형률속도에서 급격한 ${\beta}$의 증가를 관찰할 수 있었다.