• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1998년도 가을 학술발표논문집(II)
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• pp.330-335
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• 1998

This research was conducted to evaluate the adhesion in tension of the polymer mortars for cement concrete repair. Various polymer types, binder ratios, and wet/dry conditions of the surface were considered in this study. Styrene-butadiene rubber (SBR) and ethylen vinyl acetate (EVA) used for polymer cement mortars. Epoxy resin (EP), and unsaturated polyester resin (UP) were used for polymer mertars. Adhesion in tension for the dry condition of the substrate surface was higher than that for the wet condition of the substrate surface under the same binder ratio. Therefore, in repairing concrete, the dry surface condition was effective on adhesion.

• Applied Microscopy
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• 제6권1호
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• pp.33-38
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• 1976

Formation of crystal defects which may occur during and after the vacuum deposition of silver films on rocksalt substrates were studied by electron microscopy. To obtain defect free films, various evaporation conditions, such as evaporation rate, substrate temperature, substrate treatments and annealing of films were examined. Stacking faults and micro-twins are dominant defects in silver films.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 가을 학술발표회 논문집
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• pp.1225-1228
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• 2001

The purpose of this study is to develop for finishing method of concrete structures applying metal spraying system. In the experiments, the pull out tests were conducted using the specimen which was applied by various surface treatment of concrete substrate. As a result, it was confirmed that the adhesion strength of metal spray was effected by surface condition of concrete and the construction of primer or the coarse surface agent to the concrete substrate is very effective to the new finishing method of concrete for the metal spraying system.

• KIEE International Transactions on Electrophysics and Applications
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• 제3C권2호
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• pp.55-58
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• 2003

This paper examines the electrical characteristic of single oxide layer due to various diffusion conditions, substrate orientations, substrate resistivity and gas atmosphere in a diffusion furnace. The oxide quality was examined through the capacitance-voltage characteristic due to the annealing time after oxidation process, and the capacitance-voltage characteristics of the single oxide layer by will be described via semiconductor device simulation.

• 전자공학회논문지A
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• 제33A권5호
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• pp.65-74
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• 1996

in this paper, the propagation characteristics of the dominant modes in multiple coupled microstrip lines on a magnetized ferrite substrate are analyzed. The propagation constants and characteristic impedances are calculated by using the spectral domain method. With the numerical results, multi-port impedance parameters as well as scattering parameters are derived from nonreciprocal transmission line equations which are consistent with conventional transmission line theory. In additon, the numerical resutls of nonreciprocal characteristics for various values of structural, material parameters, and external magnetic fields are also presented.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.277-277
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• 2010

In this report, we present a very effective growing method of graphene using plasma enhanced chemical vapor deposition(PECVD). The graphene is successfully grown on copper substrate. Low temperature growing is obtained with methane and hydrogen plasma. The graphene layers are analyzed by Raman spectroscopy and atomic force microscope. We also provide a transfer technique of graphene layer onto silicon substrate to build up various kinds of application devices.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1515-1518
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• 2009

Hydrophobic treatments were conducted for different kinds of substrates, glass substrate, silicon wafer and plastic substrate. Ar-$CH_4$ gas mixture was used as a discharge gas for the hydrophobic treatment. The change of the contact angle before and after treatment was measured and compared. Time evolution of the contact angle change after hydrophobic treatment was investigated.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 ITC-CSCC -2
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• pp.933-936
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• 2000

N-channel poly-Si TFT, processed by Solid Phase Crystalline(SPC) on a glass substrate, has been investigated by measuring its electrical properties before and after stressing. It is observed that the threshold voltage shift due to electrical stress varies with various stress conditions. Threshold voltages measured in 1.5um and 3um poly-Si TFT’s are 3.3V, 37V respectively. With the threshold voltage shift, the degradation of transconductance and subthreshold swing is also observed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.126-127
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• 2007

In this study, the fabrication technique of a plannar field emission structure with DLC were studied Electric properties of carbon film on silicon substrate in methanol solution was carried out with various current density, solution temperature and electrode spacing between anode and cathode. The DLC film deposited on the Si substrate, plannar $SiO_2$ was obtained due to the shape of bottom electrode.

• 한국재료학회지
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• 제21권1호
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• pp.56-66
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• 2011

Multi-source evaporation is one of the methods to improve the thickness uniformity of thin films deposited by evaporation. In this study, a simulator for the relative thickness profile of a thin film deposited by a multi-source evaporation system was developed. Using this simulator, the relative thickness profiles of the evaporated thin films were simulated under various conditions, such as the number and arrangements of sources and source-to-substrate distance. The optimum conditions, in which the thickness uniformity is minimized, and the corresponding efficiency, were obtained. The substrate was a 5th generation substrate (dimensions of 1300 mm ${\times}$ 1100 mm). The number of sources and source-to-substrate distance were varied from 1 to 6 and 0 to the length of the major axis of the substrate (1300 mm), respectively. When the source plane, the area on which sources can be located, is limited to the substrate dimension, the minimum thickness uniformity, obtained when the number of sources is 6, was 3.3%; the corresponding efficiency was 16.6%. When the dimension of the source plane is enlarged two times, the thickness uniformity is remarkably improved while the efficiency is decreased. The minimum thickness uniformity, obtained when the number of sources is 6, was 0.5%; the corresponding efficiency was decreased to 9.1%. The expansion of the source plane brings about not only the improvement of the thickness uniformity, but also a decrement of the efficiency and an enlargement of equipment.