• 제목/요약/키워드: ultra-low power

검색결과 356건 처리시간 0.034초

Effective Annealing and Crystallization of Si Film for Advanced TFT System

  • Noguchi, Takashi
    • Journal of Information Display
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    • 제11권1호
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    • pp.12-16
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    • 2010
  • The effect of the crystallization and activated annealing of Si films using an excimer laser and the new CW blue laser are described and compared with furnace annealing for application in advanced TFTs and for future applications. Pulsed excimer laser annealing (ELA) is currently being used extensively as a low-temperature poly-silicon (LTPS) process on glass substrates as its efficiency is high in the ultra-violet (UV) region for thin Si films with thickness of 40-60 nm. ELA enables extremely low resistivity relating to high crystallinity for both the n- and p-type Si films. On the other hand, CW blue laser diode annealing (BLDA) enables the smooth Si surface to have arbitral crystal grains from micro-grains to an anisotropic huge grain structure only by controlling its power density. Both annealing techniques are expected to be applied in the future advanced TFT systems.

유선 네트워크 기반의 근거리 무선 통신을 이용한 제어용 네트워크 (Control Network using Bluetooth with Wire Network)

  • 곽재혁;임준홍
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 B
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    • pp.476-479
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    • 2003
  • Recently, Bluetooth has been regarded as a new technology for short-range wireless connection. Although initial application of Bluetooth technology has been focused mainly on replacing cables between hand-held devices due to a limited packet size and short-range, general wireless telecommunication such as PAN and Ad hoc networks via Bluetooth-equipped devices is expected to be one of the most popular applications. Wireless equipments have been used to exchange data between host and mobile unit. The exchanging data may be several bytes of control command and the value of sensors with ultra-sonic, vision sensor, and encoder from mobile robot. However, most wireless equipments have some drawbacks such as lack of authentication, large size and high price. On the other hand, the benefits of Bluetooth are small size, low power, low price except short-range. Especially, there are some difficulties when wireless modules are used in indoor environments. In this paper, a method of using wire network in Bluetooth network is investigated as a solution to overcome the short-range problem of Bluetooth and difficulty in indoor environment.

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극저온에서 LED 응용에 관한 연구 (A Study on the Application of LED at Ultra-low Temperature)

  • 하희주;김진욱;김선재;길경석
    • 한국전기전자재료학회논문지
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    • 제27권9호
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    • pp.600-605
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    • 2014
  • The interest in development on luminaires which are available up to $-52^{\circ}C$ is surging as demands in vessels navigating a north pole route increase. A conventional incandescent lamp used in vessels is operated stably at $-52^{\circ}C$, but many countries including Korea have eliminated the use of incandescent lamps gradually because of its low luminous efficacy. In this paper, therefore, to develop the LED luminaires with high-efficiency, long lifetime that enables to substitute for incandescent lamp, it has studied about cryogenic characteristics of LED packages, bulbs, driving circuit and power supply. This experiments were carried out according to standards IEC 60945-8.4.1. Temperature range is from $-60^{\circ}C$ to $25^{\circ}C$, and the light output depending on ambient temperature. It showed that, based on $25^{\circ}C$, light output of a CFL decreased by 80% of CFL at $-20^{\circ}C$ while each increased 12% of LED bulbs and 16~19% of LED packages at $-60^{\circ}C$.

An investigation on dicing 28-nm node Cu/low-k wafer with a Picosecond Pulse Laser

  • Hsu, Hsiang-Chen;Chu, Li-Ming;Liu, Baojun;Fu, Chih-Chiang
    • 마이크로전자및패키징학회지
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    • 제21권4호
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    • pp.63-68
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    • 2014
  • For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

Active Controlled Primary Current Cutting-Off ZVZCS PWM Three-Level DC-DC Converter

  • Shi, Yong
    • Journal of Power Electronics
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    • 제18권2호
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    • pp.375-382
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    • 2018
  • A novel active controlled primary current cutting-off zero-voltage and zero-current switching (ZVZCS) PWM three-level dc-dc converter (TLC) is proposed in this paper. The proposed converter has some attractive advantages. The OFF voltage on the primary switches is only Vin/2 due to the series connected structure. The leading-leg switches can obtain zero-voltage switching (ZVS), and the lagging-leg switches can achieve zero-current switching (ZCS) in a wide load range. Two MOSFETs, referred to as cutting-off MOSFETs, with an ultra-low on-state resistance are used as active controlled primary current cutting-off components, and the added conduction loss can be neglected. The added MOSFETs are switched ON and OFF with ZCS that is irrelevant to the load current. Thus, the auxiliary switching loss can be significantly minimized. In addition, these MOSFETs are not series connected in the circuit loop of the dc input bus bar and the primary switches, which results in a low parasitic inductance. The operation principle and some relevant analyses are provided, and a 6-kW laboratory prototype is built to verify the proposed converter.

Analysis of Cascaded H-Bridge Multilevel Inverter in DTC-SVM Induction Motor Drive for FCEV

  • Gholinezhad, Javad;Noroozian, Reza
    • Journal of Electrical Engineering and Technology
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    • 제8권2호
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    • pp.304-315
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    • 2013
  • In this paper, analysis of cascaded H-bridge multilevel inverter in DTC-SVM (Direct Torque Control-Space Vector Modulation) based induction motor drive for FCEV (Fuel Cell Electric Vehicle) is presented. Cascaded H-bridge multilevel inverter uses multiple series units of H-bridge power cells to achieve medium-voltage operation and low harmonic distortion. In FCEV, a fuel cell stack is used as the major source of electric power moreover the battery and/or ultra-capacitor is used to assist the fuel cell. These sources are suitable for utilizing in cascaded H-bridge multilevel inverter. The drive control strategy is based on DTC-SVM technique. In this scheme, first, stator voltage vector is calculated and then realized by SVM method. Contribution of multilevel inverter to the DTC-SVM scheme is led to achieve high performance motor drive. Simulations are carried out in Matlab-Simulink. Five-level and nine-level inverters are applied in 3hp FCEV induction motor drive for analysis the multilevel inverter. Each H-bridge is implemented using one fuel cell and battery. Good dynamic control and low ripple in the torque and the flux as well as distortion decrease in voltage and current profiles, demonstrate the great performance of multilevel inverter in DTC-SVM induction motor drive for vehicle application.

Ultra Wideband (UWB) - Introduction and Signal Modeling

  • Manandhar, Dinesh;Shibasaki, Ryosuke
    • 대한원격탐사학회:학술대회논문집
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    • 대한원격탐사학회 2003년도 Proceedings of ACRS 2003 ISRS
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    • pp.1421-1423
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    • 2003
  • Ultra Wideband is a new technology from commercial or civilian application viewpoint. It uses already allocated radio spectrum without causing significant interference to other users. It uses very low power, which is below the thermal noise of the receiver and is inherently difficult to detect by un-intentional users. Since, FCC approved the regulation for the commercial use of UWB in February 2002, the development of UWB technology is drastically gaining momentum. However, the technology itself is not new. It has already been used in military applications. UWB has three basic areas of applications, which are communication, positioning and imaging (UWB Microwave). The main commercial application will be for communication since it has very high data transfer rate for short distance. It can also be used for both indoor and outdoor 3-D positioning. Another important application is imaging like microwave remote sensing. An UWB sensor can pass through doors and walls and hence detect the objects inside the room. In this paper, we will introduce about UWB technology along with it’s various possible applications. We will also present some models to generate UWB signal and it’s analysis using signal-processing tools.

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위치 기반 시스템을 위한 CMOS IR-UWB RFIC (A CMOS IR-UWB RFIC for Location Based Systems)

  • 이중무;박명철;어윤성
    • 전자공학회논문지
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    • 제52권12호
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    • pp.67-73
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    • 2015
  • 본 논문에서는 근거리 위치 기반 시스템을 위한 3 - 5 GHz IR-UWB(impulse radio-ultra wide band) RFIC를 제안한다. 수신기의 구조는 에너지 검출 방식으로 설계되었고, 고속 sampling을 하기 위해서 4 bit ADC 와 DLL(delay locked loop) 을 이용하여 equivalent-time sampling 기술을 사용하도록 설계되었다. 송신기는 저전력의 디지털 UWB impulse generator 를 설계하였다. 설계된 IR-UWB RFIC 는 CMOS $0.18{\mu}m$ 공정을 이용하여 제작되었다. 측정된 수신기의 감도는 -85.7 dBm 이며, 송신기와 수신기는 1.8 V 전원 전압에서 각각 32 mA 와 25.5 mA 의 전류를 소모한다.

직접 확산 초 광대역 통신에서의 적응 다중 안테나 전송 기법 (Adaptive Multiple Antenna Transmission Scheme in DS-UWB System)

  • 송형규;국형준
    • 한국통신학회논문지
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    • 제30권12C호
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    • pp.1208-1213
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    • 2005
  • 최근 초 광대역(UWB) 시스템은 높은 데이터 전송율과 낮은 전력소모로 IEEE 802.15.3a에서 표준안으로 고려되고 있다. IEEE 802.15.3a에서 고려되고 있는 시스템 중에, 직접 확산초 광대역 통신(DS-UWB)은 UWB의 이점과 특성을 잘 이용한 시스템이라 할 수 있다. 하지만, DS-UWB의 에러율과 전송 용량은 다중 페이딩 채널에 의해 많은 제한을 받고 있다. 전송 용량과 에러율의 감소를 극복할 효과적이고 강력한 기법이 다중 안테나를 이용한 방법이라 하겠다. STBC는 전송 신호의 안정성 향상에 중점을 둔 시스템이지만, 전송율이 떨어진다. 그러나, V-BLAST는 전송 신호의 안정성은 떨어지지만, 전송율의 향상을 가져올 수 있다. 본 논문에서는 M진 DS-UWB에서 채널 용량을 높이고 안정성을 확보하기 위한 적응 다중 안테나 전송 기법을 제안한다. 제안된 시스템은 STBC와 V-BLAST의 한계점인 에러율과 처리량을 극복할 수 있는 장점을 가지고 있다. 이를 컴퓨터 모의실험으로 검증하였고 분석하였다.

Capacity Analysis of UWB Networks in Three-Dimensional Space

  • Cai, Lin X.;Cai, Lin;Shen, Xuemin;Mark, Jon W.
    • Journal of Communications and Networks
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    • 제11권3호
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    • pp.287-296
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    • 2009
  • Although asymptotic bounds of wireless network capacity have been heavily pursued, the answers to the following questions are still critical for network planning, protocol and architecture design: Given a three-dimensional (3D) network space with the number of active users randomly located in the space and using the wireless communication technology, what are the expected per-flow throughput, network capacity, and network transport capacity? In addition, how can the protocol parameters be tuned to enhance network performance? In this paper, we focus on the ultra wideband (UWB) based wireless personal area networks (WPANs) and provide answers to these questions, considering the salient features of UWB communications, i.e., low transmission/interference power level, accurate ranging capability, etc. Specifically, we demonstrate how to explore the spatial multiplexing gain of UWB networks by allowing appropriate concurrent transmissions. Given 3D space and the number of active users, we derive the expected number of concurrent transmissions, network capacity and transport capacity of the UWB network. The results reveal the main factors affecting network (transport) capacity, and how to determine the best protocol parameters, e.g., exclusive region size, in order to maximize the capacity. Extensive simulation results are given to validate the analytical results.