1 |
L. Liu, G. Q. Zhang, D. Yang, K. Pan, H. Zhang, and F. Hou, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, IEEE, 1366 (2010).
|
2 |
G. Weling, J. Xuejiao, Y. Fei, C. Bifeng, G. Wei, L. Ying, and Y. Weiwei, Journal of Semiconductors, 32, (2011).
|
3 |
Illuminating Engineering Society of North America, IESNA Handbook, 9th ed. (New York, 2000) p. 6.
|
4 |
C. D. Nam and J. M. Kim, Asia Navigation Conference, 1 (2010).
|
5 |
S. W. Hong, International Area Studies Review, 13, 557 (2010).
DOI
|
6 |
D. G. Kim, I. G. Kim, S. Y. Yu, W. Kwon, and G. S. Kil, Journal of the Korean Society for Railway, 1530 (2011).
|
7 |
I. G. Kim, D. G. Kim, G. S. Kil, H. G. Cho, and K. L. Cho, J. KIEEME, 25, 743 (2012).
|
8 |
S. J. Kim, D. G. Kim, I. K. Kim, G. S. Kil, and D. T. Song, J. KIEEME, 26, 773 (2013).
|
9 |
Ice Classed Ships Main Engines, Man Diesel & Turbo
|
10 |
Russian Maritime Register of Shipping ; Rules for Technical Supervision During Construction of Ships and Manufacture of Materials and Products for Ships Volume 2, Electronic Version of Printed Document Approved on 27.06.13.
|
11 |
International Standard IEC 60945 ; Maritime Navigation and Radio Communication Equipment and Systems, 4th ed., 2002.
|
12 |
Y. Guo, K. L. Pan, G. T. Ren, S. J. Chen, and F. Yuan, IEEE, 1411 (2012).
|