• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.9
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• pp.572-576
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• 2017

A hybrid transparent electrode was fabricated with graphene and silver nanowires (Ag NWs). Three different processes were used to fabricate the hybrid electrode. Measurements of the sheet resistances, transmittances, and surface roughnesses of the hybrid electrodes were used to identify the optimal fabrication process. The surface roughness of the hybrid electrodes with Ag NWs embedded in a transparent polymer matrix was significantly lower than that of the other hybrid electrodes. A hybrid electrode fabricated by transferring graphene onto Ag NWs after spin-coating the Ag NWs onto the substrate showed the lowest sheet resistance. The transmittance of the hybrid electrodes was comparable to that of Ag NW electrodes.

• Proceedings of the KIPE Conference
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• 2005.07a
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• pp.466-468
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• 2005

Recently, the demand for the development of high quality and high speed laser printer and efficient power utilizations are required. Among complicate electro-mechanic devices in laser printer, the toner fusing unit consumes above 90[%] of all electrical energy needed for printing devices. Therefore, the development of more effective energy-saving toner fusing process becomes a significant task of much great demand. Generally, there are several way to implement fusing unit, among them this paper present a new hybrid induction heating method. The proposed induction heating method enables to increase coupling coefficient between heating coil and heat roller also to Increase total energy transfer efficiency. Therefore the proposed IH inverter system provide very fast W.U.T.(Warm UP Time), also high efficiency. Through experimental result, the proposed control system is verified.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2231-2235
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• 2008

Thermal performance of fusing system in laser printer is determined by FPOT(First print out time) required and toner fusing quality. FPOT is influenced by the thermal resistance of fusing system between heat source and nip region. Also FPOT is depended by the heat source power and toner fusing temperature. The fusing quality of toner is decided by the temperature, pressure and duration time in nip region. In this study, I have performed thermal analysis for the toner fusing system. Computational simulation has been used to understand the effect of heat source power and printing speed etc. on the temperature distribution of the fusing system. Also in order to predict fusing quality, numerical simulation of the process that paper is continuously supplied to the nip regions were performed. In comparison with the experimental results of the fusing quality vs transferred calory to the toner layer, I could evaluate various fusing condition parameters effected on the thermal performance.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.39.2-39.2
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• 2011

With the steady increase in the demand for flexible devices, mainly in display panels, researchers have focused on finding a novel material that have excellent electrical properties even when it is bended or stretched, along with superior mechanical and thermal properties. Graphene, a single-layered two-dimensional carbon lattice, has recently attracted tremendous research interest in this respect. However, the limitations in the growing method of graphene, mainly chemical vapor deposition on transition metal catalysts, has posed severe problems in terms of device integration, due to the laborious transfer process that may damage and contaminate the graphene layer. In addition, to lower the overall cost, a fabrication technique that supports low temperature and low vacuum is required, which is the main reason why solution-based process for graphene layer deposition has become the hot issue. Nonetheless, a direct deposition method of large area, few-layered, and uniform graphene layers has not been reported yet, along with a convenient method of patterning them. Here, we report an evaporation-induced technique for directly depositing few layers of graphene nanosheets with excellent uniformity and thickness controllability on any substrate. The printed graphene nanosheets can be patterned into desired shapes and structures, which can be directly applicable as flexible and transparent electrode. To illustrate such potential, the transport properties and resistivity of the deposited graphene layers have been investigated according to their thickness. The induced internal flow of the graphene solution during tis evaporation allows uniform deposition with which its thickness, and thus resistivity can be tuned by controlling the composition ratio of the solute and solvent.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.49-53
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• 2018

Since various methods to form well-aligned nano-/micro- patterns are underlying technologies to fabricate next generation wearable electronic devices, many efforts have been made to realize finer patterns in recent years. Among lots of patterning methods, the present invention includes a nano-transfer printing (n-TP) process which is advantageous in that a processing cost is low and high-resolution patterns can be formed within a short processing time. We successfully achieved pattern formation of highly ordered Pt lines with line-width of 250 nm, 500 nm, and $1{\mu}m$ on transparent and flexible substrates. In addition, we analyzed the durability of the patterns, showing excellent stability of line-shape even after a physical and repeated bending test of 500 times using a bending machine. As a result, it is expected that a n-TP process is very useful for forming various metal patterns, and it is also expected to be applied to wiring and interconnection technology of next generation flexible electronic devices.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.44 no.4
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• pp.77-84
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• 2012

The lithographic process depends on a satisfactory ink-in-water emulsion being formed during printing and the speed of wet presses makes the choice of fountain solution vitally important as the ink and fount must react quickly to form a stable emulsion. Ink and water come into contact with each other on the rolls of the press and are forced together in the roll nips. The water is not soluble in the ink since it is slightly fat. Instead, an emulsion is formed, a heterogeneous mass consisting of small water drops mixed into the ink, if the water feed is too great. This emulsification can affect the properties of an off-set ink and negatively affect the printability. So we investigated the effects of the emulsification of phenol free heat-set ink and existing heat-set ink on printed quality, such as amount of ink transfer, printed density, print-through and uniformity. We used Duke emulsification tester for the emulsification of inks, and used IGT printability tester for printed quality. The printed quality were measured by densitometer and were evaluated by the image analysis system. Compared to conventional printing ink, phenol-free ink showed better results of the printability at the emulsification.

• Journal of the Korean institute of surface engineering
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• v.48 no.4
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• pp.158-162
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• 2015

To substitute indium tin oxide (ITO), many substituents have been studied such as metal nanowires, carbon based materials, 2D materials, and conducting polymers. These materials are not good enough to apply to an electrode because theses exhibit relatively high resistance. So metal grids are required as an additionalelectrode to improve the conductivities of substituents. The metal grids were printed by electrohydrodynamic printing system using Ag nanoparticle based ink. The Ag grids showed high uniformity and the line width was about $10{\mu}m$. The Ag nanoparticles are surrounded by dispersants such as unimolecular and polymer to prevent aggregation between Ag nanoparticles. The dispersants lead to low conductivity of Ag grids. Thus, the sintering process of Ag nanoparticles is strongly recommended to remove dispersants and connect each nanoparticles. For sintering process, the interface and microstructure of the Ag grid were controlled in 1.0 torr Ar atmosphere at aound $400^{\circ}C$ of temperature. From the sintering process, the uniformity of the Ag grid was improved and the defects on the Ag grids were reduced. As a result, the resistivity of Ag grid was greatly reduced up to $5.03({\pm}0.10){\times}10^{-6}{\Omega}{\cdot}cm$. The metal grids embedded substrates containing low pressure Ar sintered Ag grids showed 90.4% of transmittance in visible range with $0.43{\Omega}/{\square}$ of sheet resistance.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.83-89
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• 2020

For the past few decades, as part of efforts to protect the environment where fossil fuels, which have been a key energy resource for mankind, are becoming increasingly depleted and pollution due to industrial development, ecofriendly secondary batteries, hydrogen generating energy devices, energy storage systems, and many other new energy technologies are being developed. Among them, the lithium-ion battery (LIB) is considered to be a next-generation energy device suitable for application as a large-capacity battery and capable of industrial application due to its high energy density and long lifespan. However, considering the growing battery market such as eco-friendly electric vehicles and drones, it is expected that a large amount of battery waste will spill out from some point due to the end of life. In order to prepare for this situation, development of a process for recovering lithium and various valuable metals from waste batteries is required, and at the same time, a plan to recycle them is socially required. In this study, we introduce a nanoscale pattern transfer printing (NTP) process of Li2CO3, a representative anode material for lithium ion batteries, one of the strategic materials for recycling waste batteries. First, Li2CO3 powder was formed by pressing in a vacuum, and a 3-inch sputter target for very pure Li2CO3 thin film deposition was successfully produced through high-temperature sintering. The target was mounted on a sputtering device, and a well-ordered Li2CO3 line pattern with a width of 250 nm was successfully obtained on the Si substrate using the NTP process. In addition, based on the nTP method, the periodic Li2CO3 line patterns were formed on the surfaces of metal, glass, flexible polymer substrates, and even curved goggles. These results are expected to be applied to the thin films of various functional materials used in battery devices in the future, and is also expected to be particularly helpful in improving the performance of lithium-ion battery devices on various substrates.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.13-13
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• 2009

We have investigated the fabrication and properties of bendable PZT film formed on plastic substrates for the application in flexible memory. These devices used the PZT active layer formed on $SiO_2/Si$ wafer by sol-gel method with optimized device layouts and Pt electrodes. After etching Pt/PZT/Pt layers, patterned by photolithography process. these layers were transferred on PET plastic substrate using elastomeric stamp. The level of performance that can be achieved approaches that of traditional PZT. devices on rigid bulk wafers.