• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1754-1759
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• 2008

To produce plastic parts that have fine pattern through conventional injection molding, a lot of difficulties follow. Therefore, rapid heating and cooling methods are good candidates for manufacturing injection-molded parts with micro/nano patterns. In this study, we adopted the E-Mold patent technology. The mold for E-Mold technology has a separate heated core with micro heaters. It is very important to optimize the lay-out of the heaters in heated core because it influences both control and distribution of mold temperature. We developed a optimization method of heating line lay-out by using commercial softwares and compared the output with the experimental results. We used Pro-Engineer Wildfire 2.0 for the mold design, ICEMCFD for mesh generation, and FLUENT for heat transfer simulation. The simulation results showed the temperature profile from $60^{\circ}C$ to $120^{\circ}C$ or $180^{\circ}C$ during heating and cooling process which were compared with the injection molding experiments. We concluded that the simulation could well explain the experimental results. It was shown that the E-Mold optimization design for heater lay-out could be available through the simulation.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.1
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• pp.126-141
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• 1997

The purpose of this research is to develope a FEM program for analyzing solidification processes of axisymmetric casting, considering phase changes and the contact between the metal and mold. Tempera- ture recovery method is employed fro considering the phase changes releasing the latent heat and the coin- cident node method is used for calculating the amount of heat transfer between the metal and mold. Tan- gent modulus algorithm is adopted for calculating flow stress and a gap element is employed for modeling the interface between the mold and metal in finding deformed shapes. In order to verify the developed program, axisymmetric aluminum and steel casting processes are simulated. Temperature distribution, phase front position, and shrinkage and porosity creation are compared with measurements, FIDAP results, and good agreements are examined.

• Design & Manufacturing
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• v.12 no.1
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• pp.31-35
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• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.

• Journal of Mechanical Science and Technology
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• v.19 no.7
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• pp.1488-1502
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• 2005

A three dimensional model was developed to analyze the mold filling and solidification in the casting processes. The model uses the VOF method for the calculation of the free surface and the modified Equivalent Specific Heat method for the treatment of the latent heat evolution. The solution procedure is based on the SIMPLER algorithm. The complete model has been validated using the exact solutions for phase change heat transfer and the experimental results of broken water column. The three-dimensional model has been applied to the benchmark test and the results were compared to those from experiment, a two-dimensional analysis, and another three dimensional numerical model.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.413-413
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• 2014

In this paper, we present a fabrication method of functionalized gold nanostructures on flexible substrate that can be implemented for plasmonic sensing application. For biomolecular sensing, many researchers exploit unconventional lithography method like nanoimprint lithography (NIP), contact transfer lithography, soft lithography, colloidal transfer printing due to its usability and easy to functionalization. In particular, nanoimprint and contact transfer lithography need to have anti-adhesion layer for distinctive metallic properties on the flexible substrates. However, when metallic thin film was deposited on the anti-adhesion layer coated substrates, we discover much aggravation of the mold by repetitive use. Thus it would be impossible to get a high quality of metal nanostructure on the transferred substrate for developing flexible electronics based transfer printing. Here we demonstrate a method for nano-pillar mold and transfer the controllable nanoparticle array on the flexible substrates without an anti-adhesion layer. Also functionalization of gold was investigated by the different length of thiol applied for effectively localized surface plasmonic resonance sensing. First, a focused ion beam (FIB) and ICP-RIE are used to fabricate the nanoscale pillar array. Then gold metal layer is deposited onto the patterned nanostructure. The metallic 130 nm and 250 nm nanodisk pattern are transferred onto flexible polymer substrate by bi-layer functionalized contact imprinting which can be tunable surface energy interfaces. Different thiol reagents such as Thioglycolic acid (98%), 3-Mercaptopropionic acid (99%), 11-Mercaptoundecanoic acid (95%) and 16-Mercaptohexadecanoic acid (90%) are used. Overcoming the repeatedly usage of the anti-adhesion layer mold which has less uniformity and not washable interface, contact printing method using bi-layer gold array are not only expedient access to fabrication but also have distinctive properties including anti-adhesion layer free, functionalized bottom of the gold nano disk, repeatedly replicate the pattern on the flexible substrate. As a result we demonstrate the feasibility of flexible plasmonic sensing interface and anticipate that the method can be extended to variable application including the portable bio sensor via mass production of stable nanostructure array and other nanophotonic application.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.121-127
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• 2022

Micro-LED is a light-emitting diode smaller than 100 ㎛ in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate. In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.10
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• pp.790-793
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• 2011

In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.

• Design & Manufacturing
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• v.18 no.2
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• pp.41-50
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• 2024

In this study, experimental design methods were used to derive optimal process conditions for improving the thickness uniformity of a 0.40 mm, 3.5 inch light guide panel. Process mapping and expert group analysis were used to identify factors that influence the thickness of injection molded products. The key factors identified were mold temperature, mold temperature, injection speed, packing pressure, packing time, clamp force, and flash time. Considering the resin manufacturer's recommended process conditions and the process conditions for similar light guide plates, a three-level range was selected for the identified influencing factors. L27 orthogonal array process conditions were generated using the Taguchi method. Injection molding was performed using these L27 orthogonal array to mold the 3.5 inch light guide plates. Thickness measurements were then taken, and the results were analyzed using the signal-to-noise ratio to maximize the CpK value, leading to the determination of the optimal process conditions. The thickness uniformity of the product was analyzed by applying the derived optimum process conditions. The results showed a 97.5% improvement in the Cpk value of 3.22 compared to the process conditions used for similar light guide plates.

• Design & Manufacturing
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• v.17 no.2
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• pp.9-14
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• 2023

In this study, an experiment was conducted to confirm the applicability of the external shape control of the ultrasonic knife to the CFRTP material, which is the base material of thermoplastic. TC910 based on polyamide6 (PA6) was used as the material. The slope 와 and tool transfer speed of the material and tool were selected as process factors for processing, and the following results were obtained. Under all cutting conditions using an ultrasonic knife, friction heat caused by high-frequency vibration was issued at 150℃ at the contact part between the material and the knife during cutting. As a result of the cutting force analysis, the faster the transfer speed, the higher the cutting force as the angle of entry of the blade increased, and the size of the cutting force changed during cutting. As for the size of the burr in accordance with the transfer speed condition, the smallest burr occurred at 150mm/min in the side part, and the smallest burr occurred at 150mm/min and 200mm/min in the case of the outlet burr. The size of the burr according to the entry angle tended to decrease as the tool entry angle increased, and the side part tended to increase as the tool entry angle increased. As a result of the cutting surface analysis, it was confirmed that the base material was eluted under all conditions, and the faster the transfer speed, the lower the elution phenomenon of the base material. Based on the above results, cutting the CFRTP material with an ultrasonic knife is possible, but the effect on heat generation caused by friction needs to be minimized, and further research needs to be conducted on this.

• Korea-Australia Rheology Journal
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• v.12 no.1
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• pp.83-92
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• 2000

In resin transfer molding (RTM) process, preplaced fiber mat is set up in a mold and thermoset resin is injected into the mold. An important interest in RTM process is to minimize cycle time without sacrificing part quality or increasing cost. In this study, the numerical simulation and optimization process in filling stage were conducted in order to determine the optimum gate locations. Control volume finite element method (CVFEM) was used in this numerical analysis with the coordinate transformation method to analyze the complex 3-dimensional structure. Experiments were performed to monitor the flow front to validate simulation results. The results of numerical simulation predicted well the experimental results with every single, simultaneous and sequential injection procedure. We performed the optimization analysis for the sequential injection procedure to minimize fill time. The complex geometry of an automobile bumper core was chosen. Genetic algorithm was used in order to determine the optimum gate locations with regard to 3-step sequential injection case. These results could provide the information of the optimum gate locations in each injection step and could predict fill time and flow front.