• Title/Summary/Keyword: transfer assembly

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Seismic behavior of thin-walled CFST pier-to-base connections with tube confined RC encasement

  • Xuanding Wang;Yue Liao;Jiepeng Liu;Ligui Yang;Xuhong Zhou
    • Steel and Composite Structures
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    • v.50 no.2
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    • pp.217-235
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    • 2024
  • Concrete-filled steel tubes (CFSTs) nowadays are widely used as the main parts of momentous structures, and its connection has gained increasing attention as the complexity in configuration and load transfer mechanism. This paper proposes a novel CFST pier-to-footing incorporating tube-confined RC encasement. Such an innovative approach offers several benefits, including expedited on-site assembly, effective confinement, and collision resistance and corrosion resistance. The seismic behavior of such CFST pier-to-footing connection was studied by testing eight specimens under quasi-static cyclic lateral load. In the experimental research, the influences on the seismic behavior and the order of plastic hinge formation were discussed in detail by changing the footing height, axial compression ratio, number and length of anchored bars, and type of confining tube. All the specimens showed sufficient ductility and energy dissipation, without significant strength degradation. There is no obvious failure in the confined footing, while local buckling can be found in the critical section of the pier. It suggests that the footing provides satisfactory strength protection for the connection.

Behavior of structures repaired by hybrid composite patches during the aging of the adhesive

  • Habib Achache;Rachid Zahi;Djaafar Ait Kaci;Ali Benouis
    • Structural Engineering and Mechanics
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    • v.91 no.2
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    • pp.135-147
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    • 2024
  • The objective of this study is to analyze, using the finite element method, the durability of damaged and repaired structures under the effect of mechanical loading coupled with environmental conditions (water absorption and/or temperature). The study is based on the hybrid patch repair technique, considering several parameters based on the J integral to observe the behavior of the adhesive in transferring load from a damaged plate to the repair patch. The results clearly show that water absorption and increased temperature cause degradation of the mechanical properties of the adhesive, leading to an increase in its plasticization, which is beneficial for the assembly's strength. However, the degradation of the adhesive's properties due to aging in the repair results in poor load transfer from the damaged area to the patch. The findings of this study allowed the authors to conclude that the [0°]8 sequence consistently offers the best performance, with the lowest J integral values and superior crack resistance. The lowest the J integral for the [0°]8 stacking sequence is typically 3-7% lower than that of the [0/-45/45/90]S and [0/-45/90/45]S sequences at elevated temperatures. At 60℃, the J integral increases by approximately 3-6% compared to 40℃ and 20, depending on the aging duration and stacking sequences.

Complete genome sequence of Treponema pedis GNW45 isolated from dairy cattle with active bovine digital dermatitis in Korea

  • Hector Espiritu;Lovelia Mamuad;Edeneil Jerome Valete;Sang-Suk Lee;Yong-Il Cho
    • Journal of Animal Science and Technology
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    • v.66 no.5
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    • pp.1079-1082
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    • 2024
  • Treponema pedis, a fastidious anaerobic spirochete, is one of the main pathogens involved in the development and progression of bovine digital dermatitis (BDD), a lameness-causing hoof infection in cattle. Here, the complete genome sequencing of T. pedis GNW45 isolated from a dairy cow infected with BDD, was presented. Libraries for long and short reads were sequenced using PacBioRSII and Illimuna HiSeqXTen platforms, respectively. De-novo assembly was done using the long reads, producing a circular contig, by which the short reads were aligned to generate a more accurate genome sequence. The genome has a total size of 3,077,465 base pairs, with 36.84% guanine-cytosine content. A total of 2,749 protein-coding sequences, seven ribosomal RNA's, and 45 transfer RNA's were annotated. Functional analysis revealed genes associated with pathogenicity and survivability in the complex pathobiome of BDD. This study provided novel insights into the survival and pathogenic mechanisms of T. pedis GNW45.

A Discrete Model of Conveyor Systems for FMS (FMS를 위한 Conveyor System의 이산구조 모델링)

  • Sin, Ok-Geun
    • The Transactions of the Korea Information Processing Society
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    • v.3 no.6
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    • pp.1397-1406
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    • 1996
  • In this paper, we propose a discrete model of conveyor systems, which is frequently used in flexible manufacturing systems to transfer work-in-process( WIP) between manipulators. In the case where the time required for transferring WIP's between manipulators are greater than that of manufacturing itself, as in many flexible assembly lines, the quantitative model of the transfer systems is needed to analyze the behavior and productivity of the whole manufacturing system. The proposed model is based upon the assumptions that the length of any unit conveyor component is integer multiple of the length of a pallet and hat the transferring speed of the conveyor is constant. Under these assumptions, the observation moments and the length of the conveyor can be quantized. Hence, the state of a conveyor can be represented by two kinds of Boolean variables: one representing the presence of a pallet on each quantize conveyor length and the other representing the mobility of this pallet. The whole conveyor system can be modeling as a network composed of branches and knots based on these two Boolean variables. The proposed modelling method was tested with various conveyor system configurations and showed that the model can be adopted successfully for the simulation of transfer systems and of the piloting of manufacturing processes.

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Characteristics of the Electro-Optical Camera(EOC) (다목적실용위성탑재 전자광학카메라(EOC)의 성능 특성)

  • Seunghoon Lee;Hyung-Sik Shim;Hong-Yul Paik
    • Korean Journal of Remote Sensing
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    • v.14 no.3
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    • pp.213-222
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    • 1998
  • Electro-Optical Camera(EOC) is the main payload of the KOrea Multi-Purpose SATellite(KOMPSAT) with the mission of cartography to build up a digital map of Korean territory including a Digital Terrain Elevation Map(DTEM). This instalment which comprises EOC Sensor Assembly and EOC Electronics Assembly produces the panchromatic images of 6.6 m GSD with a swath wider than 17 km by push-broom scanning and spacecraft body pointing in a visible range of wavelength, 510~730 nm. The high resolution panchromatic image is to be collected for 2 minutes during 98 minutes of orbit cycle covering about 800 km along ground track, over the mission lifetime of 3 years with the functions of programmable gain/offset and on-board image data storage. The image of 8 bit digitization, which is collected by a full reflective type F8.3 triplet without obscuration, is to be transmitted to Ground Station at a rate less than 25 Mbps. EOC was elaborated to have the performance which meets or surpasses its requirements of design phase. The spectral response, the modulation transfer function, and the uniformity of all the 2592 pixel of CCD of EOC are illustrated as they were measured for the convenience of end-user. The spectral response was measured with respect to each gain setup of EOC and this is expected to give the capability of generating more accurate panchromatic image to the users of EOC data. The modulation transfer function of EOC was measured as greater than 16 % at Nyquist frequency over the entire field of view, which exceeds its requirement of larger than 10 %. The uniformity that shows the relative response of each pixel of CCD was measured at every pixel of the Focal Plane Array of EOC and is illustrated for the data processing.

Morphology Controlled Cathode Catalyst Layer with AAO Template in Polymer Electrolyte Membrane Fuel Cells (AAO를 사용한 고분자전해질 연료전지의 공기극 촉매층 구조 제어)

  • Cho, Yoon-Hwan;Cho, Yong-Hun;Jung, Nam-Gee;Ahn, Min-Jeh;Kang, Yun-Sik;Chung, Dong-Young;Lim, Ju-Wan;Sung, Yung-Eun
    • Journal of the Korean Electrochemical Society
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    • v.15 no.2
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    • pp.109-114
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    • 2012
  • The cathode catalyst layer in polymer electrolyte membrane fuel cells (PEMFCs) was fabricated with anodic aluminum oxide (AAO) template and its structure was characterized with scanning electron microscopy (SEM) and Brunauer-Emmett-Teller (BET) analysis. The SEM analysis showed that the catalyst layer was fabricated the Pt nanowire with uniform shape and size. The BET analysis showed that the volume of pores in range of 20-100 nm was enhanced by AAO template. The electrochemical properties with the membrane electrode assembly (MEA) were evaluated by current-voltage polarization measurements and electrochemical impedance spectroscopy. The results showed that the MEA with AAO template reduced the mass transfer resistance and improved the cell performance by approximately 25% through controlling the structure of catalyst layer.

Pepper Blight Disease Inhibition Metagenome Clone Screening Using Soil Metagenome Library (토양 Metagenome Library로부터 고추역병 저해 클론 탐색)

  • Park, Hae-Chul;Sung, So-Ra;Kim, Dong-Gwan;Koo, Bon-Sung;Jeong, Byeong-Moon;Kim, Jin-Heung;Yoon, Moon-Young
    • Korean Journal of Microbiology
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    • v.45 no.2
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    • pp.228-231
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    • 2009
  • We have purified Phytophthora capsici alpha and beta tubulin from Escherchia coli BL21(DE3). The recombinant alpha and beta tubulins were assembled into microtubule in vitro with specific conditions. The metagenome library was isolated from soil in the Mt. Yeo-Ki, Suwon, Korea and manufactured with the method mentioned in experiment contents for in vitro screening of microtubule assembly screening. FRET effect was used for microtubule assembly inhibitor screening with metagenome library. We got 2 metagenome clones from in vitro screening, and these 2 hit clones showed P. capsici growth inhibition activity on the growing pepper plants. These results suggest that new development of potent inhibitor for pepper blight disease and new approach to prevention of pepper blight disease.

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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Electrochemical Behavior of Cathode Catalyst Layers Prepared with Propylene Glycol-based Nafion Ionomer Dispersion for PEMFC (프로필렌글리콜에 분산된 나피온 이오노머로 제조된 공기극 촉매층의 연료전지 성능 특성 연구)

  • Woo, Seunghee;Yang, Tae-Hyun;Park, Seok-Hee;Yim, Sung-Dae
    • Korean Chemical Engineering Research
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    • v.57 no.4
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    • pp.512-518
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    • 2019
  • To develop a membrane electrode assembly (MEA) with lower Pt loading and higher performance in proton exchange membrane fuel cells (PEMFCs), it is an important research issue to understand interfacial structure of Pt/C catalyst and ionomer and design the catalyst layer structure. In this study, we prepared short-side-chain Nafion-based ionomer dispersion using propylene glycol (PG) as a solvent instead of water which is commonly used as a solvent for commercially available ionomers. Cathode catalyst layers with different ionomer content from 20 to 35 wt% were prepared using the ionomer dispersion for the fabrication of four different MEAs, and their fuel cell performance was evaluated. As the ionomer content increased to 35 wt%, the performance of the prepared MEAs increased proportionally, unlike the commercially available water-based ionomer, which exhibited an optimum at about 25 wt%. Small size micelles and slow evaporation of PG in the ionomer dispersion were effective in proton transfer by inducing the formation of a uniformly structured catalyst layer, but the low oxygen permeability problem of the PG-based ionomer film should be resolved to improve the MEA performance.

Deformation Analysis Considering Thermal Expansion of Injection Mold (사출금형의 열팽창을 고려한 변형 분석)

  • Kim, Jun Hyung;Yi, Dae-Eun;Jang, Jeong Hui;Lee, Min Seok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.39 no.9
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    • pp.893-899
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    • 2015
  • In the design of injection molds, the temperature distribution and deformation of the mold is one of the most important parameters that affect the flow characteristics, flash generation, and surface appearance, etc. Plastic injection analyses have been carried out to predict the temperature distribution of the mold and the pressure distribution on the cavity surface. As the input loads, we transfer the temperature and pressure results to the structural analysis. We compare the structural analysis results with the thermal expansion effect using the actual flash and step size of a smartphone cover part. To reduce the flash problem, we proposed a new mold design, and verified the results by performing simulations.