• Journal of the Korean Electrochemical Society
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• v.4 no.2
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• pp.41-46
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• 2001

The effect of organic additives such as PEG ind MPS on throwing power have been studied in the fabrication of porous reticular metal by electrodeposition using the mixture of cupric sulfate and sulfuric acid as electrolyte. Both the polarization test and the electrodeposition on the stacked electrodes, mean pore diameter of which was $250{\mu}m$, were performed to illustrate the behavior of throwing power quantitatively. As far as PEG was concerned, it lowered throwing power of electrodeposition on the porous electrode used in this work while the addition of MPS up to 500 ppm in electrolyte enhanced throwing power monotonously. When both MPS and PEG were added in electrolyte, the effect of MPS on throwing power was superior to that of PEG. However, the excess addition of MPS was found to cause the defect in mechanical strength of deposit layer. From the result of SEM observation, it could be concluded that less than 50 ppm of MPS in electrolyte was appropriate to avoid the breakage of deposit layer.

• Clean Technology
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• v.17 no.2
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• pp.103-109
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• 2011

The process optimization was carried out to improve the throwing power (TP) and the thickness uniformity of the electroless copper (Cu) plating, which plays a seed layer for the subsequent electroplating. The DOE (design of experiment) was employed to screen key factors out of all available operation parameters to influence the TP and thickness uniformity the most. It turned out that higher Cu ion concentration and lower plating temperature are advantageous to accomplish uniform via filling and they are accounted for based on the surface reactivity. To visualize what occurred experimentally and evaluate the phenomena qualitatively, the kinetic Monte Carlo (MC) simulation was introduced. The combination of neatly designed experiments by DOE and supporting theoretical simulation is believed to be inspiring in solving similar kinds of problems in the relevant field.

• Journal of the Korean Electrochemical Society
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• v.3 no.3
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• pp.152-156
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• 2000

The effect of cupric ion concentration on the throwing power has been studied in the electrodeposition of Cu on the porous reticular electrodes with the electrolytes of $CuSO_4\;and\;H_2SO_4$. Sulfuric acid electrolytes with lower concentration of $CuSO_4$ improved throwing power in electrodeposition of copper not only due to higher cathodic polarizability but also due to higher conductivity of the electrolytes. The increase in conductivity of the electrolytes at low concentration of $CuSO_4$ could be also illustrated by the decrease in viscosity of the electrolytes. It was found that both the throwing power and the limiting current density should be taken into account in the electrodeposition of Cu on the reticular electrodes. According to the experimental results, the electrolyte of 0.2M $CuSO_4$ and 0.5M $H_2SO_4$ was found to be the most appropriate condition at the current density of $10mA/cm^2$.

• Journal of the Korean institute of surface engineering
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• v.22 no.4
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• pp.197-206
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• 1989

The Composition and throwing power-of Pb-Sn alloy deposits are investigated in tems of the pulse parameters in pulse plating. Microhardness and intermal srress of alloy deposots are measured. The current efficiency of pulse plating is lower than that of D.C.plating while cathode overpotential and macro-throwing power noticebly increase with increasing peak current density. The Pb content of P.C. plated alloy deposits with increasing average current density, is relatively lower than of D.C. plated deposits at the same average current density. The internal stress of Pb-Sn alloy is not detected and the microhardness are 9.0kg/mm2 and 11kg/mm2 for D.C. plated P.C. plated deposits, respectively.

• Journal of the Korean institute of surface engineering
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• v.35 no.5
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• pp.295-304
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• 2002

In this study, the effect of the diameter and the number of barrel hole on the total area of barrel hole were calculated and analyzed. And the effects of applied current density, rotational speed of the barrel, size and number of barrel hole, and the volume of plating materials on the distribution of plating thickness were experimented and discussed by the barrel electroplating of the tube type brass specimens in a sulfamate nickel barrel solution. The effect of barrel hole size and barrel hole area on the throwing power was also discussed.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.820-832
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• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

• Journal of the Korean Electrochemical Society
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• v.4 no.4
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• pp.160-165
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• 2001

The eletrochemical charateristics of mercapto compound additives on the copper electroplating for semi conductor metalization were investigated. Mercapto compounds including sulfur atom is known that they activate deposition rate in eletroplating. Four different types of mercapto compounds were chosen with different concentration and both the characteristics of plating and throwing power were investigated by electrochemical experiments such as Hull cell test, Haring-Blum cell, cathodic polarization, EQCM(Electrochemical Quartz Crystal Microbalance). 3-Mercapto-1-propanesulfonic acid among 4 different mercapto compounds was regarded as the most proper activator with the results of the mass change of Cu metal deposited on eletrode by cathodic polarization and EQCM. The overpotential was more shifted to 100 mV in the concentration of 20 ppm than the solution with only $Cl^-$ in cathodic scan.

• Journal of the Korean institute of surface engineering
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• v.10 no.3
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• pp.3-11
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• 1977

The trivalent choromium plating process have been studied by serveral group of orkers in the recent years. In the plating process, Alecra 3 process is the most familiar one. Potassium formate and potassium chloride of the bath compositions in the above process, are exchanged for sodium formate and sodium chloride, and then they have been examined characteristics of the electrodeposition using above bath solution and a few optimum conditions. The results are as follows, (1) The characteristics of the electrodeposition ; that is, throwing power, covering power, appearance, and deposition rate are most satisfied when concentration of $CrCl_3{\cdot}6H_2O$ is 0.4 mol/l, and mol ratio of HCOONa to Chromium(III); HCOONa/$Cr^{3+}$, is 2 to 3. (2) Throwing power, covering power, color and deposit rate show a similiar tendency to Alecra 3 process.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.2
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• pp.129-138
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• 1994

The purpose of this study is to clarify the influence of the reaction temperature and $AlCl_3$ content on the aluminide coating formation on Ni-based superalloy IN713C in CVD process and to compare its throwing power with that of Pack Cementation process. Aluminide coating was formed by CVD in hot-wall stainless tube reactor from an $AlCl_3-H_2$ mixture in the temperature range $850{\sim}1050^{\circ}C$. At reaction temperature $850^{\circ}C$, the coating thickness and the content of aluminium at the surface were increased as $AlCl_3$ heating temperature was raised. At reaction temperature $1050^{\circ}C$, they were not influenced by the variation of $AlCl_3$ heating temperature. When $AlCl_3$ heating temperature was fixed $125^{\circ}C$, the phases of the coatings were varied from $Ni_2Al_3$ to Al-rich NiAl and to Ni-rich NiAl with the reaction temperature. Therefore, in this study the reaction temperature has been found to be a major factor in determining the phase formed in CVD process. The throwing power of CVD was superior to that of Pack Cementation.

• Corrosion Science and Technology
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• v.17 no.6
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• pp.272-278
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• 2018

Reinforced concrete (RC) has been used as a construction material in various environments, such as airports, bridges, and ocean concrete structures, etc. Over time, however, rebar in the concrete is prone to corrosion from environmental forces and structural defects of the concrete. Cathodic protection (CP) was invented to prevent problems with corrosion and is widely used for different applications. Cathodic protection is divided into two types: sacrificial anode cathodic protection (SACP) and impressed current cathodic protection (ICCP). There are several limitations to the use of sacrificial anode cathodic protection in complex reinforced concrete structures, including concrete resistivity, throwing power of the CP, and environmental conditions. These limitations can affect the protection performance of SACP. Therefore, we used impressed current cathodic protection in our study. We tested Ti-Mesh, Ti-Rod, and Ti-Ribbon anodes in slab type reinforced concrete specimens. Electrochemical tests were conducted to confirm the impressed current cathodic protection performance under different environmental conditions.