• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2000년도 춘계 학술대회논문집
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• pp.172-177
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• 2000

In this numerical work, three dimensional supersonic laminar flow and heat transfer of a blunt body(sphere-cone) at Mach 5 is simulated. The effects of angle of attack and the spin rate on the now and heat transfer are analysed. To solve the three dimensional compressible Wavier-Stokes equation, a finite volume method with the modified LDFSS scheme is employed for spatial discretization, and a point SGS implicit method is used for time integration. It is found that the heat transfer rate increases at the windward side and decreases at the leeward side with the angle of attack. The heat transfer rate at all surfaces slightly increases with the spin rate.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 1995년도 추계 학술대회논문집
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• pp.175-181
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• 1995

Three-Dimensional Euler equations are solved numerically for the analysis of contraction flows in wind or water tunnels. A second-order finite difference method is used for the spatial discretization on the nonstaggered grid system and the 4-stage Runge-Kutta scheme for the numerical integration in time. In order to speed up the convergence, the local time stepping and the implicit residual-averaging schemes are introduced. The pressure field is obtained by solving the pressure-Poisson equation with the Neumann boundary condition. For the evaluation of the present Euler solver, numerical computations are carried out for the various contraction geometries, one of which was adopted in the Large Cavitation Channel for the U.S. Navy. The comparison of the computational results with the available experimental data shows good agreements.

• 대한기계학회논문집B
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• 제28권5호
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• pp.553-559
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• 2004

Stratified flow past a three-dimensional obstacle such as a sphere has been a long-lasting subject of geophysical, environmental and engineering fluid dynamics. In order to investigate the effect of the stratification on the near wake, in particular, the unsteady vortex formation behind a sphere, numerical simulations of stratified flows past a sphere are conducted. The time-dependent Navier-Stokes equations are solved using a three-dimensional finite element method and a modified explicit time integration scheme. Laminar flow regime is considered, and linear stratification of density is assumed under Bossiness approximation. The computed results include the characteristics of the near wake and the unsteady vortex shedding. With a strong stratification, the separation on the sphere is suppressed and the wake structure behind the sphere becomes planar, resembling that behind a vertical cylinder.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.715-720
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• 2000

Stratified flow past a three-dimensional obstacle such as a sphere has been a long-lasting subject of geophysical, environmental and engineering fluid dynamics. In order to investigate the effect of the stratification on the near wake, in particular, the unsteady vortex formation behind a sphere, numerical simulations of stratified flows past a sphere are conducted. The time-dependent Navier-Stokes equations are solved using a three-dimensional finite element method and a modified explicit time integration scheme. Laminar flow regime is considered and linear stratification of density is assumed under Boussinesq approximation. The computed results include the characteristics of the near wake and the unsteady vortex shedding. With a strong stratification, the separation on the sphere is suppressed and the wake structure behind the sphere becomes planar, resembling that behind a vertical cylinder.

• ETRI Journal
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• 제36권4호
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• pp.635-642
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• 2014

Three-dimensional integrated circuits (3D ICs) implement heterogeneous systems in the same platform by stacking several planar chips vertically with through-silicon via (TSV) technology. 3D ICs have some advantages, including shorter interconnect lengths, higher integration density, and improved performance. Thermal-aware design would enhance the reliability and performance of the interconnects and devices. In this paper, we propose thermal-aware floorplanning with min-cut die partitioning for 3D ICs. The proposed min-cut die partition methodology minimizes the number of connections between partitions based on the min-cut theorem and minimizes the number of TSVs by considering a complementary set from the set of connections between two partitions when assigning the partitions to dies. Also, thermal-aware floorplanning methodology ensures a more even power distribution in the dies and reduces the peak temperature of the chip. The simulation results show that the proposed methodologies reduced the number of TSVs and the peak temperature effectively while also reducing the run-time.

• 한국해양공학회지
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• 제20권3호
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• pp.24-36
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• 2006

This paper investigates wave loads of ships that suffer sinkage due to flood in a compartment caused by damage on the side of the hull. By analyzing ships with various sizesof damage opening, the influence of opening size on ship response is investigated. The motion of the damaged ship is analyzed by using the boundary element method, based on three-dimensional potential theory, considering hydrodynamic pressure in the flooded compartments. The shear forces, bending moments and torsional moments are calculated by the direct integration of the three dimensional hydrodynamic pressure on the outer and inner hulls. A RORO passenger ship with length of 174.8 m is considered in the numerical example, and results for wave loads are discussed.

• Molecules and Cells
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• 제42권9호
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• pp.617-627
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• 2019

Brain organoids are an exciting new technology with the potential to significantly change our understanding of the development and disorders of the human brain. With step-by-step differentiation protocols, three-dimensional neural tissues are self-organized from pluripotent stem cells, and recapitulate the major millstones of human brain development in vitro. Recent studies have shown that brain organoids can mimic the spatiotemporal dynamicity of neurogenesis, the formation of regional neural circuitry, and the integration of glial cells into a neural network. This suggests that brain organoids could serve as a representative model system to study the human brain. In this review, we will overview the development of brain organoid technology, its current progress and applications, and future prospects of this technology.

• Advances in aircraft and spacecraft science
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• 제2권1호
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• pp.77-94
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• 2015

The paper focuses on the integration of a non-linear one-dimensional model of Synthetic Jet (SJ) actuator in a well-assessed numerical simulation method for turbulent compressible flows. The computational approach is intended to the implementation of a numerical tool suited for flow control simulations with affordable CPU resources. A strong compromise is sought between the use of boundary conditions or zero-dimensional models and the full simulation of the actuator cavity, in view of long-term simulation with multiple synthetic jet actuators. The model is integrated in a multi-domain numerical procedure where the controlled flow field is simulated by a standard CFD method for compressible RANS equations, while flow inside the actuator is reduced to a one-dimensional duct flow with a moving piston. The non-linear matching between the two systems, which ensures conservation of the mass, momentum and energy is explained. The numerical method is successfully tested against three typical test cases: the jet in quiescent air, the SJ in cross flow and the flow control on the NACA0015 airfoil.

• ETRI Journal
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• 제34권5호
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• 대한기계학회논문집A
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• 제20권4호
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• pp.1290-1300
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• 1996

The finite element method, based on rigid-plastic formulation, is widely used to simulate metal forming processes. In order to improve the computational efficiency of the rigid-plastic FEM, one-point integration is used to evaluate the stiffness matrix with four-node rectangular elements and eight-node brick elements. In order to control the hourglass modes, hourglass strain rate components were introduced and included in the effective strain rate definition, Numerical tests have shown that the proposed one-point integration scheme reduces the stiffness matrix evaluation time without deteriorating the convergence behavior of Newton-Raphson method. Simulations of a ring compression, a plane-strain closed-die forging and the three-dimensional spike forging processes were carried out by using the proposed integration method. The simulation results are compared to those obtained by applying the conventional integraiton method in terms of the solution accuracy and computational efficiency.