• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1054-1059
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• 2002

A great deal of research has been done in the field of characterization for piezoelectric thin films after the first report on the measurement for the piezoelectric coefficient of thin films in 1990. The main idea of this research is to provide a distinctive solution for the measurement and standardization of both the longitudinal and the transverse piezoelectric d-coefficients, d33 and d31, of ferroelectric thin films. In general, to get these two coefficients of thin films, two different measuring systems are required. Here, we propose the improved method for the evaluation of these two coefficients with single equipment and with the relatively convenient procedure. The two-step loading process of applying the both positive and the negative pressure has been introduced to acquire the piezoelectric coefficients. These results have been calibrated for both the longitudinal and 4he transverse piezoelectric d-coefficients, d33 and 431, of thin films by comparison with the virtual standard created from FEM. In this experiments, we have obtained d33 of 331pC/N and 031 of -92.2pC/N for the PZT thin films.

• Journal of the Korea Institute of Military Science and Technology
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• v.13 no.4
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• pp.659-664
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• 2010

The ZnS/CdS thin films were made using 99.99% ZnS and CdS(Aldrich) powders in $7{\times}10^{-6}torr$. The ZnS layer was coated over the CdS layer on an AlOx membrane within a vacuum, at the average speed of $1{\AA}/sec$. After studying the ZnS/CdS and CdS thin films(both with the dimensions of 2.52nm), using fluorescence spectroscopy and comparing the respective results together, we found that although both of the resulting spectra peaked at 390nm, the ZnS/CdS thin films showed a narrower peak, and a higher intensity of photoluminescence than the CdS thin films. The particles of ZnS/CdS thin films also proved to be more homogeneous in size. In addition, the ZnS layer acted as a protective layer. Also, after studying the spectra of ZnS/CdS thin films taken 30 days after their preparation, we found no signs of aging. These results were verified through the scanning electron microscopy(SEM), EDX analysis, thin film X-ray diffraction, and luminescence spectroscopy.

• Korean Journal of Materials Research
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• v.17 no.7
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• pp.386-389
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• 2007

The dielectric properties of $(Ba_{0.5}Sr_{0.5})TiO_3$ ferroelectric thin films have been investigated according to the substrates in order to optimize the their properties. MgO, r-plane sapphire, and poly-crystalline sapphire (Alumina) substrates have been used to deposite $(Ba_{0.5}Sr_{0.5})TiO_3$ ferroelectric thin films by RF magnetron sputtering. The BST thin films deposited on the single crystal (100)MgO substrates have high tunability and low dielectric loss. These results are caused by a low misfit between the lattice parameters of the BST films and the substrate. The BST films deposited on r-plane sapphire have relatively high misfit, and the tunability of 17% and dielectric loss of 0.0007. To improve the dielectric properties of the BST films, the post-annealing methods has been introduced. The BST films deposited on (100)MgO, (1102)r-plane sapphire, and poly-crystalline sapphire substrates have best properties in post-annealing conditions of $1050^{\circ}C$, $1100^{\circ}C$, and $1150^{\circ}C$, respectively. The different optimal post-annealing conditions have been found according to the different misfits between the films and substrates, and thermal expansion coefficients. Moreover, the films deposited on alumina substrate which is relatively cheap have a good tunability properties of 23% by the post-annealing.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Journal of the Korean Ceramic Society
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• v.34 no.8
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• pp.803-810
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• 1997

Ba0.5Sr0.5TiO3 thin films were deposited by RF magnetron sputliring method in order to clarify the anneal condition and doping effect on loakage current Nb and Al were selected as electron donor and acceptor dopants respectively, in the BST films because they have been known to have nearly same ionic radii as Ti and thought to substitute Ti sites to influence the charge carrier and the acceptor state adjacent to the gram boundary. BST thin films prepared in-situ at elevated temperature showed selatively high leakage current density and low breakdown voltage. In order to achieve smooth surface and to improve electrical properties, BST thin films were deposited at room temperature and annealed at elevated temperature. Post-annealed BST thin films showed smoother surface morphology and lower leakage current density than in-situ prepared thin films. The leakage current density of Al doped thin films was measured to be around 10-8A/cm2, which is much lower than those of undoped and Nb doped BST films. The result clearly demonstrates that higher Schottky barrier and lower mobile charge carrier concentration achieved by annealing in the oxygen atmosphere and by Al doping are desirable for reducing leakage current density in BST thin films.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.3
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• pp.323-328
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• 2011

In this paper, the UWR thin films were prepared by RF PECVD. The relationships between the deposition conditions and the film properties such as morphological and chemical properties of the films were discussed. Moreover, from the analysis of plasma diagnostics using OES, formation mechanism of UWR thin films was discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.591-596
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• 2006

Lead zirconate titanate(PZT) thin films have been attracting worldwide interests in exploring their potential properties [1-3] or the origins [4-6] of their excellent dielectic, ferroelectric and piezoelectric properties near the morphotropic phase boundary (MPB). PZT thin films are expected to apply to the memory devices, micro electro mechanical systems (MEMS), and display because of their superior ferroelectric, pyroelectric, piezoelectric and electron emission properties. In this study, high- performance piezoelectric PZT thin films for actuated mirror array and optical scanner were developed by controlling the several factors, such as molecular-designed precursor, seeding layer and the residual stress in films, by a chemical solution deposition (CSD).

• Proceedings of the Korean Magnestics Society Conference
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• 2000.09a
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• pp.423-424
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• 2000

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.391-394
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• 1999

The diamond thin films are deposited on silicon using MPCVD(Microwave Plasma Chemical Vapor Deposition) method at various deposition microwave power and time. Diamond is deposited with 100 sccm H$_2$ and 2 sccm CH$_4$ by MPCVD. The crystallinity of diamond thin films were increased with increase of microwave power. The growth rate of diamond thin films were increased with increase of time.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.388-388
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• 2010

Molybdenum oxide thin films were deposited on p-type Si(100) by an RF magnetron sputtering method. The physical and chemical properties of these films were studied with X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) techniques. The thickness of molybdenum oxide thin films was measured by spectroscopic ellipsometer (SE) and the thickness was about 200 nm. As the oxygen gas pressure increased, the thickness was decreased, the phases of the thin films were changed, and the amount of metallic Mo decreased but the contents of $Mo^{6+}$ species increases.