• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.13-15
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• 2005

The growth of $Bi_2Te_3$ thin films on (001) GaAs substrates by metal organic chemical vapour deposition (MOCVD) is discussed in this paper. The results of surface morphology, electrical and thermoelectrical properties as a function of growth parameters are given. The surface morphologies of $Bi_2Te_3$ films were strong1y dependent on the deposition temperatures. Surface morphologies varied from step-flow growth mode to island coalescence structures depending on deposition temperature. In-plane carrier concentration and electrical Hall mobility were highly dependent on precursor's ratio of Te/Bi and deposition temperature. The high Seebeck coefficient (of $-160{\mu}VK^{-1}$) and good surface morphology of our result is promising for $Bi_2Te_3$ based thermoelectric thin film and two dimensional supperlattice device applications.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1114-1115
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• 2006

The preparation of single-phase $CuLaO_2$ with delafossite-type structure by means of the solid-state reaction method was investigated using X-ray diffraction. The results showed that notwhistanding the fact that there was a trace of metallic copper, nearly single-phase $CuLaO_2$ was obtained by using $La(OH)_3$ as a lanthanum source and by firing the mixed powder with nonstoichiometric composition ratio of $La(OH)_3:Cu_2O=1:1.425$ in a vacuum at 1273 K for 10 h. The measurement of electrical conductivity and Seebeck coefficient showed that $CuLaO_2$ thus obtained was a p-type semiconductor and had a Seebeck coefficient of approximately $70{\mu}V/K$.

• Bulletin of the Korean Chemical Society
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• 제11권1호
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• pp.11-15
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• 1990

The temperature dependence of electrical conductivities and thermoelectric power of $I_2$-doped poly(1,4-penylene vinylene-co-2,5-dimethoxy-1,4-phenylene vinylene)s [poly(PV-co-DMPV)] and poly(1,4-phenylene vinylene-co-2,5-thienylene vinylene)s [poly(PV-co-TV)] were studied. The former copolymers were also doped with $FeCl_3$. All the samples used were in thin film forms. The temperature dependence of electrical conductivity implies that the variable range hopping conduction mechanism applises to these systems. The activation energy for the electrical conduction in dimethoxy-phenylene vinylene (DMPV) copolymers ranged from about 7 to 30 meV depending on the polymer composition and the nature of the dopant. It was significantly higher for $I_2$-doped thienylene vinylene (TV) copolymers, namely 90-200 meV. The values of the room temperature thermoelectric power were $30-70{\mu}V/K$ for DMPV copolymer and $100-800{\mu}V/K$ for TV copolymers. Anisotropy in the electrical conductivities was also studied for oriented films obtained by uniaxial stretching of the precursor polymer films.

• Advances in materials Research
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• 제13권1호
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• pp.55-62
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• 2024

Cu-based sulfides have recently emerged as promising thermoelectric (TE) materials due to their low cost, non-toxicity, and abundance. In this research, point defect structure of Cu_2-xZnSnS₄ (x=0.1, 0.2, 0.3) samples were synthesized by the mechanical alloying method. Mixed powders of Cu, Zn, Sn and S were milled using high energy ball milling at a rotation speed of 300 rpm in Ar atmosphere. The milled Cu_2-xZnSnS₄ powders were heat-treated at 723 K for 24 h, and subsequently consolidated using spark plasma sintering (SPS) under an applied pressure of 60 MPa for 15 min. The thermal conductivity of the sintered Cu_2-xZnSnS₄ samples was evaluated. A well-defined Cu_2-xZnSnS₄ powders were successfully formed after milling for 16 h, with the particle sizes mostly distributed in the range of 60-100 nm. The lattice constants of aand cdecreased with increasing composition value x. The thermal conductivity of sintered x=0.1 sample exhibited the lowest value and attained 0.93 W/m K at 673 K.

• 공업화학
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• 제1권1호
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• pp.83-90
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• 1990

PbTe, SnTe, PbSnTe계 반도체는 저온 열전재료로서 이들의 화학조성과 비화학양(nonstoichiometry)은 열전 특성에 중요한 인자가 된다. 본 연구에서는 $(Pb_1\;_xSn_x)_1$ $_yTe_y$의 x=0.1, 0.2, 0.3, 0.4, 0.5인 고용체 시편을 제조하여 이들의 조성을 분석하고 화학조성과 전기전도도 및 열기전력과의 상관 관계를 조사하였다. 조성분석을 위하여 Pb의 함량은 EDTA와 Pb(II) 표준용액을 이용한 착화합물 역적정법을, Te의 함량은 $KMnO_4$와 Fe(II)표준용액을 이용한 산화환원 역적정법을 사용하였다. 또한 300K-750K의 온도범위에서 직류 4접점법에 의해 전기전도도를, Heat Pulse법에 의해 열기전력을 측정하였다. 모든 시편은 금속성분 (Pb+Sn) 보다는 Te의 양이 많은 비화학양의 조성을 보이며 p - 형의 반도성을 가졌고 주석의 함량이 증가할수록 비화학양도 증가하였다. 열기전력의 측정으로 시편의 주 전하나르개는 정공임을 확인할 수 있었고 비화학양에 따른 열기전력의 변화를 saturation 영역 내에서 온도에 따른 Fermi Level의 변화폭과 관련지어 설명하였다. x=0.1인 시편은 약 670K 에서 p - 형으로부터 n - 형으로 전도특성이 전환되었는데 이는 이온도에서 saturation영역에서 intrinsic영역으로 전이되며 전자의 이동도가 정공의 이동도보다 크다는 사실로부터 설명되었다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.89-94
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• 2010

Bi 증착원과 Te 증착원의 몰비를 변화시키며 동시증착법으로 Bi-Te 박막을 형성 후, Bi 증착원과 Te 증착원의 몰비에 따른 Bi-Te 박막의 열전특성을 분석하였다. 동시증착법으로 형성한 Bi-Te 박막은 n형 반도체로서, $-60{\sim}-80{\mu}V/K$의 Seebeck 계수를 나타내었다. Bi 증착원의 양이 30 mol%인 조건으로 동시 증착하여 Te 과잉 조성인 박막은 $5{\times}10^{-4}W/m-K^2$의 출력인자를 나타내었으며, Bi 증착원의 양이 90 mol%인 조건으로 동시 증착하여 Bi 과잉 조성인 박막은 $17.7{\times}10^{-4}W/m-K^2$의 출력인자를 나타내었다.

• 열처리공학회지
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• 제31권3호
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• pp.135-142
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• 2018

In this study, we have fabricated n-type $Bi_2Te_{2.85}Se_{0.15}$ compounds by different processing routes such as crushing, milling and mixing respectively. Subsequently, the obtained powders were consolidated by spark plasma sintering (SPS). The phase crystallinity of bulk samples were identified using X-ray diffraction technique. Powder morphology and fracture surface of bulk samples were observed using the scanning electron microscopy (SEM). The Seebeck coefficient and electrical conductivity values were significantly increased for the milling sample than crushing and mixing samples. As a result, the maximum power factor was obtained $2.4mW/mK^2$, which is thrice than that of crushing process. The maximum figure of merit (ZT) of 0.77 was achieved at 400 K for the milling sample. Furthermore, relatively high hardness and density values were noticed for the different processed samples.

• 열처리공학회지
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• 제31권3호
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• pp.126-134
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• 2018

In this research, we produced polycrystalline n-type $Bi_2Te_{2.7}Se_{0.3}$ powder using water atomization. To obtain full benefit through water atomized powder, we have implemented spark plasma sintering and hot extrusion for powder compaction. The microstructure and thermoelectric properties were investigated and compared. The average grain size of SPS and extruded bulks were 3.08 and $3.86{\mu}m$ respectively. The extruded material microstructure contains layered grains with less grain boundaries and its counter-part SPS displays dense packed grains with high grain boundaries. Among both bulks, extrusion sample exhibited high power factor (PF) of $2.96{\times}10^{-3}Wm^{-1}K^{-2}$ which is 38% higher than SPS ($2.14{\times}10^{-3}$) bulk sample. Due to variations in grain size and grain boundaries, the SPS bulk shows low thermal conductivity than extruded bulk. However, the extruded bulk sample exhibited a peak ZT of 0.69 at 400 K, which is 19% higher than SPS bulk sample, due to its higher power factor.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.342-345
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• 2015

The n -type Hf_0.25Zr_0.25Ti_0.5NiSn_0.998Sb_0.002 Half-Heusler (HH) alloy composition was prepared by using the induction melting method in addition to the mechanical grinding, annealing, and spark plasma sintering processes. Analysis of X-ray diffraction (XRD) results indicated the formation of a pure phase HH structured compound. The electrical and thermal properties at temperatures ranging from room temperature to 718 K were investigated. The electrical conductivity increased with increasing temperatures and demonstrated nondegenerate semiconducting behavior, and a large reduction in the thermal conductivity to the value of 2.5 W/mK at room temperature was observed. With the power factor and thermal conductivity, the dimensionless figure of merit was increased with temperature and measured at 0.94 at 718 K for the compound synthesized by the induction melting process.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.1-8
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• 2008

환원분위기 열처리가 진공증착법으로 형성한 $(Bi,Sb)_{2}Te_3$박막의 열전특성에 미치는 영향을 연구하였다. 환원분위기(50% $H_2$ + 50% Ar)에서 $300^{\circ}C$의 온도로 2시간 유지하여 열처리함으로써 $(Bi,Sb)_{2}Te_3$박막의 결정성이 크게 향상되었으며 결정립 크기가 크게 증가하였다. 환원분위기 열처리에 의한 정공농도의 감소에 기인하여 $(Bi,Sb)_2Te_3$박막의 Seebeck계수가 열처리 전의 $\sim90{\mu}V/K$로부터 $\sim180{\mu}V/K$으로 증가하였다. 환원분위기 열처리에 의해 $(Bi,Sb)_{2}Te_3$ 박막의 출력인자(power factor)가 5배에서 16배 정도 향상되었으며, 환원분위기 열처리 후 $(Bi,Sb)_{2}Te_3$ 박막은 $18.6\times10^{-4}W/K^{2}-m$의 최대 출력인자를 나타내었다.