• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1291-1293
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• 2005

Hybrid insulator pentacene thin film transistors (TFTs) were fabricated with thermally grown oxide and cross-linked polyvinylalcohol (PVA) including surface treatment by dilute ploymethylmethacrylate (PMMA) layers on $n^+$ doped silicon wafer. Through the optimization of $SiO_2$ layer thickness in hybrid insulator structure, carrier mobility was increased to above 35 times than that of the TFT only with the gate insulator of $SiO_2$ at the same transverse electric field. The carrier mobility of 1.80 $cm^2$/V-s, subthreshold swing of 1.81 V/decade, and $I_{on}$/ $I_{off}$ current ratio > 1.10 × $10^5$ were obtained at low bias (less than -30 V) condition. The result is one of the best reported performances of pentacne TFTs with hybrid insulator including cross-linked PVA material at low voltage operation.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.5 s.248
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• pp.397-404
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• 2006

Effects of surface defect distribution on flame instability during flame-surface interaction are experimentally investigated. To examine chemical quenching phenomenon which is caused by radical adsorption and recombination processes on the surface, thermally grown silicon oxide plates with well-defined defect density were prepared. ion implantation technique was used to control the number of defects, i.e. oxygen vacancies. In an attempt to preferentially remove oxygen atoms from silicon dioxide surface, argon ions with low energy level from 3keV to 5keV were irradiated at the incident angle of $60^{\circ}$. Compositional and structural modification of $SiO_2$ induced by low-energy $Ar^+$ ion irradiation has been characterized by Atomic Force Microscopy (AFM) and X-ray Photoelectron Spectroscopy (XPS). It has been found that as the ion energy is increased, the number of structural defect is also increased and non-stoichiometric condition of $SiO_x({\le}2)$ is enhanced.

• Journal of the Korean institute of surface engineering
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• v.56 no.6
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• pp.443-450
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• 2023

SiC/SiC_f CMC is vulnerable to water vapor corrosion at a high temperature of 1500℃. So, EBC (Environmental Barrier Coating) materials are required to protect Si-based CMCs. Ytterbium silicates are reported to have coefficient of thermal expansion (CTE) similar to that of the base material, such as SiC/SiC_f CMC. When the EBC are materials exposed to high temperature environment, the interface between ytterbium silicates and SiC/SiC_f CMC is not separated, and the coating purpose can be safely achieved. For the perspective of EBC applications, thermally grown oxide (TGO) layer with different CTE is formed by the reaction with water vapor in EBC, which leads to a decrease in life time. In this study, we prepare two types of ytterbium silicates to observe the corrosion behavior during the expose to high temperature and water vapor. In order to observe this behavior, the steam-jet furnace is prepared. In addition, phase formation of these ytterbium silicates is analyzed with microstructures by the before/after steam-jet evaluation at 1500℃ for 100 h.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.200-200
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• 2010

In recent times, metal oxide semiconductors thin films transistor (TFT), such as zinc and indium based oxide TFTs, have attracted considerable attention because of their several advantageous electrical and optical properties. There are many deposition methods for fabrication of ZnO-based materials such as chemical vapor deposition, RF/DC sputtering and pulsed laser deposition. However, these vacuum process require expensive equipment and result in high manufacturing costs. Also, the methods is difficult to fabricate various multicomponent oxide semiconductor. Recently, several groups report solution processed metal oxide TFTs for low cost and non vacuum process. In this study, we have newly developed solution-processed TFTs based on Ti-related multi-component transparent oxide, i. e., InTiO as the active layer. We propose new multicomponent oxide, Titanium indium oxide(TiInO), to fabricate the high performance TFT through the sol-gel method. We investigated the influence of relative compositions of Ti on the electrical properties. Indium nitrate hydrate [$In(NO^3).xH_2O$] and Titanium isobutoxide [$C_{16}H_{36}O_4Ti$] were dissolved in acetylacetone. Then monoethanolamine (MEA) and acetic acid ($CH_3COOH$) were added to the solution. The molar concentration of indium was kept as 0.1 mol concentration and the amount of Ti was varied according to weighting percent (0, 5, 10%). The complex solutions become clear and homogeneous after stirring for 24 hours. Heavily boron (p+) doped Si wafer with 100nm thermally grown $SiO_2$ serve as the gate and gate dielectric of the TFT, respectively. TiInO thin films were deposited using the sol-gel solution by the spin-coating method. After coating, the films annealed in a tube furnace at $500^{\circ}C$ for 1hour under oxygen ambient. The 5% Ti-doped InO TFT had a field-effect mobility $1.15cm^2/V{\cdot}S$, a threshold voltage of 4.73 V, an on/off current ratio grater than $10^7$, and a subthreshold slop of 0.49 V/dec. The 10% Ti-doped InO TFT had a field-effect mobility $1.03\;cm^2/V{\cdot}S$, a threshold voltage of 1.87 V, an on/off current ration grater than $10^7$, and a subthreshold slop of 0.67 V/dec.

• Solar Energy
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• v.17 no.2
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• pp.55-66
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• 1997

The structural and optoelectronic properties of polycrystalline CdS films up to several microns in thickness, fabricated by three different methods, are compared to one another for the purpose of preparing CdTe/CdS solar cells. All films were deposited on an indium tin oxide on glass substrate. The three methods are: 1) alternated spraying of cation and anion solution at room temperature; 2) spray pyrolysis with substrate temperature up to $500^{\circ}C$; 3) chemical bath deposition (CBD). Deposited films were thermally treated in various ways. All films showed a well-developed wurtzite structure. Films grown by the alternated-spray method and the chemical bath method consist of randomly-oriented crystallites with dimensions <0.5 microns. Annealing at $400^{\circ}C$ increases the crystallite size slightly. Films which were grown by pyrolysis at substrate temperatures from $400^{\circ}C\;to\;500^{\cir\c}C$ were oriented in the <002> direction. For growth by pyrolysis at $500^{\circ}C$, the surface is rough on a lateral scale of 0.1 to 0.3 microns. The optical band gap and defect states are investigated by optical absorption, photoluminescene, Raman, and photothermal deflection spectroscopies.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.50-55
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• 2008

Carbon Nanotube (CNT) films were deposited with varying deposition temperature by RF plasma CVD on Fe catalysts deposited onto $SiO_2$ films grown thermally on the silicon wafer using $C_2H_2$ and $H_2$ gases. The Fe catalysts on silicon oxide film were made by RF magnetron sputtering. The grounded grid mesh cover on the substrate holder was used for depositing CNT thin films with high purity. The surface morphologies and chemical structure of deposited CNT films were characterized using SEM, Raman, XPS and TEM. It was observed that deposited CNTs films were carbon fiber type having Bamboo-like multiwall structure and CNT film grown at $600^{\circ}C$ was more dense than that at $550^{\circ}C$, but become less dense at $650^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.1
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• pp.15-23
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• 2002

In this study, metal/ZnO contacts were thermally annealed at different temperatures (as-dep., 400$^{\circ}C$, 600$^{\circ}C$, 800$^{\circ}C$, 1000$^{\circ}C$) for the investigation of electrical properties, and surface and interface characteristics. The analysis of the element composition and the chemical bonding state of the surface was made by the XPS(X-ray photoelectron spectroscopy). An attempt was made to establish the electrical property-microstructure relationship for the (Ti, Au)/ZnO. The Ti/ZnO contact exhibits an ohmic characteristics with a relatively high contact resistance of 4.74${\times}$10$\^$-1/ $\Omega$$\textrm{cm}^2$ after an annealing at 400$^{\circ}C$. The contact showed a schottky characteristics when the samples were annealed at higher temperature than 400$^{\circ}C$. The transition from the ohmic to schottky characteristics was contributed from the formation of the oxide layers as was confirmed by the peaks for O-O and Ti-O bondings in XPS analysis. For the Au/ZnO contact the lowest contact resistance was obtained from the as-deposited sample. The resistance was slowly increased with annealing temperature up to 600$^{\circ}C$. The ohmic characteristics were maintained eden fort 600$^{\circ}C$ annealing. The XPS analysis showed that the Au-O intensity was dramatically decreased with temperature above 600$^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.101-105
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• 2024

4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (R_on,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (D_it) at the SiO₂/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO₂/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N₂ diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N₂ gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO₂/4H-SiC interface, thereby reducing the D_it.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.207-213
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• 2018

Not only efficiency of chlorine evolution reaction (CER) but also durability namely service life is very important property in dimensional stable anode for Ballast Water Management System (BWMS) for marine ships. Many researchers have been focused on improving efficiency of CER by controlling composition, phase and surface area for a long time, but the efforts to increase durability was relatively small. In this study, we have investigated the effect of $TiO_2$ protective interlayers on efficiency and durability of DSA electrodes. $TiO_2$ protective interlayers were prepared by thermal oxidation at 500, 600 and $700^{\circ}C$ on Ti substrate. And then the DSA electrodes consisting of $Ti/RuO_2-PdO-TiO_2$ were prepared by thermal decomposition method on $TiO_2$ interlayers. The efficiencies of CER of DSA electrodes without $TiO_2$ interlayer and with $TiO_2$ interlayer grown at 500, 600 and $700^{\circ}C$ were 94.19, 94.45, 84.60 and 76.75% respectively. On the otherhand, durabilities were 30, 55, 90 and 65 hours respectively. In terms of industrial aspect, the performance of DSA is considered high efficiency and durability which can correspond to total production of chlorine. If we considered the performance index of DSA as the product of efficiency and durability, performance indices could be recalculated as 28.26, 50.85, 76.14 and 49.89 respectively. As the thermal oxidation temperature increasing, life time were increased remarkerbly, while efficiency of CER was decreased slightly. As a result, DSA electrode with $TiO_2$ interlayer grown at $600^{\circ}C$ has shown about 2.7 times performace of original DSA electrode without $TiO_2$ interlayer.

• Journal of the Korean Vacuum Society
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• v.16 no.5
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• pp.359-365
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• 2007

In this paper we present a bottom-gate type of zinc oxide (ZnO) and Gallium (Ga) doped zinc oxide (GZO) based thin film transistors (TFTs) through applying a radio frequency (RF) magnetron sputtering method at room temperature. The gate leakage current can be reduced up to several ph by applying $SiO_2$ thermally grown instead of using new gate oxide materials. The root mean square (RMS) values of the ZnO and GZO film surface were measured as 1.07 nm and 1.65 nm, respectively. Also, the transmittances of the ZnO and GZO film were more than 80% and 75%, respectively, and they were changed as their film thickness. The ZnO and GZO film had a wurtzite structure that was arranged well as a (002) orientation. The ZnO TFT had a threshold voltage of 2.5 V, a field effect mobility of $0.027\;cm^2/(V{\cdot}s)$, a on/off ratio of $10^4$, a gate voltage swing of 17 V/decade and it operated in a enhancement mode. In case of the GZO TFT, it operated in a depletion mode with a threshold voltage of -3.4 V, a field effect mobility of $0.023\;cm^2/(V{\cdot}s)$, a on/off ratio of $2{\times}10^4$ and a gate voltage swing of 3.3 V/decade. We successfully demonstrated that the TFTs with the enhancement and depletion mode type can be fabricated by using pure ZnO and 1wt% Ga-doped ZnO.