• 제목/요약/키워드: thermal-cycling

검색결과 306건 처리시간 0.033초

Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 $\mu$BGA Solder접합부의 열피로 수명예측 (Prediction of Thermal Fatigue Life on $\mu$BGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys)

  • 김연성;김형일;김종민;신영의
    • Journal of Welding and Joining
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    • 제21권3호
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    • pp.92-98
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    • 2003
  • This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가 (Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA)

  • 정승민;김영호
    • 마이크로전자및패키징학회지
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    • 제13권2호
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    • pp.21-26
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    • 2006
  • NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$$100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

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열 및 기계적 반복하중 하의 내열금속 표면 홀 주변 산화막의 변형 및 응력해석 (Cracking Near a Hole on a Heat- Resistant Alloy Subjected to Thermo-Mechanical Cycling)

  • 이봉훈;강기주
    • 대한기계학회논문집A
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    • 제34권9호
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    • pp.1227-1233
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    • 2010
  • 가스터빈엔진 내의 블레이드에서는 표면에 외부의 찬 공기를 흘려주는 작은 냉각 홀들을 가공하고 열 차단 코팅시스템을 코팅하는 방법으로 기지금속을 고온에서 보호한다. 열 차단 코팅은 열피로 과정에서 산화막의 성장 및 접합층과 산화막의 열팽창계수의 불일치로 산화막내부에 잔류응력이 발생하며 궁극적으로 코팅층의 분리를 유발한다. 본 연구에서는 내열합금 시편 표면에 작은 홀을 가공하여 여러 가지 고온 유지 조건에서 열 및 기계적 피로 시험을 수행하여 홀 주위의 산화막의 변형을 관찰하였다. 실험결과 기계적 피로가 홀 주위의 산화막의 변형에 중요한 영향을 미치며, 동일한 산화막 두께에서 고온 유지 시간이 짧을수록 변형이 쉽게 발생 하였다. 또한 본 연구에서는 홀 주위 산화막의 응력해석을 위한 이론적인 연구도 시도되었다.

Enhancement of Electrochemical Activity of Ni-rich LiNi0.8Mn0.1Co0.1O2 by Precisely Controlled Al2O3 Nanocoatings via Atomic Layer Deposition

  • Ramasamy, Hari Vignesh;Sinha, Soumyadeep;Park, Jooyeon;Gong, Minkyung;Aravindan, Vanchiappan;Heo, Jaeyeong;Lee, Yun-Sung
    • Journal of Electrochemical Science and Technology
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    • 제10권2호
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    • pp.196-205
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    • 2019
  • Ni-rich layered oxides $Li(Ni_xCo_yMn_z)O_2$ (x + y + z = 1) have been extensively studied in recent times owing to their high capacity and low cost and can possibly replace $LiCoO_2$ in the near future. However, these layered oxides suffer from problems related to the capacity fading, thermal stability, and safety at high voltages. In this study, we use surface coating as a strategy to improve the thermal stability at higher voltages. The uniform and conformal $Al_2O_3$ coating on prefabricated electrodes using atomic layer deposition significantly prevented surface degradation over prolonged cycling. Initial capacity of 190, 199, 188 and $166mAh\;g^{-1}$ is obtained for pristine, 2, 5 and 10 cycles of ALD coated samples at 0.2C and maintains 145, 158, 151 and $130mAh\;g^{-1}$ for high current rate of 2C in room temperature. The two-cycle $Al_2O_3$ modified cathode retained 75% of its capacity after 500 cycles at 5C with 0.05% capacity decay per cycle, compared with 46.5% retention for a pristine electrode, at an elevated temperature. Despite the insulating nature of the $Al_2O_3$ coating, a thin layer is sufficient to improve the capacity retention at a high temperature. The $Al_2O_3$ coating can prevent the detrimental surface reactions at a high temperature. Thus, the morphology of the active material is well-maintained even after extensive cycling, whereas the bare electrode undergoes severe degradation.

Comparison of fracture strength, surface hardness, and color stain of conventionally fabricated, 3D printed, and CAD-CAM milled interim prosthodontic materials after thermocycling

  • Mesut Yildirim;Filiz Aykent;Mahmut Sertac Ozdogan
    • The Journal of Advanced Prosthodontics
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    • 제16권2호
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    • pp.115-125
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    • 2024
  • PURPOSE. The purpose of this in vitro study was to investigate the fracture resistance, surface hardness, and color stain of 3D printed, CAD-CAM milled, and conventional interim materials. MATERIALS AND METHODS. A total of 80 specimens were fabricated from auto polymerizing polymethyl methacrylate (PMMA), bis-acryl composite resin, CAD-CAM polymethyl methacrylate resin (milled), and 3D printed composite resin (printed) (n = 20). Forty of them were crown-shaped, on which fracture strength test was performed (n = 10). The others were disc-shaped specimens (10 mm × 2 mm) and divided into two groups for surface hardness and color stainability tests before and after thermal cycling in coffee solution (n = 10). Color parameters were measured with a spectrophotometer before and after each storage period, and color differences (CIEDE2000 [DE00]) were calculated. The distribution of variables was measured with the Kolmogorov Smirnov test, and one-way analysis of variance (ANOVA), Tukey HSD, Kruskal-Wallis, Mann-Whitney U tests were used in the analysis of quantitative independent data. Paired sample t-test was used in the analysis of dependent quantitative data (P < .05). RESULTS. The highest crown fracture resistance values were determined for the 3D printed composite resin (P < .05), and the lowest were observed in the bis-acryl composite resin (P < .05). Before and after thermal cycling, increase in mean hardness values were observed only in 3D printed composite resin (P < .05) and the highest ΔE00 value were observed in PMMA resin for all materials (P < .05). CONCLUSION. 3D printing and CAD-CAM milled interim materials showed better fracture strength. After the coffee thermal cycle, the highest surface hardness value was again found in 3D printing and CAD-CAM milled interim samples and the color change of the bis-acryl resin-based samples and the additive production technique was higher than the PMMA resin and CAD-CAM milled resin samples.

실내 설정온도에 따른 태양열 냉난방 시스템의 동적 거동 해석 (Simnlation of a Thermal Behavior in Solar Heating and Cooling System with respect to Demand Room Temperature)

  • 장환영;이상범;정경택;서정세
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.3446-3451
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    • 2007
  • The thermal behavior of a building in response to heat input from an active solar space heating system is analysed to determine the effect of the variable storage tank temperature on the cycling rate, on and off temperature of a heating cycle and on the comfort characteristics of room air temperature. A computer simulation of the system behavior has been performed and verified by comparisons with various parameters. Especially, this study is focused on the effect of the system's performance when subjected to dynamic cooling loads. The heat input to the absorption system is provided by an array of solar collectors that coupled to a thermal storage tank.

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Thermo-Mechanical Fatigue Analysis of Ribbon Wire/Ag Electrode Interfaces for PV Module

  • 박노창;홍원식;한창운;김동환
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.48.1-48.1
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    • 2011
  • In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

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플립칩 어셈블리의 언더필 최적설계에 관한 연구 (A Study on Optimal Design of Underfill for Flip Chip Package Assemblies)

  • 이선병;김종민;이성혁;신영의
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.150-152
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    • 2007
  • It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

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플라즈마용사공정에서의 최적 조건 결정에 관한 연구 (Determination of Optimum Condition in Plasma Spraying Process)

  • 최경수;박동화
    • 한국세라믹학회지
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    • 제33권2호
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    • pp.155-162
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    • 1996
  • A Taguchi methodology study of the plasma spraying thermal barrier coating (TBC) layer is presented. The experiment parameters were designed by a L8-style orthogonal arrays approach. A Taguchi analysis was conduc-ted through the results of the coating properties which were affected by plasma spraying parameters. Zirconia (partially stbilized with ytrria: PSZ) was sprayed on TiAl intermetallic compound substrates, The coating layer was characterized by thickness microstructure and porosity using SEM and Image analyzer. The coating quali-ties are discussed with respect to thermal barrier effect thermal cycling test6 and adhesion strength test. An optimum condition of plasma spraying process which are derived from the Taguchi analysis could be found for high quality TBC.

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Use of Modern Non­destructive Techniques in High Temperature Degradation of Material and Coatings

  • Lee, C.K.;Sohn, Y.H.
    • International Journal of Korean Welding Society
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    • 제3권2호
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    • pp.29-39
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    • 2003
  • The durability and reliability of thermal barrier coatings (TBCs) play an important role in the service reliability, availability and maintainability (RAM) of hot­section components in advanced turbine engines for aero and utility applications. Photostimulated luminescence spectroscopy (PSLS) and electrochemical impedance spectroscopy (EIS) are being concurrently developed as complimentary non­destructive evaluation (NDE) techniques for quality control and life­remain assessment of TBCs. This paper overviews the governing principles and applications of the luminescence and the impedance examined in the light of residual stress, phase constituents and resistance (or capacitance) in TBC constituents including the thermally grown oxide (TGO) scale. Results from NDE by PSLS and EIS are discussed and related to the microstructural development during high temperature thermal cycling, examined by using a variety of microscopic techniques including focused ion beam (FIB) in­situ lift­out (INLO), transmission and scanning transmission electron microscopy (TEM and STEM).

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