• Transactions of Materials Processing
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• v.19 no.7
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• pp.405-410
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• 2010

Double layered tube that has been used for transportation and oil piping system is occasionally exposed to elevated temperature. The change in stress state at elevated temperature is important for the safe design of double layered tube. In this study, the variation of stress state for hydroformed double layered tube of which inner tube is stainless steel and outer tube is mild steel has been analytically analyzed. To characterize the thermal stress at elevated temperature, analytical model to provide thermal stresses between outer tube and inner tube was developed by using theories of elasticity and Lame equation. The feasibility of analytical model is verified by finite element analysis using ANSYS $CLASSIC^{TM}$, commercially available code. The variation of thermal stress at various thickness combination of inner and outer tube has also been investigated by proposed analytical model.

• Structural Engineering and Mechanics
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• v.82 no.6
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• pp.691-699
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• 2022

This paper is devoted to the presentation of a numerical study on vibration behavior of composite panels reinforced by glass fibres and carbon nanotubes (CNTs) subjected to thermal environments. The effect of temperature variation has been included as thermal load acting on in-plane direction of the panel. To model the composite material, a micromechanical model which contains random dispersion of nanotubes and single-direction fibers has been selected. The geometry of the panel has been considered to have a single curveture along its width. Based on the above assumptions, the governing equations have been derived by using thin shell theory capturing the panel curveture and also nonlinear deflections. Finally, the panel dependence on various factors such as the curveture, nanotube amount, fiber volume, fiber direction and temperature variation has been researched.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.827-828
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• 2012

• Journal of Advanced Marine Engineering and Technology
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• v.22 no.1
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• pp.28-34
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• 1998

This paper introduced the thermal characteristics of Moss Rosenberg Verft spherical tank type LNG Carrier. Especially described the temperature variation during cooling down condition. It is not easy task to calculate the temperature variation because of unsteady state condition. In this paper, computer simulation program is developed by using a Tomas Algorithm on unsteady state condition and compared with calculation results and experimental results on existing LNG Carrier voyage.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.109-110
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• 2010

• Proceedings of the SAREK Conference
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• 2005.06a
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• pp.97-97
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• 2005

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.361-362
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• 2010

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05b
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• pp.95-101
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• 1996

In this paper, the steady 2-dimensional model for a long horizontal line with different end temperatures undergoing natural convection at very high Rayleigh number is proposed to numerically investigate the heat transfer and flow characteristics. The dimensionless governing equations are solved by using SIMPLE (Semi-Implicit Method for Pressure Linked Equations) algorithm which is developed using control volumes and staggered grids. The numerical results are verified by comparison with the operating PWR test data. The analysis focuses on the effects of variation of the heat transfer rates at the pipe surface, the thermal conductivities of the pipe material and the thickness of the pipe wall on the thermal stratification. The results show that the heat transfer rate at the pipe surface is the controlling parameter. A significant reduction and disappearance of thermal stratification phenomenon is observed at the Biot number of 5.0$\times$10$^{-2}$. The results also show that the increment of the thermal conductivity and thickness of the wall weakens the thermal stratification and somewhat reduces azimuthal temperature gradient in the pipe wall. Those effects are however minor, when compared with those due to the variation of the heat transfer rates at the surface of the pipe wall.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.3
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• pp.31-38
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• 1991

Effect of thermal cycling on shape memory effect and stabilization of austenite was investigated in Fe-21%Mn alloy. The thermal cyclic treatment was carried out with two types, room temperature${\leftrightarrow}215^{\circ}C$ and room temperature${\leftrightarrow}260^{\circ}C$. In case of the room temperature${\leftrightarrow}215^{\circ}C$, the SME was rapidly increased up to 3 cycles and maintained nearly constant value regardless of further cycles. In case of the room temperature${\leftrightarrow}260^{\circ}C$, however, the SME was increased with increasing the thermal cycle up to 5 cycles and decreased gradually with further cycle. The variation of the ${\varepsilon}$ martensite volume pet with the thermal cycle was in good agreement with the variation of the SME. Therefore, the change of the SME due to the cyclic treatment was explained with the change of the ${\varepsilon}$ martensite content. As the thermal cycle was increased, the $M_s$ temperature was decreased, and the $A_s$ and $A_f$ temperatures were increased, respectively.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.