• 제목/요약/키워드: thermal stresses

검색결과 832건 처리시간 0.035초

순차이송 GMP 공정에서의 비구면 유리렌즈 성형 해석에 관한 연구 (Study on the Aspheric Glass Lens Forming Simulation in the Progressive GMP process)

  • 장성호;강정진;신광호;정우철;허영무;정태성
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.539-542
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    • 2008
  • Recently, GMP(Glass Molding Press) process is mainly used to produce aspheric glass lenses. Because glass lens is heated at high temperature above Ty (yielding point) for forming glass, the quality of aspheric glass lens is deteriorated by residual stresses which are generated in a aspheric glass lens after forming. Before this study, as a fundamental study to develop forming conditions for progressive GMP process, compression, strain relaxation and thermal conductivity tests were carried out to obtain the visco-rigid plastic, the visco-elastic and thermal properties of K-PBK40 which is newly developed and applied for precision molding glass material, In this study, using the experimental results we obtained, a glass lens forming simulation in progressive GMP process was carried out and we could forecast the shape of deformed glass lenses and residual stresses contribution in the structure of deformed glass lenses after forming.

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알루미늄 확산코팅재료의 주기산화 특성에 관한 연구 (A Study on the Cyclic Oxidation Properties of Aluminum Diffusion Coated Materials)

  • 강석철;민경만;김길무
    • 한국표면공학회지
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    • 제32권1호
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    • pp.49-60
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    • 1999
  • The protective oxide scales and coatings formed on high temperature materials must be preserved in high temperature atmosphere. And the thermal stresses induced by thermal cycling and the growth stresses by the formation of oxide scales can cause the loss of adherence and spalling of the oxide scales and coated layers. Among the coating processes Al diffusion coating is favored due to thermochemical stability and superior adherence in an hostile atmosphere. In this study, protective oxide forming element, Al was coated on Ni, Inconel 600 and 690 by diffusion coating process varying coating temperature and time. And the surface stability and adherence of oxide scales formed on those Al diffusion coated materials were evaluated by thermal cycling test. Al diffusion coated specimens showed superior cyclic oxidation resistance compared to bare ones and specimens coated for longer period had better cyclic oxidation resistance, due to the abundant amount of Al in the coated layer. Meanwhile Al diffusion coated Inconel 600 and 690 showed improved cyclic oxidation resistance by the effect of Al in the coated layer and Cr in the substrate. Comparing both Al diffusion coated Inconel 600 and 690, Al diffusion coated Inconel 690 maintained better adhesion between coated layer and substrate by virtue of the bridging effect resulting from the segregation of Cr in the interdiffusion zone.

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Thermal stresses and deflections of functionally graded sandwich plates using a new refined hyperbolic shear deformation theory

  • Bouchafa, Ali;Bouiadjra, Mohamed Bachir;Houari, Mohammed Sid Ahmed;Tounsi, Abdelouahed
    • Steel and Composite Structures
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    • 제18권6호
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    • pp.1493-1515
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    • 2015
  • A new refined hyperbolic shear deformation theory (RHSDT), which involves only four unknown functions as against five in case of other shear deformation theories, is presented for the thermoelastic bending analysis of functionally graded sandwich plates. Unlike any other theory, the number of unknown functions involved is only four, as against five in case of other shear deformation theories. The theory presented is variationally consistent, does not require shear correction factor, and gives rise to transverse shear stress variation such that the transverse shear stresses vary parabolically across the thickness satisfying shear stress free surface conditions. The sandwich plate faces are assumed to have isotropic, two-constituent material distribution through the thickness, and the modulus of elasticity, Poisson's ratio of the faces, and thermal expansion coefficients are assumed to vary according to a power law distribution in terms of the volume fractions of the constituents. The core layer is still homogeneous and made of an isotropic ceramic material. Several kinds of sandwich plates are used taking into account the symmetry of the plate and the thickness of each layer. The influences played by the transverse shear deformation, thermal load, plate aspect ratio and volume fraction distribution are studied. Numerical results for deflections and stresses of functionally graded metal-ceramic plates are investigated. It can be concluded that the proposed theory is accurate and simple in solving the thermoelastic bending behavior of functionally graded plates.

Theoretical models of threshold stress intensity factor and critical hydride length for delayed hydride cracking considering thermal stresses

  • Zhang, Jingyu;Zhu, Jiacheng;Ding, Shurong;Chen, Liang;Li, Wenjie;Pang, Hua
    • Nuclear Engineering and Technology
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    • 제50권7호
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    • pp.1138-1147
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    • 2018
  • Delayed hydride cracking (DHC) is an important failure mechanism for Zircaloy tubes in the demanding environment of nuclear reactors. The threshold stress intensity factor, $K_{IH}$, and critical hydride length, $l_C$, are important parameters to evaluate DHC. Theoretical models of them are developed for Zircaloy tubes undergoing non-homogenous temperature loading, with new stress distributions ahead of the crack tip and thermal stresses involved. A new stress distribution in the plastic zone ahead of the crack tip is proposed according to the fracture mechanics theory of second-order estimate of plastic zone size. The developed models with fewer fitting parameters are validated with the experimental results for $K_{IH}$ and $l_C$. The research results for radial cracking cases indicate that a better agreement for $K_{IH}$ can be achieved; the negative axial thermal stresses can lessen $K_{IH}$ and enlarge the critical hydride length, so its effect should be considered in the safety evaluation and constraint design for fuel rods; the critical hydride length $l_C$ changes slightly in a certain range of stress intensity factors, which interprets the phenomenon that the DHC velocity varies slowly in the steady crack growth stage. Besides, the sensitivity analysis of model parameters demonstrates that an increase in yield strength of zircaloy will result in a decrease in the critical hydride length $l_C$, and $K_{IH}$ will firstly decrease and then have a trend to increase with the yield strength of Zircaloy; higher fracture strength of hydrided zircaloy will lead to very high values of threshold stress intensity factor and critical hydride length at higher temperatures, which might be the main mechanism of crack arrest for some Zircaloy materials.

N-pole 종류의 FSS가 결합된 복합재료 구조의 잔류응력과 전파투과특성 (Study on Thermal Residual Stresses and Transmission Characteristics in N-pole Type Frequency Selective Surface Embedded Composite Structures)

  • 박경미;황인한;전흥재;홍익표;박용배;김윤재
    • 한국전산구조공학회논문집
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    • 제26권2호
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    • pp.123-130
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    • 2013
  • 본 논문에서는 주파수 선택적 투과막(FSS)이 결합된 복합재료 구조에서 구성 재료 간의 열팽창계수 차이로 잔류응력이 발생하므로 이로 인한 층간분리나 FSS의 손상 등 구조적인 파손 가능성과 잔류응력으로 인하여 변형된 FSS가 전파투과특성에 미치는 영향에 대하여 연구하였다. FSS는 단위요소의 종류, 설계변수, 배열에 따라 전파특성이 다르게 나타나므로, PSO 알고리즘을 이용하여 다이폴이 목표주파수에서 투과특성을 갖도록 설계하고 그 설계치수를 다른 N-pole 종류 단위요소(Tripole, Cross dipole, Jerusalem cross)에 적용하여, 복합재료 구조에 발생하는 잔류응력과 그로인한 구조적 손상과 전파 특성을 영향성을 관찰하고 FSS패턴과 복합재료의 적층 변화에 따라 비교하였다.

주파수 선택적 투과막이 결합된 복합재료의 잔류응력평가 및 선택적 투과막 설계 (Thermal Residual Stresses in the Frequency Selective Surface Embedded Composite Structures and Design of Frequency Selective Surface)

  • 김가연;전흥재;강경탁;이경원;홍익표;이명건
    • Composites Research
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    • 제24권1호
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    • pp.37-44
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    • 2011
  • 본 연구에서는 최적화 알고리즘 중 하나인 PSO기법을 이용하여 주파수 선택적 표면을 설계하였으며, 설계된 주파수 선택구조를 적용한 하이브리드 레이돔의 잔류응력을 예측하였다. 주파수 선택 구조로서 Square Loop의 등가회로모델에 PSO를 적용하여, K-band(23GHz)에서 차단특성을 갖는 최적의 설계값을 구하였다. 또한 FSS와 복합재료의 하이브리드 레이돔을 제작할 때 발생하는 잔류응력의 효과가 클 경우 구조적 안정성이 떨어질 뿐만 아니라 층간분리가 발생하여 FSS의 전파투과특성에 영향을 미칠 수 있으므로, 하이브리드 레이돔의 제작 시에 동시경화 후 상온으로 냉각되는 과정에서 발생하는 잔류 열응력에 대하여 예측하였으며, FSS패턴과 복합재료의 적층각 변화에 따른 영향을 비교하였다.

주파수 선택막이 삽입된 복합재 평판의 잔류 열응력과 스프링 백 효과 (Thermal Residual Stresses and Spring back Effects on the Frequency Selective Surface Embedded Composite Laminates)

  • 박경미;서윤석;전흥재;홍익표;박용배;김윤재
    • 한국전산구조공학회논문집
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    • 제26권6호
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    • pp.475-481
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    • 2013
  • 복합재료 사이에 주파수 선택적 투과막(Frequency Selective Surface)을 삽입하여 동시경화 공정을 이용하여 주파수 선택적 투과 기능을 가지는 하이브리드 복합재료를 성형하면 재료들 간의 열팽창 계수와 강성의 차이로 인해 구조 내에 잔류 열응력이 발생하게 되고, 이로 인하여 스프링 백 현상이 발생한다. 따라서 복합재의 적층에 따른 영향을 알아보기 위해 복합재료의 적층각을 선택적 투과막(Frequency Selective Surface)을 중심으로 대칭과 비대칭 적층으로 적용하여 하이브리드 구조의 잔류 열응력을 예측하고, 이에 대한 스프링 백에 대해서 연구하였다.

패키지 및 PCB 재료가 PDIP 열특성에 미치는 영향에 관한 연구 (A Study on the Effects of Package and PCB Materials on Thermal Characteristics of PDIP)

  • 정일용;이규봉
    • 대한기계학회논문집
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    • 제18권3호
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    • pp.729-737
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    • 1994
  • A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

Numerical Analysis for Unsteady Thermal Stratified Turbulent Flow in a Horizontal Circular Cylinder

  • Ahn, Jang-Sun;Ko, Yong-Sang;Park, Byeong-Ho;Youm, Hag-Ki;Park, Man-Heung
    • Nuclear Engineering and Technology
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    • 제28권4호
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    • pp.405-414
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    • 1996
  • In this paper, the unsteady 2-dimensional turbulent flow model for thermal stratification in a pressurizer surge line of PWR plant is proposed to numerically investigate the heat transfer and flow characteristics. The turbulence model is adapted to the low Reynolds number K-$\varepsilon$ model (Davidson model). The dimensionless governing equations are solved by using the SIMPLE (Semi-Implicit Method for Pressure Linked Equations) algorithm. The results are compared with simulated experimental results of TEMR Test. The time-dependent temperature profiles in the fluid and pipe nil are shown with the thermal stratification occurring in the horizontal section of the pipe. The corresponding thermal stresses are also presented. The numerical result for thermal stratification by the outsurge during heatup operation of PWR shows that the maximum dimensionless temperature difference is about 0.83 between hot and cold sections of pipe well and the maximum thermal stress is calculated about 322MPa at the dimensionless time 28.5 under given conditions.

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이종 전자재료 JO1NT 부위의 신뢰성에 관한 연구 (A Study on Reliability of Solder Joint in Different Electronic Materials)

  • 신영의;김경섭;김형호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1993년도 추계학술대회 논문집
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    • pp.49-54
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    • 1993
  • This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

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