• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Laser Solutions
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• v.11 no.1
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• Journal of the Korean Ceramic Society
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• v.29 no.4
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• pp.283-292
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• 1992

Duplex composites such as Y-TZP/Y-TZP-20 wt.% Al2O3 and Y-TZP/Y-TZP- 40 wt.% Al2O3 were made by mixing the sieve-shaked granules followed by isostatic pressing and sintering at 150$0^{\circ}C$ for 1 hour. So Y-TZP became matrix region and Y-TZP-20 wt.% Al2O3 or Y-TZP-40 wt.% Al2O3 became dispersed regions. In these composites, propagating cracks due to thermal shock always run into the dispersed region because these regions act as compressive zone due to low thermal expansion than matrix region. So duplexes having dispersed regions of Y-TZP-40 wt.% Al2O3 showed higher retained strength after thermal shock than matrix only composites because crack propagations were stopped more or less in the dispersed region. But when crack propagations were much more easy than matrix like Y-TZP-20 wt.% Al2O3 region, retained strength was decreased than the matrix only composites despite of the low initial strength.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

• Nuclear Engineering and Technology
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• v.51 no.1
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• pp.190-197
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• 2019

W-K-TiC alloys with different titanium carbide concentrations (0.05, 0.1, 0.25, 0.5, 1, 2) wt.% were fabricated through Mechanical Alloying and Spark Plasma Sintering. The effects of the addition of nano-scaled TiC particles on the relative density, Vickers micro-hardness, microstructure, crystal information, thermal shock resistance, and tensile strength were investigated. It is revealed that the doped TiC nano-particles located at the grain boundaries. The relative density and Vickers micro-hardness of W-K-TiC alloys was enhanced with TiC addition and the highest Vickers micro-hardness is 731.55. As the TiC addition increased from 0.05 to 2 wt%, the room-temperature tensile strength raised from 141 to 353 MPa. The grain size of the W-K-TiC alloys decreased sharply from $2.56{\mu}m$ to 330 nm with the enhanced TiC doping. The resistance to thermal shock damage of W-K-TiC alloys was improved slightly with the increased TiC addition.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.617-620
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• 2011

Thermal shock behavior of porous ceramic nozzles with various pore sizes for continuous casting process of steel was investigated in terms of physical properties and microstucture. Porous nozzle samples with a composition of $Al_2O_3$-$SiO_2$-$ZrO_2$ were fabricatedby adding various sizes of graphite as the pore forming agent. As the graphite size increased from 45~75 to 150~180 ${\mu}m$, both the resulting pore size and the flexural strength also increased. A thermal shock test was carried out at temperatures (${\Delta}$T) of 600, 700, 800, and 900$^{\circ}C$. Microstructure analysis revealed a small number of cracks on the sample with the largest mean pore size of 22.32 ${\mu}m$. In addition, increasing the pore size led to a smaller decrease in both pressure drop and elastic modulus. In conclusion, controlling the pore size can enhance thermal shock behavior.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.3
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• pp.524-531
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• 2011

The cryogenic vessel, storing a liquified solutions as LOX and $LN_2$, consists of a external vessel, internal vessel, thermal insulator and internal support. The internal support should be satisfied with mechanical strength not only to support weight of internal tank but also to maintain uniform space between external and internal tank in spite of external mechanical shock. However, excessive structure design of internal supports is able to increase the amount of heat conduction and the rate of vaporization. The thermal insulator, filled with space between a external and internal vessel, reduces the rate of heat transfer and guarantees the standing time of cryogenic vessel. Especially powder type of insulator has low thermal conductivity and reduce the specification of structure design. In order to evaluate the effect of insulator on structure design, the experiment set-up simulated cryogenic vessel was tested in shock environment according to thermal insulator. As a result, the behavior of internal support under external shock was understood and the design criteria was able to be suggested.

• Journal of the Korean institute of surface engineering
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• v.31 no.1
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• pp.12-23
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• 1998

The Thermal Barrier Coating(TBC) has been used to improve the heat barrier and tribological properties of the aircraft engine and the automobile engine in high temperature. Especially, the high temperature tribological propertied of the cylinder haed and the piston crown of diesel engine was emphasized. Therefore, the purpose of this work was to evaluate the microstructure, tribological propeer in high tempearmal shock resistance and bonding strength of five layer functionally gradient TBC for the applications. The five layerwere composed with 100% ceramic insulating later, 75(ceramic):25 (metal) layer, 50:50 layer, 25:75 layer and 100% metal bonding layer to redude the thermal stress. the YSL and MSL poweders were the insulation ceramics powers. The NiCrAly, Inconel625 and SUS powders were the bonding and mixingg powders for plasma spray process. According to the result of high temperature wear test, the wera resistance of YSZ/NiCrAlY siytem was most out standing at 600 and $800^{\circ}C$. At $400^{\circ}C$, the wear resistance of YSZ/Inconel system was better than others. Wear volume at other temperature because of the low temperature degration of zirconia. The thermal shock mechanism of 5 later is the vertical crack gegration in insulating layer. this means that the initial cracks were generated in the top layer, and then developed into the composite layers during thermal shock test. Finally, these cracks werereached to the interface of coating and substrate and also, these vertioal cracks join with the horizontal cracks of the each layers. The bonding strength of YSZ/NiCrAlY and YSZ/Inconel 5 layer system is better than other 5layer systems. The theramal shock resistance of thermal barrier coating s with 5 layer system is better than that of 3 layers and 2 layers.

• Progress in Superconductivity and Cryogenics
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• v.1 no.2
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• pp.1-7
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• 1999

we evaluated the effects of joining process such as contact method. shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape, Specifically. the current capacity of the jointed tape was measured as a function of uniaxial pressure. and the thermal shock, bonding strength and the thermal of the tape were evaluated and correlated to the microstructural evolution. It was observed that the current capacity was significanrly dependent on the uniaxial pressure The jointed tape, fabricated with a pressure of 1,000-1,600 Mpa. showed the highest value of current capacity results from improvements in core density, contacting area and grain alignment, ect. In addition, the strength of jointed tape was measured to be 86 Mpa, which is about 88% of the unjoined ape's strength. The irreversible strain($\varepsilon$irrev) for the jointed tape was measured to be 0.1%, smaller than that of unjoined tape ($\varepsilon$irrev= 0.3%). The decrease in the strength and irreversible strain for jointed tape is believed to be due to the irregular geometry/morphology of the transition area of the tape.