• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.11 no.2
• /
• pp.236-243
• /
• 1999

Aluminum/Freon-22 heat pipes were manufactured and tested which have a special wick geometry combining axial groove and screen mesh. There were 14 axial grooves in a cross-section and these were covered by two layers of 350 mesh screens to enhance the thermal performance. The performance test was conducted by varying the thermal load and tilt angle. Furthermore, the operation limits and overall heat transfer coefficient were investigated. The experimental results will be useful in a variety of applications, especially in design and manufacturing of a high-efficiency heat exchanger and energy recovery systems.

• International Journal of Air-Conditioning and Refrigeration
• /
• v.12 no.1
• /
• pp.21-29
• /
• 2004

This paper is to study the heat transfer performance of the copper-water heat pipe with screen wicks. Recently, the semiconductor capacity of an electronic unit becomes larger, but its size becomes much smaller. As a result, a high- performance cooling system is needed. Experimental variables are inclination angles, temperatures of cooling waters and the mesh number of screen wicks. The distilled water was used as a working fluid. Based on the experimental results, when the copper-water heat pipe of 6mm diameter is used at the top heat mode, the heat transfer performance of 100 mesh 2 layers heat pipe is better than that of 150 and 200 mesh. The thermal resistance of the two layers with the 100-mesh screen was 0.7-$0.8^{\circ}C$/W.

• Journal of the Korean Solar Energy Society
• /
• v.34 no.5
• /
• pp.89-99
• /
• 2014

The determination of the solar and thermal performance of fenestration is required for the evaluation of fenestration energy performance, estimating building load. Presently, there exist several methods for determining the thermal transmission(U-value) and solar heat gain coefficient (SHGC) of fenestration system. These method are commonly grouped under calculation or experimental methods. While U-value testing and calculation methods have been long established, SHGC has been evaluated only by the method of calculation under the lack of any established testing method. However, it is difficult to assess the exact SHGC for various types of fenestration with sun-shading or other solar control systems. The purpose of this study was to evaluate the effect of interior venetian blind and roll screen on the SHGC of glazing system. SHGC has been evaluated by the KS L 9107 test method and exiting calculation method for precise comparison of the energy performances of various shading devices. In this research, the test sample consists of three different types of double glazing unit with venetian blind and roll screen. Slat angles of venetian blind were changed to $-45^{\circ}$, $0^{\circ}$, and$-45^{\circ}$. For the roll screen, measurements were taken with the roll screen in the closed position. In result, the venetian blind reduced SHGC by 21.2~28.4% at $45^{\circ}$, when compared to the double glazing unit. The roll screen reduced SHGC by 34.4~41.7% at closed. The differences between the measured and calculated SHGC were found to range between 0.001(0.2%) and 0.047(11.1%) for all test cases. For the cases of venetian blind $-45^{\circ}$, $0^{\circ}$ and $45^{\circ}$, the deviation ratio were 3.6~9.8%, 1.1~2.6%, 4.2~11.1%, respectively. For the case of roll screen, the deviation ratio were 4.1~5.7%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1993.11a
• /
• pp.49-54
• /
• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Journal of the Korean Institute of Telematics and Electronics B
• /
• v.31B no.6
• /
• pp.81-90
• /
• 1994

Finite element analysis is performed for transient thermal deformation of a shadow mask inside the Braun tube and the landing shift or mislanding of the electronic beam is calclated. The shadow mask has numerous slits through which the electronic beams are guided to land on the designed phosphor. Its thermal deformations therefore cause the mislanding of the electronic beam and result in decolorization of a screen. For realistic finite element analysis, firstly the effective thermal conductivity and the effective elastric modulus are calculated, and the shadow mask is modeled as shell without slits. Next the nonlinear finite element formulation is developed for transient heat transfer on the shadow mask, wherein thermal radiation is a major heat transfer mechanism. Analysis of the resulting thermoelastic deformations is followed, from which the mislanding of the electronic beam is obtained. The present finite element scheme may be efficiently used for thermal deformation design of a shadow mask.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.139-142
• /
• 2002

Characteristics of piezoelectric thick films prepared by screen printing were investigated. The piezoelectric thick films were fabricated using Pb(Al,Nb)O$_3$-Pb(Zr,Ti)O$_3$ system on Si-substrate. The fabricated thick films were burned out at 400$^{\circ}C$ and sintered at 850∼1000$^{\circ}C$ using rapid thermal annealing(RTA) precess. The thickness of piezoelectric thick films were 10$\mu\textrm{m}$. PAN-PZT thick film on Ag-Pd/SiO$_2$/Si prepared at 900$^{\circ}C$/1300sec had remanent polarization of 19.70 ${\mu}$C/$\textrm{cm}^2$.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.14 no.11
• /
• pp.880-889
• /
• 2002

The purpose of the present study is to examine the factors affecting the heat transfer limitations of screen mesh heat pipe for electronic cooling by theoretical analysis. Diameter of pipe was 6 mm, and mesh numbers are 50, 100, 150, 200 and 250 and water was selected as a working fluid. According to the change of mesh number, wick layer, inclination and saturation temperature, capillary pressure, pumping pressure, liquid friction coefficient in wick, vapor friction coefficient, capillary limitation, entrainment limitation, sonic limitation and boiling limitation we analyzed by theoretical design method of a heat pipe. As some results, the capillary limitation in small diameter of heat pipe is largely affected by mesh number and wick layer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09a
• /
• pp.430-431
• /
• 2006

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.

• 한국태양에너지학회:학술대회논문집
• /
• 2008.11a
• /
• pp.220-225
• /
• 2008

Cylindrical stainless-steel/sodium heat pipe for a high-temperature solar thermal application was manufactured and tested for transient and steady-state operations. Two layers of stainless-steel screen mesh wick was inserted as a capillary structure. The outer diameter of the heat pipe was 12.7 mm and the total length was 250 mm. The effective heat transport length, the thermal load, and the operating temperature were varied as thermal transport conditions of the heat pipe. The thermal load was supplied by an electric furnace up to 1kW and the cooling was performed by forced convection of air The effective thermal conductivity and the thermal resistance were investigated as a function of heat flux, heat transport length, and vapor temperature. Typical range of the total effective thermal conductivity was as low as 43,500 W/m K for heat flux of 176.4 kW/$m^2$ and of operating temperature of 1000 K.

• International Journal of Air-Conditioning and Refrigeration
• /
• v.14 no.4
• /
• pp.125-130
• /
• 2006

This study has been performed to investigate the thermal performance of variable conductance heat pipe (VCHP) with screen meshed wick. The active length of condenser section in a VCHP is varied by non-condensible gas, which controls the operating temperature, and the heat capacity of VCHP is controlled by the operating temperature. In this study, numerical analysis of the VCHP based on the diffusion model of non-condensible gas is done for the thermal control performance of VCHP. Water is used as a working fluid and nitrogen as a control non-condensible gas in the copper tube. As a result, the thermal conductance of VCHP has been compared with that of constant conductance heat pipe (CCHP) corresponding to the variation of operating temperature.