Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Fabrication and Characterization of Thermoelectric Thick Film by Using Bi-Te-Sb Powders

  • Yu, Ji-Hun (Powder Materials Research Center, Korea Institute of Machinery and Materials) ;
  • Bae, Seung-Chul (Powder Materials Research Center, Korea Institute of Machinery and Materials) ;
  • Ha, Gook-Hyun (Powder Materials Research Center, Korea Institute of Machinery and Materials) ;
  • Kim, Ook-Jung (Energy Systems Research Center, Korea Institute of Machinery & Materials) ;
  • Lee, Gil-Gun (Division of Materials Science and Engineering, Pukyung National University)
  • Published : 2006.09.24
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Abstract

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.

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