• Journal of Korean Vacuum Science & Technology
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• v.4 no.2
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• pp.41-43
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• 2000

We present a study of exciton relaxation in GaAs/AIGaAs quantum well structures by using time-resolved photoluminescence techniques.03 observed that light-hole exciton has a longer decay time than heavy-hole exciton, which results from the difference of the exciton population factor. We considered the thermal population time to explain the observed exciton dynamics.

• Journal of the Korean Society of Safety
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• v.24 no.2
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• pp.17-22
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• 2009

Thermal stress and elastic creeping stress analysis was conducted by finite element method to simulate start-up process of a boiler header of 500MW standard fossil power plant. Start-up temperature and operating pressure history were simplified from the real field data and they were used for the thermal stress analysis. Two kinds of thermal stress analysis were considered. In the first case only temperature increase was considered and in the second case both of temperature and operating pressure histories were considered. In the first analysis peak stress was occurred during the temperature increase from the room temperature. Hence cracking or fracture may occur at the temperature far below the operating maximum temperature. In the results of the second analysis von Mises stress appeared to be higher after the second temperature increase. This is due to internal pressure increase not due to the thermal stress. When the stress components of radial(r), hoop($\theta$) and longitudinal(z) stress were investigated, compression hoop stress was occurred at inner surface of the stub tube when the temperature increased from room temperature to elevated temperature. Then it was changed to tension hoop stress and increased because of the operating pressure. It was expected that frequent start-up and shut-down operations could cause thermal fatigue damage and cracking at the stub tube hole in the header. Elastic-creeping analysis was also carried out to investigate the stress relaxation due to creep and stabilized stress after considerable elapsed time. The results could be used for assessing the creep damage and the residual life of the boiler header during the long-tenn service.

• Polymer(Korea)
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• v.26 no.6
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• pp.728-736
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• 2002

The thermal and dielectric properties of unsaturated polyester resin system during cure were analyzed under Isothermal conditions. Both $varepsilon$′ and $varepsilon$" decreased and dipole relaxation was observed under isothermal conditions during cure. The ionic conductivity decreased linearly with the conversion according to the Kienle-Rate equation (ln($varepsilon$"$_{ionic}$we$_{0}$)=C$_{r}$$alpha$+C$_{0}$) up to $alpha$=0.15, after which it aparted from the relationship due to the entanglement of polymer chains. The effect of ionic conductivity was revealed to be larger than that of dipole motion during the whole cure through the electrical modulus analysis. Although dielectric motion was analyzed with Debye model, it was observed only at a narrow time region of middle stage of cure. In order to estimate the dielectric properties during the whole cure, the Havriliak-Negami model was considered and modified with the strong effect of ionic conductivity. The changes of $varepsilon$′ and $varepsilon$" were well estimated with this modified Havriliak-Negami model.

• 한국전산유체공학회:학술대회논문집
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• 1999.11a
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• pp.42-47
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• 1999

In this study, we adopt the point symmetric Gauss-Seidel relaxation algorithm to obtain the steady state solution of the Navier-Stokes equations for the thermal and chemical nonequilibrium flow of air. All of the inviscid, viscous flux Jacobians and thermochemical source Jacobians are included in the implicit part Numerical simulation is performed for the thermal and chemical nonequilibrium flow over blunt body and computational results are presented. The convergence history and CPU time of the present computation are compared with the LU-SGS scheme which employs the approximate Jacobians.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.75-79
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• 1993

The Thermally Stimulated Current(TSC) method has been allied to study the influence of the structural change and interface on the electrical properties of epoxy composites. Three DGBA- MeTHPA matrix model samples mixed different ratios arts silica(SiO$_2$) filled sample and silaln treating-filled sample have been studied. Above room temperature, the relaxation mode ${\alpha}$ peak associated with T$\_$g/ has been located at 110$^{\circ}C$. Below glass transition temperature(T$\_$g/), three relaxation modes are observed in all samples : a ${\beta}$ mode situated at 10$^{\circ}C$, a ${\gamma}$ mode located at -40$^{\circ}C$ and a $\delta$mode appeared in -120$^{\circ}C$, which may be due to segmental motion, side chains, substitution and terminal groups. The analysis of its fine structure indicates that constitution of elementary processes is characterized by the activation energy and relaxation time. Also the change of the molecular structure and their thermal motion are compared with the relaxation mode and conduction mechanism in TSC spectra through the dielectric properties and FTIR measurements.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1627-1632
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• 2003

The effect of (1) phonon dispersion in thermal conductivity model and (2) the differentiation of group velocity and phase velocity for Ge is examined. The results show drastic change of thermal conductivity regardless of using same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon is changed by considering more rigorous dispersion model. Holland model underestimates the scattering rate for high frequency TA, so misleading conclusion, i.e. TA is dominant heat transfer mode at high temperature. But the actual reduction of thermal conductivity is much larger than the estimation by Holland model and high frequency TA is no more dominant heat transfer mode. Another heat transfer mechanism may exist for high temperature. Two possible explanations are (1) high frequency LA by Umklapp scattering and (2) optical phonon.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.57-62
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• 2014

Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were also investigated for low-cost and process feasibility of flexible electronics. After annealing at $200^{\circ}C$ for 1 h under various reducing ambient, surface color was changed to red and electrical resistivity was decreased to the level of conductor under formic acid ambient. However, its resistivity was much higher than conventional copper films due to surface crack. In order to reduce the residual film stress after annealing, additional isothermal treatment was inserted before anneal hiring the stress relaxation applied in processes of amorphous materials. As a result, no surface crack was observed and electrical resistivity of $3.4{\mu}{\Omega}cm$ was measured after annealing at $230^{\circ}C$ with stress relaxation while electrical resistivity of $7.4{\mu}{\Omega}cm$ was observed after normal annealing without relaxation. The effect of stress relaxation was also confirmed by observing surface crack after decreasing the relaxation time to 0 min.

• Journal of Korean Society of Forest Science
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• v.112 no.4
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• pp.544-553
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• 2023

The purpose of this study was to reveal the thermal comfort and physiological and psychological effects of spending time in broad-leaved forests in suumer. Thirty-one university students (with an average age of 21.4 ± 2.1 years) participated in the study, and a within-subjects experimental design methodology was used. The participants moved to an experimental site (with a crown closure of 76.6%) or a control site (25.9%), sat on a chair to eliminate the impact of movement, and rested for 5 minutes with closed eyes. At this time, thermal comfort, heart rate variability, heart rate, and forehead temperature were continuously measured. After that, blood pressure and pulse rate were measured, and a subjective evaluation was conducted. As a result, spending time at an experimental site showed a statistically significant decrease in the predicted mean vote and the percentage of dissatisfied values, enhancement of parasympathetic nerve activity, decrease of forehead temperature, diastolic blood pressure, heart rate, pulse rate, and improvement of personal thermal sensation (thermal sensation vote and comfort sensation vote). In conclusion, it was found that a forest with high crown closure reduces thermal stress and induces physiological and psychological relaxation.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.28 no.1
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• pp.71-78
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• 1992

Zr-4 used for a cladding and an end plug of reactor component has creep deformation under operation at high temperature. Creep is regarded as the time dependent deformation of a material under constant applied stress. Although the major source of the deformation of zirconium component in water-cooled reactors is irradiation creep, the thermal creep may give a rise to significant deformation in reactor component especially at relatively high temperatures and at various constant stresses, and therefore it must be predicted accurately. Stress relaxation is the time dependent change of stress at constant strain and it is a process related intimately to creep. In this paper, the creep behavior and stress relaxation of Zr-4 is examined at the temperature of 50$0^{\circ}C$ that is 40% of the absolute melting temperature of Zr-4 under the stress below yield stress and under the various constant strains. The results obtained are summarized as follows: 1) With an increase of stress, the steady state creep rate increases and the creep rupture time decreases. 2) The steady state creep rate $\varepsilon$(%/s) for the stress $\sigma$sub(c) (kgf/mm super(2)) of Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 are in accord with Norton's model equation($\varepsilon$=K$\sigma$ sub(c) super (n)). The constants of materials computed are as follows: K=3.9881$\times$10 super(-5), n=1.9608 3) The rupture time T sub(r) (hr) decreases linearly with the increase of stress on the log-log scaled graph. The empirical equations computed for Zr-4 are in accord with Bailey's model equation (T sub(r)=K sub(1)$\sigma$sub(c) super(m)). The constants of materials computed are as follows: K sub(1)=1.2875$\times$10 super(16), m=-3.467 4) It seems clear that the strain could be quantitatively dependent on the high temperature creep properties such as creep stress, rupture time, steady state creep rate and total creep rate. It is found that these relationships are linear on the log-log graph. 5) In stress relaxation test, as the critical constant strain that can be allowed to the specimen is larger, stress relaxation becomes more rapid, and as the constant strain is smaller, the stress relaxation becomes slower.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.481-484
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• 2004

A form of measured temperature distribution to estimate condition of a electrical apparatus is a absolute reference for condition of the apparatus, time rate of transition, and difference between reference and currently temperature. Because passive thermography which has not injection of external thermal stimulation shows difference of temperature being on surface of a structure and temperature difference between the structure and back ground, the result could apply only to estimation or monitor for condition of terminal relaxation and overload related with temperature rising. However, a thermal flow in active thermography is differently generated by structure and condition of surface and subsurface. This paper presents the nondestructive testing using the properties and includes the results by heat injection and cooling to the apparatus. The buried discontinuity of subsurface could be detected by these techniques.