1 |
B. -J. Kim, "Reliability of Metal Electrode for Flexible Electronics", J. Microelectron. Packag. Soc., 20(4), 1 (2013).
과학기술학회마을
DOI
|
2 |
D. Kim, S. Jeong, B. K. Park and J. Moon, "Direct Writing of Silver Conductive Patterns: Improvement of Film Morphology and Conductance by Controlling Solvent Compositions", App. Phy. Lett., 89(26), 264101 (2006).
DOI
ScienceOn
|
3 |
D. Huang, F. Liao, S. Molesa, D. Redinger and V. Subramanian, "Plastic-compatible Low Resistance Printable Gold Nanoparticle Conductors for Flexible Electronics", J. Electrochem. Soc., 150(7), G412 (2003).
DOI
ScienceOn
|
4 |
J. Perelaer, B. -J. de Gans and U. S. Schubert, "Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks", Adv. Mater., 18(16), 2101 (2006).
DOI
ScienceOn
|
5 |
J. R. Greer and R. A. Street, "Mechanical Characterization of Solution-derived Nanoparticle Silver Ink Thin Films", J. Appl. Phys., 101(10), 103529 (2007).
DOI
|
6 |
P. F. Blazdell, J. R. G. Evans, M. J. Edirisinghe, P. Shaw and M. J. Binstead, "The Computer Aided Manufacture of Ceramics Using Multilayer Jet Printing", J. Mater. Sci. Lett., 14(22), 1562 (1995).
DOI
|
7 |
B. J. de Gans, P. C. Duineveld and U. S. Schubert, "Inkjet Printing of Polymers: State of The Art and Future Developments", Adv. Mater., 16(3), 203 (2004).
DOI
ScienceOn
|
8 |
D. Pede, G. Serra and D. De Rossi, "Microfabrication of Conducting Polymer Devices by Ink-jet Stereolithography", Mater. Sci. Eng: C., 5(3), 289 (1998).
DOI
|
9 |
H. Sirringhaus, T. Kawase, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu and E. P. Woo, "High-resolution Inkjet Printing of All-polymer Transistor Circuits", Science, 290(5499), 2123 (2000).
DOI
ScienceOn
|
10 |
S. Magdassi and M. B. Moshe, "Patterning of Organic Nanoparticles by Ink-jet Printing of Microemulsions", Langmuir, 19(3), 939 (2003).
DOI
|
11 |
G. Harsanyi and G. Inzelt, "Comparing Migratory Resistive Short Formation Abilities of Conductor Systems Applied in Advanced Interconnection SYSTEMS", Microelectron. Reliab., 41(2), 229 (2001).
DOI
ScienceOn
|
12 |
X. -F. Tang, Z. -G. Yang and W. -J. Wang, "A Simple Way of Preparing High-concentration and High-purity Nano Copper Colloid for Collective Ink in Inkjet Printing Technology", Colloids and Surfaces A: Physicochem. Eng. Aspects, 360(2), 99 (2010).
DOI
|
13 |
B. K. Park, S. Jeong, D. Kim, J. Moon, S. Lim and J. S. Kim, "Synthesis and Size Control of Monodisperse Copper Nanoparticles by Polyol Method", J. Colloid and Interface Sci., 311(2), 417 (2007).
DOI
ScienceOn
|
14 |
B. Lee, Y. kim, S. Yang, I. Jeong and J. Moon, "A Low-Cure-temperature Copper Nano Ink for Highly Conductive Printed Electrodes", Current Appl. Phys., 9(2), e157 (2009).
DOI
ScienceOn
|
15 |
B. K. Park, D. Kim, S. Jeong, J. Moon and J. S. Kim, "Direct Writing of Copper Conductive Patterns by Ink-jet Printing", Thin Solid Films, 515(19), 7706 (2007).
DOI
ScienceOn
|
16 |
A. Agrawal, V. Kumar, B. D. Pandey and K. K. Sahu, "A Comprehensive Review on The Hydro Metallurgical Process for The Production of Nickel and Copper Powders by Hydrogen Reduction", Mater. Res. Bull., 41(4), 879 (2006).
DOI
ScienceOn
|
17 |
K. S. Kim, J. M. Koo, J. W. Joung, B. S. Kim and S. B. Jung, "Electrical Characteristics of Copper Circuit using Inkjet Printing", J. Microelectron. Packag. Soc., 17(3), 43 (2010).
과학기술학회마을
|
18 |
Y. Lee, J. Choi, K. J. Lee, N. E. Scott and D. Kim, "Large-scale Synthesis of Copper Nanoparticles by Chemically Controlled Reduction for Applications of Inkjet-printed Electronics", Nanotechnology, 19(41), 415604 (2008).
DOI
ScienceOn
|
19 |
K. Nagase, Y. Zheng, Y. Kodama and J. Kakuta, "Dynamic Study of The Oxidation State of Copper in The Course of Carbon Monoxide Oxidation over Powdered CuO and Cu2O", J. Catal., 187(1), 123 (1999).
DOI
|
20 |
P. J. Soininen, K. -E. Elers, V. Saanila, S. Kaipio, T. Sajavaara and S. Haukka, "Reduction of Copper Oxide Film to Elemental Copper", J. Electrochem. Soc., 152(2), G122 (2005).
DOI
ScienceOn
|
21 |
J. -K. Jung, S. -H. Choi, I. Kim, H. C. Jung, J. Joung and Y. -C. Joo, "Characteristics of Mcrostructure and Electrical Resistivity of Inkjet-printed Nanoparticle Silver Films Annealed under Ambient Air", Phil. Mag., 88(3), 339 (2008).
DOI
|
22 |
G. Grimvall, J. Kubat and M. Rigdahl, "A Theory of Stress Relaxation", Mater. Sci. Eng., 27(1), 45 (1977).
DOI
|
23 |
I. -M. Park, J. -K. Jung, S. -O. Ryu, K. -J. Choi, B. -G. Yu, Y. -B. Park, S. -M. Han and Y. -C. Joo, "Thermomechanical Properties and Mechanical Stresses of Ge2Sb2Te5 Films in Phase-change Random Access Memory", Thin Solid Films, 517(2), 848 (2008).
DOI
ScienceOn
|
24 |
S. -M. Yi, J. -H. Lee, N. -R. Kim, S. Oh, S. Jang, D. Kim, J. Joung and Y. -C. Joo, "Improvement of Electrical and Mechanical Properties of Ag NanopartiCulate Films by Controlling the Oxygen Pressure", J. Electrochem. Soc., 157(12), K254 (2010).
DOI
|
25 |
A. Witvrouw and F. Spaepen, "Viscosity and Elastic Constants of Amorphous Si and Ge", J. Appl. Phys., 74(12), 7154 (1993).
DOI
|