• Applied Science and Convergence Technology
• /
• 제25권6호
• /
• pp.149-153
• /
• 2016

Thermal oxidation has significant potential for use in synthesizing metal-oxide nanostructures from metallic materials. However, this method has limited applicability to the synthesis of multi-morphology NiO from Ni foil. Techniques consisting of mechanical and chemical approaches were used to pre-treat the Ni foil (prior to oxidation) to promote the formation of nanowires and nanoplates on the NiO layer. These morphologies were realized on the Ni foils scratched by sand paper and a knife, respectively, and subsequently heat-treated at $500^{\circ}C$ for 24 h. Small nanowires (diameter: <10 nm) formed on the Ni foil treated by absolute $HNO_3$ and then oxidized at $500^{\circ}C$ for 24 h. The formation of various morphologies (on the pre-treated Ni foil), which differ from that formed in the case of pristine Ni foil after oxidation, may be attributed to the surface melting phenomenon that occurs during the nucleation process.

• Bulletin of the Korean Chemical Society
• /
• 제29권12호
• /
• pp.2525-2527
• /
• 2008

• 한국결정성장학회지
• /
• 제24권4호
• /
• pp.151-157
• /
• 2014

The degradation mechanisms of thermal barrier coatings (TBCs) were investigated in different thermal fatigue condition in terms of microstructural analyses. The isothermal and cyclic oxidation tests were conducted to atmospheric plasma sprayed-TBCs on NIMONIC 263 substrates. The delamination occurred by the oxide layer formation at the interface, the Ni/Cr-based oxide was formed after Al-based oxide layer grew up to ${\sim}10{\mu}m$ in the isothermal condition. In the cyclic oxidation with dwell time, the failure occurred earlier (500 hr) than in the isothermal oxidation (900 hr) at same temperature. The thickness of Al-based oxide layer of the delaminated specimen in the cyclic condition was ${\sim}4{\mu}m$ and the interfacial cracks were observed. The acoustic emission method revealed that the cracks generated during the cooling step. It was considered that the specimens were prevented from the formation of the Al-based oxide by cooling treatment, and the degradation mode in the cyclic test was dominantly interfacial cracking by the difference of thermal expansion coefficients of the coating layers.

• 전자공학회논문지D
• /
• 제34D권2호
• /
• pp.38-45
• /
• 1997

본 논문에서는 반도체 소자 제조 공정 중, 염산화 공정 시에 발생하는 스트레스에 따른 산화막의 3차원적 거동을 시뮬레이션하였다. 이를 위해, 이동하는 3차원 경계면에서의 노드 생성 및 제거 기능을 지는 3차원 적응 메쉬 생성기를 개발하였고, 지배 방정식을 유한요소법(finite element method)으로 이산화시켜 수치 해석적으로 해를 구하는, 스트레스 효과를 고려한 3차원 산화 시뮬레이터를 개발하였다. 본 연구에서는 열산화 공정에 의한 산화막의 3차원적 거동을 관찰하기 위하여, 섬구조(island) 및 공구조(hole structure)의 산화막 성장을 <100> 실리콘 기판에 대하여 $1000^{\circ}C$, 60분간 습식 산화 조건에서 시뮬레이션하였다. 초기 산화막의 두께는 $300\AA$, 질화막의 두께는 $2,000\AA$으로 가정하였다. 마스크의 형태에 따라 코너에서의 새부리(bird's beak)형태가 변하는데, 코너에서의 효과는 마스크 형태에 따라 산화제의 확산이 다른 영역에 비해 감소하거나 증가하는 영향이 주된 이유이지만, 스트레스에 의해 그 영향이 더 커짐을 확인하였다. 섬구조에서는 compressive 스트레스에 의해 코너 부근에서 산화가 감소하는 결과를 가져오고, 공구조에서는 tensile 스트레스로 인해 산화가 더 증가하는 결과를 보임을 확인하였다.

• 전자공학회논문지A
• /
• 제32A권3호
• /
• pp.68-77
• /
• 1995

Characteristics of electron cyclotron resonance (ECR) plasma thermal oxide grown at low-temperature have been investigated. The effects of several process parameters such as substrate temperature, microwave power, gas flow rate, and process pressure on the growth rate of the oxide have been also investigated. It was found that the plasma density, reactive ion species, is strongly related to the growth rate of ECR plasma oxied. It was also found that the plasma density increases with microwave power while it decreases with decreasing O2 flow rate. The oxidation time dependence of the oxide thichness showed parabolic characteristics. Considering ECR plasma thermal oxidation at low-temperature, the linear as well as parabolic rate constants calculated from fitting data by using the Deal-Grove model was very large in comparison with conventional thermal oxidation. The ECR plasma oxide grown on (100) crystalline-Si wafer exhibited good electrical characteristics which are comparable to those of thermal oxide: fixed oxide charge(N$_{ff}$)= 7${\times}10^{10}cm^{-2}$, interface state density(N$_{it}$)=4${\times}10^[10}cm^{-2}eV^{-1}$, and breakdown field > 8MV/cm.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
• /
• pp.407-410
• /
• 2002

Thermal oxidations of 3C-SiC thin-films grown on Si(100) by APCVD(atmospheric pressure chemical vapor deposition) were carried out. The oxidations of 3C-SiC were performed at $1100^{\circ}C$ for 1~6 hr in wet and dry $O_2$ ambient, respectively. Ellipsometry was used to determine the thickness and index of refraction of oxide films. The oxide thickness vs. the oxidation time follows the general relationship used for the thermal oxidation of Si. The surface roughness was analyzed by using AFM(atomic force microscopy). The surface roughness of oxidized 3C-SiC was rougher than before oxidation. The thermal oxide was found to be $SiO_2$ by XPS(X-ray photoelectron spectroscopy) analysis. Auger analysis showed them to be homogeneous with near stoichiometric composition.

• 한국재료학회지
• /
• 제27권4호
• /
• pp.221-228
• /
• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Food Science and Biotechnology
• /
• 제16권6호
• /
• pp.981-987
• /
• 2007

Effects of lignan compounds (sesamol, sesamin, and sesamolin) extracted from roasted sesame oil on the autoxidation at $60^{\circ}C$ for 7 days and thermal oxidation at $180^{\circ}C$ for 10 hr of sunflower oil were studied by determining conjugated dienoic acid (CDA) contents, p-anisidine values (PAV), and fatty acid composition. Contents of lignan compounds during the oxidations were also monitored. ${\alpha}$-Tocopherol was used as a reference antioxidant. Addition of lignan compounds decreased CDA contents and PAY of the oils during oxidation at $60^{\circ}C$ or heating at $180^{\circ}C$, which indicated that sesame oil lignans lowered the autoxidation and thermal oxidation of sunflower oil. Sesamol was the most effective in decreasing CDA formation and hydroperoxide decomposition in the auto- and thermo-oxidation of oil, and its antioxidant activity was significantly higher than that of ${\alpha}$-tocopherol. Sesamol, sesamin, and sesamolin added to sunflower oil were degraded during the oxidations of oils, with the fastest degradation of sesamol. Degradation of sesamin and sesamolin during the oxidations of the oil were lower than that of ${\alpha}$-tocopherol. The results strongly indicate that the oxidative stability of sunflower oil can be improved by the addition of sesamol, sesamin, or sesamolin extracted from roasted sesame oil.

• 한국전기전자재료학회논문지
• /
• 제17권1호
• /
• pp.21-26
• /
• 2004

Ultra-thin silicon dioxides were grown on p-type(100) oriented silicon employing rapid thermal dry oxidation technique at the temperature range of 850∼1050 $^{\circ}C$. The growth rate of the ultra-thin film was fitted well with tile model which was proposed recently by da Silva ＆ Stosic. The capacitance-voltage, current-voltage, characteristics were used to study the electrical properties of these thin oxides. The minimum interface state density around the midgap of the MOS capacitor having oxide thickness of 111.6 $\AA$ derived from the C-V curve was ranged from 6 to 10${\times}$10$^{10}$ /$\textrm{cm}^2$eV.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.459-459
• /
• 2011

Graphene has many fascinating material properties such as high electron mobility, high optical transparency, excellent thermal conductivity, superior Young's modulus, etc. Several studies have recently found that single-layer graphene is chemically more reactive than few-layer graphene when supported on silicon dioxide substrates with sub-nm roughness. In this study, we have investigated the influence of substrates on chemical reactivity of graphene. Morphology and thermal oxidation behavior of graphene on atomically flat mica substrates were studied by atomic force microscopy (AFM) and Raman spectroscopy compared to graphene on SiO2/Si substrates. Notably, oxidation of single-layer graphene proceeds more slowly on mica than SiO2/Si. Detailed analysis led to a conclusion that deformation along the out-of-plane direction enhances reactivity of graphene.