• 제목/요약/키워드: thermal impact

검색결과 804건 처리시간 0.026초

ESG를 위한 반도체 패키지 기술 트렌드 (Technology Trends of Semiconductor Package for ESG )

  • 서민석
    • 마이크로전자및패키징학회지
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    • 제30권3호
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    • pp.35-39
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    • 2023
  • ESG는 많은 기업에게 기업 가치를 향상시키고, 지속 경영이 가능하게 하는 큰 지침이 되고 있다. 그 중에서도 환경(Environment)은 기술적 관점의 접근이 필요하다. 환경 오염을 줄이거나 방지하고, 에너지를 절감하는 것은 기술적인 해법이 필요하기 때문이다. 반도체 패키지 기술은 반도체 패키지의 본연의 역할인 칩의 보호, 전기/기계적 연결, 열 방출 등을 잘 하기 위해 개발 및 발전해 왔는데, 이에 따라 열 방출 효과 향상, 전기적/기계적 특성 향상, 칩을 보호하는 신뢰성 향상, 적층 및 소형화, 그러면서 비용절감을 위한 기술들이 개발되고 발전해 왔다. 그 중에서도 열 방출 기술은 열효율을 높이고, 냉각을 위한 에너지 소모를 작게 하며, 전기적 특성 향상 기술도 저전력 사용과 에너지 소모를 줄이는 효과를 만들어서 환경에도 영향을 주었다. 또한 재사용이나 재료 소모를 줄이는 기술은 환경 오염을 줄이게 되며, 특히 환경에 유해한 물질들에 대해 대체하는 기술들은 환경 개선에 기여하게 된다. 본 논문에서는 이러한 환경 오염 방지 및 개선을 위한 반도체 패키지 기술들의 트렌드를 정리하였다.

Zn-Al-Mg 합금의 압출 시 미세조직 변화에 관한 연구 (Study on the Microstructure Evolution during Extrusion of Zn-Al-Mg alloy)

  • 서위걸;;이희남;양동주;박순균;최시훈
    • 소성∙가공
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    • 제32권6호
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    • pp.344-351
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    • 2023
  • The use of Zn-Al-Mg alloy coatings for enhancing the corrosion resistance of steel sheets is gaining prominence over traditional Zn coatings. There is a growing demand for the development of thermal spray wires made from Zn-Al-Mg alloys, as a replacement for the existing wires produced using Al and Zn. This is particularly crucial to secure corrosion resistance and durability in the damaged areas of coated steel sheets caused by deformation and welding. This study focuses on the casting and extrusion processes of Zn-2Al-1Mg alloy for the fabrication of such spray wires and analyzes the changes in microstructure during the extrusion process. The Zn-2Al-1Mg alloy, cast in molds, was subjected to a heat treatment at 250 ℃ for 3 hours prior to extrusion. The extrusion process was carried out by heating both the material and the mold up to 300 ℃. Microstructural analysis was conducted using FE-SEM and EDS to differentiate each phase. The mechanical properties of the cast specimen were evaluated through compression tests at temperatures ranging from 200 to 300 ℃, with strain rates of 0.1 to 5 sec-1. Vickers hardness testing was utilized to assess the inhomogeneity of mechanical properties in the radial direction of the extruded material. Finite Element Analysis (FEA) was employed to understand the inhomogeneity in stress and strain distribution during extrusion, which aids in understanding the impact of heterogeneous deformation on the microstructure during the process.

몰드 두께에 의한 팬 아웃 웨이퍼 레벨 패키지의 Warpage 분석 (Analysis of Warpage of Fan-out Wafer Level Package According to Molding Process Thickness)

  • 문승준;김재경;전의식
    • 반도체디스플레이기술학회지
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    • 제22권4호
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    • pp.124-130
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    • 2023
  • Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

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파크골프 참여자의 열정이 운동만족 및 행동의도에 미치는 영향 (The effect of park golf participants' passion on exercise satisfaction and behavioral intention)

  • 임영삼
    • 한국응용과학기술학회지
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    • 제40권5호
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    • pp.1081-1091
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    • 2023
  • 본 연구는 열정을 갖고 파크골프에 참여함으로써 느끼는 운동만족 및 행동의도의 인과 관계를 살펴보았다. 대상은 파크골프 참여자 189명을 대상으로 하였고, 조사 대상은 2023년 7월 20일 ~ 9월 14일까지 세종시에 거주하면서 파크골프를 하고 있는 대상자를 모집단으로 선정하였다. 자료분석은 SPSS 21.0을 활용하였다. 또한, 빈도분석과 신뢰도 분석, 탐색적 요인분석, 상관분석 및 다중회귀분석을 통하여 각 요인 간의 영향 관계를 살펴보았다. 연구결과 첫째, 열정은 운동만족에 정적 영향을 미쳤다. 둘째, 열정은 행동의도에 정적 영향을 미치는 것으로 확인되었다. 셋째, 운동만족은 행동의도에 정적 영향을 미쳤다. 이는 파크골프의 열적적 감정이 만족감과 행동의도를 높여주는 역할을 한다는 의미로써 참여자의 열정이 저하되지 않는 환경을 만들어 준다면 파크골프 저변확대에 영향을 미칠 것이다.

금속 적층제조에서의 서포트 설계변수에 따른 강성 분석 (Stiffness analysis according to support design variables in the metal additive manufacturing process)

  • 문인용;송영환
    • 한국결정성장학회지
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    • 제33권6호
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    • pp.268-275
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    • 2023
  • 적층제조 기술의 지속적 발전 및 적용 산업의 확대에 따라 제조된 금속 부품의 전반적인 품질 및 성능을 향상 시키기 위한 서포트 최적 설계 수행은 필수적이 되었다. 따라서 본 논문은 금속 적층제조 공정에서의 서포트 설계변수가 서포트 강성에 미치는 영향을 분석하였다. 대표적인 서포트 설계변수인 서포트 종류, 간격, 침투 깊이를 다양하게 적용한 인장시편을 적층제조를 통해 제작하고, 이에 대한 인장시험을 통해 변위-하중 곡선의 차이를 분석하였다. 그 결과를 바탕으로 서포트 설계변수가 지지 강성에 미치는 영향에 대한 포괄적인 분석을 제시하였다. 이를 통해 적층제조 공정 중 금속 부품의 열 변형을 억제하기 위한 서포트 최적설계 수행을 효과적으로 할 수 있을 것이라 기대된다.

4H-SiC PiN 다이오드의 깊은 준위 결함에 따른 전기적 특성 분석 (Analysis of Electrical Characteristics due to Deep Level Defects in 4H-SiC PiN Diodes)

  • 이태희;박세림;김예진;박승현;김일룡;김민규;임병철;구상모
    • 한국재료학회지
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    • 제34권2호
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    • pp.111-115
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    • 2024
  • Silicon carbide (SiC) has emerged as a promising material for next-generation power semiconductor materials, due to its high thermal conductivity and high critical electric field (~3 MV/cm) with a wide bandgap of 3.3 eV. This permits SiC devices to operate at lower on-resistance and higher breakdown voltage. However, to improve device performance, advanced research is still needed to reduce point defects in the SiC epitaxial layer. This work investigated the electrical characteristics and defect properties using DLTS analysis. Four deep level defects generated by the implantation process and during epitaxial layer growth were detected. Trap parameters such as energy level, capture-cross section, trap density were obtained from an Arrhenius plot. To investigate the impact of defects on the device, a 2D TCAD simulation was conducted using the same device structure, and the extracted defect parameters were added to confirm electrical characteristics. The degradation of device performance such as an increase in on-resistance by adding trap parameters was confirmed.

Novel Algorithms for Early Cancer Diagnosis Using Transfer Learning with MobileNetV2 in Thermal Images

  • Swapna Davies;Jaison Jacob
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제18권3호
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    • pp.570-590
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    • 2024
  • Breast cancer ranks among the most prevalent forms of malignancy and foremost cause of death by cancer worldwide. It is not preventable. Early and precise detection is the only remedy for lowering the rate of mortality and improving the probability of survival for victims. In contrast to present procedures, thermography aids in the early diagnosis of cancer and thereby saves lives. But the accuracy experiences detrimental impact by low sensitivity for small and deep tumours and the subjectivity by physicians in interpreting the images. Employing deep learning approaches for cancer detection can enhance the efficacy. This study explored the utilization of thermography in early identification of breast cancer with the use of a publicly released dataset known as the DMR-IR dataset. For this purpose, we employed a novel approach that entails the utilization of a pre-trained MobileNetV2 model and fine tuning it through transfer learning techniques. We created three models using MobileNetV2: one was a baseline transfer learning model with weights trained from ImageNet dataset, the second was a fine-tuned model with an adaptive learning rate, and the third utilized early stopping with callbacks during fine-tuning. The results showed that the proposed methods achieved average accuracy rates of 85.15%, 95.19%, and 98.69%, respectively, with various performance indicators such as precision, sensitivity and specificity also being investigated.

Reduction of Leakage Current and Enhancement of Dielectric Properties of Rutile-TiO2 Film Deposited by Plasma-Enhanced Atomic Lay er Deposition

  • Su Min Eun;Ji Hyeon Hwang;Byung Joon Choi
    • 한국재료학회지
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    • 제34권6호
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    • pp.283-290
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    • 2024
  • The aggressive scaling of dynamic random-access memory capacitors has increased the need to maintain high capacitance despite the limited physical thickness of electrodes and dielectrics. This makes it essential to use high-k dielectric materials. TiO2 has a large dielectric constant, ranging from 30~75 in the anatase phase to 90~170 in rutile phase. However, it has significant leakage current due to low energy barriers for electron conduction, which is a critical drawback. Suppressing the leakage current while scaling to achieve an equivalent oxide thickness (EOT) below 0.5 nm is necessary to control the influence of interlayers on capacitor performance. For this, Pt and Ru, with their high work function, can be used instead of a conventional TiN substrate to increase the Schottky barrier height. Additionally, forming rutile-TiO2 on RuO2 with excellent lattice compatibility by epitaxial growth can minimize leakage current. Furthermore, plasma-enhanced atomic layer deposition (PEALD) can be used to deposit a uniform thin film with high density and low defects at low temperatures, to reduce the impact of interfacial reactions on electrical properties at high temperatures. In this study, TiO2 was deposited using PEALD, using substrates of Pt and Ru treated with rapid thermal annealing at 500 and 600 ℃, to compare structural, chemical, and electrical characteristics with reference to a TiN substrate. As a result, leakage current was suppressed to around 10-6 A/cm2 at 1 V, and an EOT at the 0.5 nm level was achieved.

Bio-based Polypropylene Composites: Plausible Sustainable Alternative to Plastics in Automotive Applications

  • Ji Won Kwon;Sarbaranjan Paria;In Soo Han;Hyeok Jee;Sung Hwa Park;Sang Hwan Choi;Jeong Seok Oh
    • Elastomers and Composites
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    • 제59권2호
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    • pp.51-63
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    • 2024
  • Polypropylene (PP) is a commodity plastic that is widely used owing to its cost-effectiveness, lightweight nature, easy processability, and outstanding chemical and thermomechanical characteristics. However, the imperative to address energy and environmental crises has spurred global initiatives toward a circular economy, necessitating sustainable alternatives to traditional fossil-fuel-derived plastics. In this study, we conducted a series of comparative investigations of bio-based polypropylene (bio-PP) blends with current PP of the same and different grades. An extrusion-based processing methodology was employed for the bio-PP composites. Talc was used as an active filler for the preparation of the composites. A comparative analysis with the current petroleum-based PP indicated that the thermal properties and tensile characteristics of the bio-PP blends and composites remained largely unaltered, signifying the feasibility of bio-PP as a potential substitute for the current PP. To achieve a higher Young's modulus, elongation at break (EAB), and melt flow index (MFI), we prepared different composites of PP of different grades and bio-PP with varying talc contents. Interestingly, at higher biomass contents, the composites exhibited higher MFI and EAB values with comparable Young's moduli. Notably, the impact strengths of the composites with various biomass and talc contents remained unaltered. In-depth investigations through surface analysis confirmed the uniform dispersion of talc within the composite matrix. Furthermore, the moldability of the bio-PP composites was substantiated by comprehensive rheological property assessments encompassing shear rate and shear viscosity. Thus, from these outcomes, the fabricated bio-PP-based composites could be an alternative to petroleum-based PP composites for sustainable automobile applications.

Modification of Substrate and Fermentation Process to Increase Mass and Customize Physical Properties of Lacticaseibacillus rhamnosus and Limosilactobacillus fermentum Exopolysaccharides in Kefir Grain

  • Dandy Yusuf;Raden Haryo Bimo Setiarto;Andi Febrisiantosa;Angga Maulana Firmansyah;Taufik Kurniawan;Ahmad Iskandar Setiyawan;Rina Wahyuningsih;Tri Ujilestari;Satyaguna Rakhmatulloh;Heni Rizqiati
    • 한국미생물·생명공학회지
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    • 제52권2호
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    • pp.152-162
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    • 2024
  • The microbial starter used to produce kefir beverages, kefir grain, contains a microbial exopolysaccharide called kefiran. Kefir grain consisting of water-insoluble polysaccharides, proteins, and fats, which can be applied as a multi-functional biopolymer. The mass of kefir grain can increase in the fermentation process of Kefir, but it is considered very slow. The purpose of this research is to study the impact of ammonium sulfate supplementation and yeast extract on reconstituted skim milk to increase the mass kefir grain and physical properties of kefiran. Results showed that the ammonium sulfate-supplemented substrate increased the mass of kefir grain by 547% in 14 days, with the condition that the substrate must be renewed every 2 days. Refreshing the substrate is considered one of the important factors. Supplementation on substrate did not appear to affect the viability of bacterial and yeast cells. Kefir grain produced from supplemented substrate also yields better thermal stability properties and has more functional groups than without supplementation. Two Lacticaseibacillus rhamnosus (RAL27 and RAL43) and one Limosilactobacillus fermentum (RAL29) were found to produce EPS. The three isolates also showed good skim milk fermentation ability after purification from kefir grain. The kefir grain produced in this study has the potential for wider application. This study also showed that kefir grain can be adjusted in quantity and quality through fermentation substrate engineering.