• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 추계학술대회 논문집
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• pp.1096-1101
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• 2008

Concrete is shown the time dependent behavior after placing. The time dependent behavior of normal strength concrete that is used usually in present, were already examined closely lots of parameters by several investigators. however, high strength concrete is that the material characteristics are not definite and the experimental data are lacking. So, The goal of this study is to propose the material characteristics models, and to develop the routine of the time dependent behavior above 60 MPa. The thermal conductivity, the specific heat, the moisture diffusion coefficient, and the surface coefficient are proposed the suitable models through the parametric study. The structural element is used the 8-node solid element. The matrix equation is developed considering the transient heat transfer and moisture diffusion theory. The application of the time dependent behavior is used the finite differential method.

• 한국산학기술학회논문지
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• 제20권9호
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• pp.532-540
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• 2019

본 연구에서는 PET 초극세사의 분산염료 등온흡착염색에서 염료의 분배계수와 표준친화력의 시료 굵기에 따른 영향성과 확산계수의 온도 의존성을 알아보았다. 염색은 해도형 초극세사 0.2, 0.06, 0.01 dpf 급과 일반 극세사 0.5 dpf 급을 anthraquinone계 염료 C.I. Disperse Blue 56으로 무한염욕조건 100, 110, 120, $130^{\circ}C$에서 등온염색을 진행하였다. 그 결과 Nernst type과 잘 일치하는 분산염료의 시료 굵기별 등온흡착곡선을 얻었다. 해도형 PET 초극세사의 해성분 용출은 NaOH 수용액을 이용한 PET 알칼리 가공을 통하여 이루어졌다. 염색에 사용된 분산염료는 흡광도 측정을 토대로 고온에서 장시간 염색 진행시 안정성이 확보됨을 확인하였다. 초극세사의 염색은 결론적으로 동일 온도에서 굵기가 감소함에 따라 시료 표면적의 증가로 인해 분배계수 및 표준친화력은 증가하였다. 모든 굵기에서 염색현상은 발열반응이기 때문에 염색 온도가 증가할수록 분배계수가 감소하였고 이에 따라 표준친화력은 동일 굵기에서 대략 9% 감소하였다. 또한 굵기가 감소할수록 동일 온도에서 최대로 염착되는 염료 농도가 증가하였고, 염색 과정에서 발생되는 염색열은 0.01 dpf 초극세사에서 -10.64 kcal/mol로 가장 낮게 나타났다. 시료 굵기가 감소할수록 염액과 접촉 가능한 표면적은 증가하였지만, 그에 반해 초극세사 사이의 공간이 조밀하게 되어 염액이 원활히 이동하기 어렵게 된다. 그 때문에 확산계수는 시료의 굵기가 극세화될수록 감소하였다. 이러한 경향성은 고온으로 갈수록 더 뚜렷하게 나타났으며. 시료의 굵기가 증가할수록 확산계수의 온도 의존성은 $130^{\circ}C$에서 40%까지 증가하였다.

• Bulletin of the Korean Chemical Society
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• 제28권10호
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• pp.1689-1696
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• 2007

Equilibrium molecular dynamics (EMD) simulations are used to evaluate the transport coefficients of argonkrypton mixtures at two liquid states (state A: 94.4 K and 1 atm; state B: 135 K and 39.5 atm) via modified Green-Kubo formulas. The composition dependency of the volume at state A obeys close to the linear model for ideal liquid mixture, while that at state B differs from the linear model probably due to the high pressure. The radial distribution functions for the Ar-Kr mixture (x = 2/3) show a mixing effect: the first peak of g11 is higher than that of g(r) for pure Ar and the first peak of g22 is lower than that of g(r) for pure Kr. An exponential model of engineering correlation for diffusion coefficient (D) and shear viscosity (η) is superior to the simple linear model for ideal liquid mixtures. All three components of thermal conductivity (λpm, λtm, and λti) at state A and hence the total thermal conductivity decrease with the increase of x. At state B, the change in λtm is dominant over those in λpm and λti, and hence the total thermal conductivity decrease with the increase of x.

• 대한기계학회논문집B
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• 제38권4호
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• pp.347-355
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• 2014

전자장치들의 소형화 및 박형화가 됨에 따라 전자장치의 수명과 직결되는 열적문제가 중요해지고 있다. 열적문제를 해결하기위해 열확산과 단열을 통한 열적 안정성 연구가 필요하다. 허니컴 샌드위치 평판은 이방성의 열전도계수를 갖는다. 허니컴 샌드위치 평판이 적용된 시스템에 대해 온도분포와 열변형을 해석하기 위하여 열 및 탄성 물성치가 필요하다. 본 연구에서는 허니컴 코어의 크기, 두께 그리고 구성된 재료에 따라 허니컴 샌드위치 평판의 물성치가 변하기 때문에 허니컴 샌드위치 평판의 열전도계수, 열팽창계수, 탄성계수, 전단탄성계수, 푸아송비와 같은 열 및 탄성 물성치를 예측하였다.

• Nuclear Engineering and Technology
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• 제40권3호
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• pp.233-238
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• 2008

This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

• 한국항행학회논문지
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• 제16권4호
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• pp.657-664
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• 2012

용질분자를 용매를 통하여 전달시키는 기법중의 하나는 확산에 의한 것이다. 이러한 기전은 각개 용질분자의 열운동에 의한 것이다. 유체는 정지해 있는 상태로서 용질 전달의 핵심기전은 농도차에 의하여 결정된다. 인체 내에서 각종 하전 이온을 포함한 입자나 분자들은 체내의 농도차에 의해서 또는 외부 전계에 의해서 영향을 받아 고농도에서 저농도쪽으로 확산되어간다. 이러한 현상은 픽이 제안한 확산에 관한 제1법칙과 제2법칙에 의하여 정량적으로 전개할 수 있다. 본 논문에서는 체내의 물질이 확산되는 과정을 픽의 법칙을 이용하여 해석하고 그것을 실례를 통하여 구현하였다. 각 시간별 공간상의 확산현상에서 확산계수가 클 때는 시간이 경과함에 따라 발생지점의 농도는 현저히 낮아지고 그 농도가 주위로 급속히 확산되어감을 알 수 있었다. 그러나 어느 정도의 시간이 경과되면 그 농도의 감소는 매우 약해진다.

• 한국세라믹학회지
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• 제24권5호
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• pp.484-490
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• 1987

Diffusion coupling experiment was done to study expansion of body and soild reaction in BaCO3-TiO2 system. Specimen of BaCO3 and TiO2 was formed with Pt-mark's method. Each specimen was fired at interval of 25℃ from 900℃ to 1000℃ for 2hrs. After that, specimen was fixed with resin and polished. Product layers of specimen were observed with SEM and EDS. The result were following; 1. Diffusion component is Ba2+, which diffuse toward TiO2. 2. Large crack between layer of BaCO3 and Ba2TiO4 was generated because of difference of thermal expansion coefficient. 3. Ba2TiO4 is formed to TiO2 body by the reaction of BaTiO3 and BaO and its structure is very porous. 4. BaTiO3 changes immediately to Ba2TiO4 by the reaction of BaO. But BaTiO3 which formed by the reaction of TiO2 and Ba2TiO4 exsists as layer because the diffusion distance of Ba2+ is far.

• Nuclear Engineering and Technology
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• 제54권8호
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• pp.2801-2808
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• 2022

The synergistic effect of ZrC nanoparticle pining and Re solution in W matrix on the thermal stability of tungsten was studied by investigating the evolution of the microstructure, hardness and tensile properties after annealing in a temperature range of 1000-1700 ℃. The results of metallography, electron backscatter diffraction pattern and Vickers micro-hardness indicate that the rolled W-1wt%Re-0.5 wt% ZrC alloy has a higher recrystallization temperature (1600 ℃-1700 ℃) than that of the rolled pure W (1200 ℃), W-0.5 wt%ZrC (1300 ℃), W-0.5 wt%HfC (1400-1500 ℃) and W-K-3wt%Re alloy fabricated by the same technology. The molecular dynamics simulation results indicated that solution Re atoms in W matrix can slow down the self-diffusion of W atoms and form dragging effect to delay the growth of W grain, moreover, the diffusion coefficient decrease with increasing Re content. In addition, the ZrC nanoparticles can pin the grain boundaries and dislocations effectively, preventing the recrystallization. Therefore, synergistic effect of solid solution Re element and dispersed ZrC nanoparticles significantly increase recrystallization temperature.

• Bulletin of the Korean Chemical Society
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• 제12권3호
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• pp.315-322
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• 1991

In a recent $paper^1$ we reported equilibrium (EMD) and non-equilibrium (NEMD) molecular dynamics simulations of liquid argon using the Green-Kubo relations and NEMD algorithms to calculate the thermal transport coefficients-the self-diffusion coefficient, shear viscosity, and thermal conductivity. The overall agreement with experimental data is quite good. In this paper the same technique is applied to calculate the thermal transport coefficients of liquid water at 298.15 K and 1 atm using TIP4P model for the interaction between water molecules. The EMD results show difficulty to apply the Green-Kubo relations since the time-correlation functions of liquid water are oscillating and not decaying rapidly enough except the velocity auto-correlation function. The NEMD results are found to be within approximately ${\pm}$30-40% error bars, which makes it possible to apply the NEMD technique to other molecular liquids.

• Journal of Welding and Joining
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• 제19권3호
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.