• Journal of the Korean Society for Heat Treatment
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• v.11 no.2
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• pp.111-120
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• 1998

The effects of chemical composition and thermal cycling on the martensitic transformation characteristics in Cu-rich, equiatomic and Zr-rich CuZr binary alloys have been studied by calorimetry. Only martensite could be indentified in equiatomic $Cu_{49.9}Zr_{50.1}$ alloy, while $Cu_{10}Zr_7$ and $CuZr_2$ intermetallic compounds as well as martensite were formed by rapid cooling from the melts in Cu-rich $Cu_{52.2}Zr_{47.5}$ alloy and Zr-rich $Cu_{48.4}Zr_{51.6}$ alloy, respectively. The $M_s$ temperature of $Cu_{49.9}Zr_{50.1}$ was $156^{\circ}C$ but those of $Cu_{52.5}Zr_{47.5}$ and $Cu_{48.4}Zr_{51.6}$ alloys, being $109^{\circ}C$ and $138^{\circ}C$, were lower than that of equiatomic $Cu_{49.9}Zr_{50.1}$ alloy. In all the alloys, the $M_s$ temperature has fallen but the $A_s$ temperature has risen, resulting in widening of the transformation hysteresis with thermal cycling. The anomalous characteristics in the transformation temperature are due to the presence of the intermetallic compounds i.e. $Cu_{10}Zr_7$ and $CuZr_2$ formed by an eutectoid reaction during thermal cycling in the temperature range between $-100^{\circ}C$ < $T_c$ < $400^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.259-265
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• 2016

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.677-684
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• 2004

Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep model was implemented into a finite element program (ABAQUS) to simulate creep response of solder. Based on the finite element results, thermal fatigue reliability was predicted by using various fatigue life prediction models. Also, the effects of ramp conditions, dwelling time, and solder joint-embedding materials on the reliability were investigated under the thermal cycling conditions of the Telcordia schedule (-40∼75$^{\circ}C$).

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1318-1319
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• 2011

In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.

• Journal of Korean Society for Quality Management
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• v.51 no.4
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• pp.735-749
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• 2023

Purpose: The purpose of this study is to derive solutions and prevent similar cases from occurring by analyzing the causes of cracks found in temperature cycling tests of rocket motor. Methods: By combining the results of the current state confirmation test, non-destructive test, domestic and foreign rocket motor comparison test, cutting test, and adhesion test according to the number of times to apply mold release agent, a Cause and Effect Diagram analysis was performed to derive the cause of cracks. Results: Through this study, 26 factors that could cause cracking in rocket motors during temperature cycling tests were identified. Through various additional test results, a total of five causes were identified, including chemical and structural design of the joint between the propellant and stress relief insert, omission of procedure in the manufacturing procedures, natural aging due to temperature, and load accumulation due to temperature changes. The fundamental cause was confirmed to be insufficient consideration of the release properties of the propellant and stress relief insert. Conclusion: During the design process, it was confirmed that this could be solved by structurally or chemically designing the insert so that it does not combine with the propellant, or by applying a mold release agent during the manufacturing process.

• International Journal of Reliability and Applications
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• v.15 no.2
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• pp.125-150
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• 2014

Accelerated life tests (ALTs) are extensively used to determine the reliability of a product in a short period of time. Test units are subject to elevated stresses which yield quick failures. ALT can be carried out using constant-stress, step-stress, progressive-stress, cyclic-stress or random-stress loading and their various combinations. An ALT with linearly increasing stress is ramp-stress test. Much of the previous work on planning ALTs has focused on constant-stress, step-stress, ramp-stress schemes and their various combinations where the stress is generally increased. This paper presents an optimal design of ramp soak-stress ALT model which is based on the principle of Thermal cycling. Thermal cycling involves applying high and low temperatures repeatedly over time. The optimal plan consists in finding out relevant experimental variables, namely, stress rates and stress rate change points, by minimizing variance of reliability function with pre-specified mission time under normal operating conditions. The Burr type XII life distribution and time-censored data have been used for the purpose. Burr type XII life distribution has been found appropriate for accelerated life testing experiments. The method developed has been explained using a numerical example and sensitivity analysis carried out.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.751-752
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• 2011

• Journal of the Korean Society for Heat Treatment
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• v.4 no.3
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• pp.31-38
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• 1991

Effect of thermal cycling on shape memory effect and stabilization of austenite was investigated in Fe-21%Mn alloy. The thermal cyclic treatment was carried out with two types, room temperature${\leftrightarrow}215^{\circ}C$ and room temperature${\leftrightarrow}260^{\circ}C$. In case of the room temperature${\leftrightarrow}215^{\circ}C$, the SME was rapidly increased up to 3 cycles and maintained nearly constant value regardless of further cycles. In case of the room temperature${\leftrightarrow}260^{\circ}C$, however, the SME was increased with increasing the thermal cycle up to 5 cycles and decreased gradually with further cycle. The variation of the ${\varepsilon}$ martensite volume pet with the thermal cycle was in good agreement with the variation of the SME. Therefore, the change of the SME due to the cyclic treatment was explained with the change of the ${\varepsilon}$ martensite content. As the thermal cycle was increased, the $M_s$ temperature was decreased, and the $A_s$ and $A_f$ temperatures were increased, respectively.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.924-927
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• 2007

In this study, adaptation of two-way shape memory effect of SMA wire to the actuator is examined. Therefore the SMA characteristics which are training, material properties, response time at different thermal cycling rates are tested. During training, permanent deformation is accumulated till a certain number of cycle and then saturated. The amount of two-way strain is unchangeable over all cycle and the slope of strain(or stress)-temperature curve is slower as the increase of applied stress. The rate effect is observed resulted from the thermal distribution which heating profile differs from cooling as thermal cycling time. Using the estimated SMA properties, an experimental test for the simple smart wing is performed.