• 제목/요약/키워드: thermal creep(strain)

검색결과 85건 처리시간 0.028초

감소인자에 의한 토목합성보강재의 장기안정성 평가 (Assessment of Long-Term Stability of Geosynthetic Reinforcement Materials by Reduction Factors)

  • 전한용;목문성;조성호;차동환;김성철;안주환
    • 한국지반신소재학회논문집
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    • 제4권3호
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    • pp.11-19
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    • 2005
  • 2가지 형태의 지오그리드의 장기안정성을 평가하였다. 멤브레인 연신형 지오그리드는 지수함수 형 인장특성을 나타내었으며 섬유형 지오그리드는 파단점에 근접할수록 빠른 인장특성의 증가를 나타내었다. 단기 가속 크리프 시험은 섬유형 지오그리드에는 실시되었지만 멤브레인 연신형 지오그리드의 경우 열적특성 때문에 실온에서만 실시 하였다. 멤브레인 연신형 지오그리드의 크리프 변형률은 인장시험에 의한 극한 인장변형률보다 크게 나타났다. 섬유형 지오그리드의 크리프 변형에 의한 감소인자는 멤브레인 연신형 지오그리드보다 작게 나타났다. 이 결과로부터 섬유형 지오그리드가 멤브레인 연신형 지오그리드보다 크리프 변형에 안정성이 있음을 알 수 있었다.

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Failure simulation of nuclear pressure vessel under LBLOCA scenarios

  • Eui-Kyun Park;Jun-Won Park;Yun-Jae Kim;Kukhee Lim;Eung-Soo Kim
    • Nuclear Engineering and Technology
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    • 제56권7호
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    • pp.2859-2874
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    • 2024
  • This paper presents the finite element deformation and failure simulation of a typical Korean high-power reactor vessel under a severe accident characterized by large break loss of coolant (LBLOCA) with in-vessel retention of molten corium through external reactor vessel cooling (IVR-ERVC) conditions. Temperature distributions calculated using Modular Accident Analysis Program Version 5 (MAAP5) as thermal boundary conditions were used, and ABAQUS thermal and structural analyses were performed. After full ablation, the temperature of the inner surface in the thinnest section remained high (920 ℃), but the stress remained relatively low (less than 6 MPa). At the outer surface, the stress was as high as 250 MPa; however, the resulting plastic strain was small owing to the low temperature of 200 ℃. Variations in stress, inelastic strain, and temperature with time in the thinnest section suggest that the plastic and creep strains are saturated owing to stress relaxation, resulting in low cumulative damage. Thus, the lower head of the vessel can maintain its structural integrity under LBLOCA with IVR-ERVC conditions. The sensitivity analysis of internal pressure indicates the occurrence of failure in the thinnest section at an internal pressure >9.6 MPa via local necking followed by failure due to high stresses.

플립 칩 패키지 솔더의 탄소성 거동과 크립 해석 (Elastoplastic Behavior and Creep Analysis of Solder in a FC-PBGA Package)

  • 최남진;이봉희;주진원
    • 마이크로전자및패키징학회지
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    • 제17권2호
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    • pp.21-28
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    • 2010
  • 본 논문에서는 온도 사이클이 진행되는 동안 비선형 거동과 크립 거동을 보이는 FC-PBGA 패키지 솔더볼의 변형거동을 알아보기 위하여 시간에 종속하는 거동을 적용 시킬 수 있는 점소성 모델과 크립 모델에 대하여 유한요소해석을 수행하였다. 유한요소해석 결과의 신뢰성을 평가하기 위하여 무아레 간섭계를 이용하여 온도변화에 따른 열변형 실험을 수행하였다. 전체적인 굽힘변위는 Anand 모델과 변형률 분리 모델 모두 실험결과와 잘 일치하였으나 솔더볼의 변형률은 Anand 모델의 경우 큰 차이를 보이고 변형률 분리 모델의 경우 상당히 일치하는 계산결과를 얻었다. 따라서 본 논문에서는 변형률 분리 모델을 이용하여 시간에 종속하는 FC-PBGA 패키지 솔더볼의 크립 거동을 검토하였다. 솔더를 포함한 패키지에 온도변화가 생길 때 고온에서는 시간이 지남에 따라 크립 거동에 의해 솔더의 응력이 점차 완화되는 현상을 나타내고 있음을 알 수 있었다.

EVALUATION AND TEST OF A CRACK INITIATION FOR A 316 SS CYLINDRICAL Y-JUNCTION STRUCTURE IN A LIQUID METAL REACTOR

  • Park, Chang-Gyu;Kim, Jong-Bum;Lee, Jae-Han
    • Nuclear Engineering and Technology
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    • 제38권3호
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    • pp.293-300
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    • 2006
  • A liquid metal reactor (LMR) operated at high temperatures is subjected to both cyclic mechanical loading and thermal loading; thus, creep-fatigue is a major concern to be addressed with regard to maintaining structural integrity. The Korea Advanced Liquid Metal Reactor (KALIMER), which has a normal operating temperature of $545^{\circ}C$ and a total service life time of 60 years, is composed of various cylindrical structures, such as the reactor vessel and the reactor baffle. This study focuses on the creepfatigue crack initiation for a cylindrical Y-junction structure made of 316 stainless steel (SS), which is subjected to cyclic axial tensile loading and thermal loading at a high-temperature hold time of $545^{\circ}C$. The evaluation of the considered creep-fatigue crack initiation was carried out utilizing the ${\sigma}_d$ approach of the RCC-MR A16 guide, which is the high-temperature defect assessment procedure. This procedure is based on the total accumulated strain during the service time. To confirm the evaluated result, a high-temperature creep-fatigue structural test was performed. The test model had a circumferential through wall defect at the center of the model. The defect front of the test model was investigated after the $100^{th}$ cycle of the testing by utilizing a metallurgical inspection technique with an optical microscope, after which the test result was compared with the evaluation result. This study shows how creep-fatigue crack initiation for a high-temperature structure can be predicted with conservatism per the RCC-MR A16 guide.

Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation

  • Kim, Cheolgyu;Oh, Chulmin;Choi, Yunhwa;Jang, Kyung-Oun;Kim, Taek-Soo
    • 마이크로전자및패키징학회지
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    • 제25권3호
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    • pp.21-30
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    • 2018
  • Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

통일구성방정식을 이용한 구조물의 열점소성 거동에 관한 해석 (Analysis of Thermo-Viscoplastic Behavior of Structures Using Unified Constitutive Equations)

  • 윤성기;이주진
    • 대한기계학회논문집
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    • 제15권1호
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    • pp.190-200
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    • 1991
  • 본 연구에서는 고온에 노출되는 열-점소성 거동의 해석을 위해 소성유동, 크 리프, 응력풀림(stress relaxation)등의 거동을 동시에 다룰 수 있는 통일구성방정식 모델에 대해 논하고 적절한 모델을 선정한다. 이 모델은 미소변형이론에 근거한 것 이므로 구조물의 거동을 소변형률(small strain)과 소회전(small rotation)의 범위내 로 가정하여 해석한다.선정된 모델에 대해서 시간변화율 형태의 방정식으로부터 유 한요소법을 통한 수치화와 사용된 구성방정식을 효율적으로 처리할 수 있는 수치해석 법상의 알고리듬을 제안한다. 제안된 알고리즘을 사용하여 유한요소법 전산코드를 적상하고, 작성된 코드를 이용하여 고온에서 하중을 받는 단순보와 국부적으로 심한 가열을 받는 구조물에 적용하여 고전적인 구성방정식으로 복합적인 해석이 어려웠던 열-점소성 거동을 효과적으로 해석할 수 있음을 보인다. 본 논문은 응력해석에 주안 점을 두었으므로 열해석에 관한 상세한 논의는 가급적 생략하기로 한다.

고온분위기에서 열응력을 받는 부재의 수명예측에 관한 연구 (A study of life predictions on very high temperture thermal stress)

  • 김성청
    • 한국생산제조학회지
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    • 제7권6호
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    • pp.117-125
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    • 1998
  • The paper attempts to estimate the incubation time of a cavity in the interface between a power law creep particle and an elastic matrix subjected to a uniaxial stress. Since the power law creep particle is time dependent, the stresses in the interface relax. The volume free energy associated with Helmholtz free energy includes strain energies caused by applied stress and dislocations piled up in interface(DPI). The energy due to DPI is found by modifying the result of Dundurs and Mura[4]. The volume free energies caused by both applied stress and DPI are a function of the cavity size(r) and elapsed time(t) and arise from stress relaxation in the interface. Critical radius $r^*$ and incubation time $t^*$ to maximise Helmholtz free energy is found in present analysis. Also, kinetics of cavity formation are investigated using the results obtained by Riede [7]. The incubation time is defined in the analysis as the time required to satisfy both the thermodynamic and kinetic conditions. Through the analysis it is found that 1) strain energy caused by the applied stress does not contribute significantly to the thermodynamic and kinetic conditions of a cavity formation, 2) in order to satisfy both thermodynamic and kinetic conditions, critical radius $r^*$ decreases or holds constant with increase of the time until the kinetic condition(eq. 2.3) is satisfied. there for the cavity may not grow right after it is formed, as postulated by Harris [15], and Ishida and Mclean [16], 3) the effects of strain rate exponent (m), material constant $\sigma$0, volume fraction of the particle to matrix(f)and particle size on the incubation time are estimated using material constants of the copper as matrix.

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열하중과 굽힘 하중 조건에서의 솔더조인트 피로 특성 비교연구 (A Comparative study on the solder joint fatigue under thermal and mechanical loading conditions)

  • 김일호;이순복
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제7권2호
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    • pp.45-55
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    • 2007
  • In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

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Alumina/SiC 나노복합재료에서의 잔류 열응력 완화거동에 관한 연구 (Thermal Residual Stress Relaxation Behavior of Alumina/SiC Nanocomposites)

  • Choa, Y.H.;Niihara, K.;Ohji, T.;Singh, J.P.
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2002년도 춘계학술강연 및 발표대회
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    • pp.11-11
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    • 2002
  • Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

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2$\frac {1}{4}$ Cr-1Mo강 압력용기 Nozzle 용접이음부의 재열균열에 관한 수치해석적 연구 (A Numerical Analysis Study on the Reheating crack around Welded Joint of Pressure Vessel with 2$\frac {1}{4}$Cr-1Mo Steel)

  • 김종명
    • 한국해양공학회지
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    • 제14권1호
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    • pp.88-94
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    • 2000
  • Recently various pressure vessels like an atomic reactor and plant facilities become more larger and are needed to bear in both very high temperature and pressure condition. And in making such a high pressure vessels the amount of annual usage of 2 $\frac {1}{4}$ Cr-1Mo steels which are predominant to resist high temperature high pressure and corrosive circumstances are increasing. But despite of this advantage of 2 $\frac {1}{4}$Cr-1Mo steel. when PWHT(post welding heat treatment) is carried out lots of reheating cracks are occur. In this reason it is strongly needed to study and examine the mechanical behavior of welded joints through welding to PWHT process. So in this study welded nozzle of pressure vessel where reheat cracks are frequently occur are selected for analysis the crack-occurrence mechanism.

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