• Title/Summary/Keyword: thermal circuit

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Investigation of a Thermal Analysis Method for IPMSM in Railway Vehicles (철도차량용 영구자석 동기전동기의 열해석 기법 연구)

  • Park, Chan-Bae;Lee, Hyung-Woo;Lee, Byung-Song
    • Journal of the Korean Society for Railway
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    • v.16 no.2
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    • pp.99-103
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    • 2013
  • In this paper, research on the thermal analysis method is reported for the characterization of heat generation while operating an Interior Permanent Magnet Synchronous Motor (IPMSM) for railway vehicles. Efficient cooling of the heat generated in the IPMSM is important because the excessive heat generated from the winding, core and permanent magnets increases the difficulty of continuously operating an IPMSM over long time periods. Therefore, in this study, in order to analyze the heat generation characteristics of the IPMSM for advanced research in the application of IPMSMs to cooling devices, the heat transfer coefficients for each component of the IPMSM were derived and the thermal equivalent circuit was configured to perform thermal analyses. Finally, the validation of the suggested thermal analysis method was performed through comparison with the heat experimental data of an IPMSM prototype.

A study on PCB Heat Dissipation Characteristics of High Density Power Supply for E-mobility (E-mobility용 고밀도 전원장치의 PCB방열 특성해석에 관한 연구)

  • Kim, Jong-Hae
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.528-533
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    • 2021
  • This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

The Optimum Design According to Type Analysis of the Safety Circuit Design (LED 조명의 안전회로설계 Type분석에 따른 최적설계)

  • Jang, In-Hyeok;Kim, Jeong-Ho;Lim, Hong-Woo;Oh, Geun-Tae;Choi, Youn-Ok
    • Journal of Applied Reliability
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    • v.16 no.4
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    • pp.331-337
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    • 2016
  • Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

Analysis of a Parasitic-Diode-Triggered Electrostatic Discharge Protection Circuit for 12 V Applications

  • Song, Bo Bae;Lee, Byung Seok;Yang, Yil Suk;Koo, Yong-Seo
    • ETRI Journal
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    • v.39 no.5
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    • pp.746-755
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    • 2017
  • In this paper, an electrostatic discharge (ESD) protection circuit is designed for use as a 12 V power clamp by using a parasitic-diode-triggered silicon controlled rectifier. The breakdown voltage and trigger voltage ($V_t$) of the proposed ESD protection circuit are improved by varying the length between the n-well and the p-well, and by adding $n^+/p^+$ floating regions. Moreover, the holding voltage ($V_h$) is improved by using segmented technology. The proposed circuit was fabricated using a $0.18-{\mu}m$ bipolar-CMOS-DMOS process with a width of $100{\mu}m$. The electrical characteristics and robustness of the proposed ESD circuit were analyzed using transmission line pulse measurements and an ESD pulse generator. The electrical characteristics of the proposed circuit were also analyzed at high temperature (300 K to 500 K) to verify thermal performance. After optimization, the $V_t$ of the proposed circuit increased from 14 V to 27.8 V, and $V_h$ increased from 5.3 V to 13.6 V. The proposed circuit exhibited good robustness characteristics, enduring human-body-model surges at 7.4 kV and machine-model surges at 450 V.

Optimization of Thermal Performance in Nano-Pore Silicon-Based LED Module for High Power Applications

  • Chuluunbaatar, Zorigt;Kim, Nam-Young
    • International Journal of Internet, Broadcasting and Communication
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    • v.7 no.2
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    • pp.161-167
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    • 2015
  • The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

EFFICIENT THERMAL MODELING IN DEVELOPMENT OF A SPACEBORNE ELECTRONIC EQUIPMENT

  • Kim Jung-Hoon;Koo Ja-Chun
    • Bulletin of the Korean Space Science Society
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    • 2004.10b
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    • pp.270-273
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    • 2004
  • The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

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Thermal Management Study of PEMFC for Residential Power Generation (가정용 연료전지 시스템의 열관리 해석)

  • Yu, Sang-Seok;Lee, Young-Duk;Ahn, Kook-Young
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2839-2844
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    • 2008
  • A PEMFC(proton exchange membrane fuel cell) is a good candidate for residential power generation to be cope with the shortage of fossil fuel and green house gas emission. The attractive benefit of the PEMFC is to produce electric power as well as hot water for home usage. Typically, thermal management of vehicular PEMFC is to reject the heat from the PEMFC to the ambient air. Different from that, the thermal management of PEMFC for RPG is to utilize the heat of PEMFC so that the PEMFC can be operated at its optimal efficiency. In this study, dynamic thermal management system is modeled to understand the response of the thermal management system during dynamic operation. The thermal management system of PEMFC for RPGFC is composed of two cooling circuits, one for controling the fuel cell temperature and the other for heating up the water for home usage. Dynamic responses and operating strategies of the PEMFC system are investigated during load changes.

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A Study of High-Power Dissipation Parts Modeling for Spacecraft PCB Thermal Analysis (위성 PCB 열해석을 위한 고 전력소산 소자의 모델링 연구)

  • 이미현;장영근;김동운
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.34 no.6
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    • pp.42-50
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    • 2006
  • This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

Thermodynamic Performance Analysis of a Cogeneration System in Series Circuit Using Regenerative ORC (재생 유기랭킨사이클을 이용한 직렬 열병합 발전 시스템의 열역학적 성능 특성)

  • KIM, KYOUNG HOON;PARK, BAE DUCK;KIM, MAN-HOE
    • Journal of Hydrogen and New Energy
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    • v.26 no.3
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    • pp.278-286
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    • 2015
  • This paper presents the analytical results of the thermodynamic performance characteristics for a cogeneration system using regenerative organic Rankine cycle (ORC) driven by low-grade heat source. The combined heat and power cogeneration system consists of a regenerative superheated ORC and an additional process heater in a series circuit. Eight working fluids of R134a, R152a, propane, isobutane, butane, R245fa, R123, and isopentane are considered for the analysis. Special attention is paid to the effect of turbine inlet pressure on the system performance such as thermal input, net power and useful heat productions, electrical, thermal, and system efficiencies. The results show a significant effect of the turbine inlet pressure and selection of working fluid on the thermodynamic performance of the system.

Electronic Circuit System of a Portable Rl Gauge for Compaction Control (성토다짐용 휴대용 Rl 계기의 전자회로 시스템)

  • 김기준
    • Journal of Korea Society of Industrial Information Systems
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    • v.4 no.2
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    • pp.32-38
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    • 1999
  • In this study, an objection is to develop a electronic circuit of a gauage using radioisotope for compaction control to be needed at public works The developed gauage makes use of radioisotope with the activity exempted from domestic atomic law and consists of measuring circuits for gamma-rays and thermal neutrons, a high voltage supply unit and a microprocessor. To obtain meaningful numbers of pulse counts, parallel five and tow circuits are provided for gamma-rays and thermal neutrons, respectively. Also, to minimize effects of natural environmental radiation and electrical noise, circuits are electrostatically shielded and pulses made by ripples are eliminated by taking frequency of high voltage supplied to the circuit and pulse height of ripples into consideration One-chip microprocessor is applied to process various counts, results are stored, Enough and meaningful numbers of pulses are counted with the prototype gauage for compaction control.

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