• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.29-36
• /
• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.11 s.353
• /
• pp.8-13
• /
• 2006

Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• Polymer(Korea)
• /
• v.24 no.6
• /
• pp.829-836
• /
• 2000

In order to recyle the FRP waste from SMC bathtubs and rock-crush sludge obtained as a byproduct of stones, the composite consisting of the FRP and rock-crush sludge and the unsaturated polyester matrix resin were prepared. To enhance the interfacial bonding force between the reinforcements and the matrix resin, the rock-crush sludge was treated with silane coupling agent, ${\gamma}$-methacryloxypropyltrimethoxysilane (${\gamma}$-MPS) and their mechanical properties and interface phenomena were examined. The flexural modulus of the composite containing 10 wt% rock-crush powder treated with 3 wt% silane coupling agent showed the maximum value. And also the initial thermal degradation temperature of composites were in the range of 352~359$^{\circ}C$. From these results, we observed that the weight loss of composites was almost constant regardless of the concentration of silane coupling agent. It is confirmed that the interface of the composites containing filler treated with ${\gamma}$-MPS was improved in that there were no pull-out phenomena between the reinforcement and matrix resin.

• Applied Microscopy
• /
• v.31 no.2
• /
• pp.117-128
• /
• 2001

DMF is not a good solvent for PVA. There is no solvent-PVA interaction such as H-bonding. DMF/PVA makes a UCST system. DMF/PVA makes a gel through crystallization-induced gelation. X-ray, thermal analysis, and other experimental proofs are presented. The gelation rate was faster at low temperature. Small addition of PEG increased the rate of gelation, but urea decreased the rate. SEM showed the phase demixing process very clearly. In the early stage of gelation, only phase demixing was occurring at a low rate. Hence, no holes appear in the early stage photographs. As demixing proceeded further, the holes began to appear and the sizes became bigger. DMF phase remains many holes after vaporization and PVA phase constitute the matrix phase.

• The Journal of Advanced Prosthodontics
• /
• v.12 no.4
• /
• pp.181-188
• /
• 2020

PURPOSE. The effect of core design on the fracture resistance of zirconia-lithium disilicate (LS2) bilayered crowns for anterior teeth is evaluated by comparing with that of metal-ceramic crowns. MATERIALS AND METHODS. Forty customized titanium abutments for maxillary central incisor were prepared. Each group of 10 units was constructed using the same veneer form of designs A and B, which covered labial surface to approximately one third of the incisal and cervical palatal surface, respectively. LS2 pressed-on-zirconia (POZ) and porcelain-fused-to-metal (PFM) crowns were divided into "POZ_A," "POZ_B," "PFM_A," and "PFM_B" groups, and 6000 thermal cycles (5/55 ℃) were performed after 24 h storage in distilled water at 37 ℃. All specimens were prepared using a single type of self-adhesive resin cement. The fracture resistance was measured using a universal testing machine. Failure mode and elemental analyses of the bonding interface were performed. The data were analyzed using Welch's t-test and the Games-Howell exact test. RESULTS. The PFM_B (1376. 8 ± 93.3 N) group demonstrated significantly higher fracture strength than the PFM_A (915.8 ± 206.3 N) and POZ_B (963.8 ± 316.2 N) groups (P<.05). There was no statistically significant difference in fracture resistance between the POZ_A (1184.4 ± 319.6 N) and POZ_B groups (P>.05). Regardless of the design differences of the zirconia cores, fractures involving cores occurred in all specimens of the POZ groups. CONCLUSION. The bilayered anterior POZ crowns showed different fracture resistance and fracture pattern according to the core design compared to PFM.

• Polymer(Korea)
• /
• v.35 no.2
• /
• pp.124-129
• /
• 2011

Wood plastic composites (WPCs) are attracting a lot of interest recently. In this study, wood flour/polyethylene (PE) composites panels comprised of a coupling agent and nanoclay were prepared by melt-blending followed by compression molding. Five maleic anhydride grafted polyethylene (MAPE) coupling agents were tested, and the best choice and its optimum content were determined. The mechanical properties of the WPCs were measured by UTM, and the thermal properties were measured by TGA, DMA, DSC, and TMA. Adding just a small amount (1 phr) of organoclay made the tensile and flexural strength and the crystallinity of the WPC somewhat increase and the storage modulus and dimensional stability of the WPC largely increase. SEM images showed that the coupling agent drastically improved wood flour/PE interfacial bonding. Selecting the best coupling agent optimized content and adding a small amount of organoclay resulted in a high performance wood flour/PE composite.

• Korean Journal of Materials Research
• /
• v.20 no.8
• /
• pp.434-438
• /
• 2010

The selenization process has been a promising method for low-cost and large-scale production of high quality CIGS film. However, there is the problem that most Ga in the CIGS film segregates near the Mo back contact. So the solar cell behaves like a $CuInSe_2$ and lacks the increased open-circuit voltage. In this study we investigated the Ga distribution in CIGS films by using the $Ga_2Se_3$ layer. The $Ga_2Se_3$ layer was applied on the Cu-In-Ga metal layer to increase Ga content at the surface of CIGS films and to restrict Ga diffusion to the CIGS/Mo interface with Ga and Se bonding. The layer made by thermal evaporation was showed to an amorphous $Ga_2Se_3$ layer in the result of AES depth profile, XPS and XRD measurement. As the thickness of $Ga_2Se_3$ layer increased, a small-grained CIGS film was developed and phase seperation was showed using SEM and XRD respectively. Ga distributions in CIGS films were investigated by means of AES depth profile. As a result, the [Ga]/[In+Ga] ratio was 0.2 at the surface and 0.5 near the CIGS/Mo interface when the $Ga_2Se_3$ thickness was 220 nm, suggesting that the $Ga_2Se_3$ layer on the top of metal layer is one of the possible methods for Ga redistribution and open circuit voltage increase.

• Korean Journal of Materials Research
• /
• v.23 no.10
• /
• pp.580-585
• /
• 2013

To observe the formation of defects at the interface between an oxide semiconductor and $SiO_2$, ZnO was prepared on $SiO_2$ with various oxygen gas flow rates by RF magnetron sputtering deposition. The crystallinity of ZnO depends on the characteristic of the surface of the substrate. The crystallinity of ZnO on a Si wafer increased due to the activation of ionic interactions after an annealing process, whereas that of ZnO on $SiO_2$ changed due to the various types of defects which had formed as a result of the deposition conditions and the annealing process. To observe the chemical shift to understand of defect deformations at the interface between the ZnO and $SiO_2$, the O 1s electron spectra were convoluted into three sub-peaks by a Gaussian fitting. The O 1s electron spectra consisted of three peaks as metal oxygen (at 530.5 eV), $O^{2-}$ ions in an oxygen-deficient region (at 531.66 eV) and OH bonding (at 532.5 eV). In view of the crystallinity from the peak (103) in the XRD pattern, the metal oxygen increased with a decrease in the crystallinity. However, the low FWHM (full width at half maximum) at the (103) plane caused by the high crystallinity depended on the increment of the oxygen vacancies at 531.66 eV due to the generation of $O^{2-}$ ions in the oxygen-deficient region formed by thermal activation energy.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.29 no.10 s.241
• /
• pp.1298-1306
• /
• 2005

In this paper, Part II, we realized the Serpentine Laminating Micromirer (SLM) which was proposed in the accompanying paper, Part I, by means of the injection molding process in mass production. In the SLM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms of splitting/recombination and chaotic advection by the successive arrangement of 'F'-shape mixing units in two layers. Mold inserts for the injection molding process of the SLM were fabricated by SU-8 photolithography and nickel electroplating. The SLM was realized by injection molding of COC (cyclic olefin copolymer) with the fabricated mold inserts and thermal bonding of two injection molded COC substrates. To compare the mixing performance, a T-type micromixer was also fabricated. Mixing performances of micromixers were experimentally characterized in terms of an average mixing color intensity of a pH indicator, phenolphthalein. Experimental results show that the SLM has much better mixing performance than the I-type micromixer and chaotic mixing was successfully achieved from the SLM over the wide range of Reynolds number (Re). The chaotic micromixer, SLM proposed in this study, could be easily integrated in Micro-Total-Analysis- System , Lab-on-a-Chip and so on.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.18 no.1
• /
• pp.15-21
• /
• 2008

SiC has an excellent resistance to oxidation and corrosion, high temperature strength and good thermal conductivity. However, it is difficult to density because of its highly covalent bonding characteristics. Hot-press sintering process was applied to fabricate fully densified SiC ceramics with carbon and boron addition as a sintering additive. The addition of carbon improved the mechanical properties of SiC because it could induce a fine and homogeneous microstructure by the suppression of abnormal growth of SiC grain. Also, the addition of carbon could control the phase transformation of SiC. The phase transformation of 6H to 4H increased with sintering temperature but the addition of carbon decreased that kind of phase transformation.