• 제목/요약/키워드: thermal NO

검색결과 2,439건 처리시간 0.033초

아파트 적용 태양열 난방 및 급탕시스템의 열적 거동에 관한 실험연구 (Experimental Study on the Thermal Behavior of Solar Space Heating & Hot Water System in Apartment)

  • 신우철;백남춘;김종현
    • 한국태양에너지학회 논문집
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    • 제26권4호
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    • pp.127-134
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    • 2006
  • In this paper, an experiment was carried out to investigate the thermal behavior and performance on a solar space heating & hot water system in an apartment. Measurement was continued for 6 months between January 1st 2004 and June 31th 2004. The results show that there is no problem in control and operation in case of connection this system with conventional space heating and hot water system, and that the thermal performance of this system and indoor thermal environment is good.

Thermal and Non-thermal Heat Flow in a Large Crystal Detector for Neutrinoless Double Beta Decay Search

  • Kim, G.B.;Lee, S.J.;Jang, Y.S.;Lee, H.J.;Lee, J.H.;Lee, J.Y.;Lee, M.K.;Yoon, W.S.;Kim, Y.H.
    • Progress in Superconductivity
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    • 제14권2호
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    • pp.87-91
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    • 2012
  • Metallic magnetic calorimeters (MMCs) are one of the most competitive low temperature detector (LTD) readout sensors. They have the advantages of high time resolution, no heat dissipation, and a wide range of operating temperature. We apply MMCs to our neutrinoless double beta decay ($0v{\beta}{\beta}$) search experiment. A $CaMoO_4$ crystal was employed as both a source of $0v{\beta}{\beta}$ and an energy absorber. The crystal was thermally connected to a MMC sensor. We set a simple thermal model for this detector and measured pulse shapes are compared with a numerical solution of the thermal model.

외장형 HEAT PIPE 가 장착된 정지궤도 위성 패널의 열해석 (THERMAL ANALYSIS OF SURFACE HEAT PIPE INSTALLED PANEL OF GEOSTATIONARY SATELLITE)

  • 전형열;김정훈
    • 한국전산유체공학회지
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    • 제11권3호
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    • pp.8-13
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    • 2006
  • The north panel of a geostationary satellite is used as one of the main radiators, on which communication equipment or bus equipment are installed. The thermal control of panel is designed by using embedded heat pipes and surface heat pipes (or external heat pipes) to spread out heat dissipated from equipment all over the radiator evenly and finally to reject the heat to the space through the radiator efficiently. This panel is also divided by several areas based on the operating temperature and dissipation of equipment in order to increase heat rejection capability of radiator. The thermal analysis is carried out for the hot case, Winter Solsitce EOL (End Of Life), in order to validate thermal design of the panel utilized 6 surface heat pipes and 8 embedded heat pipes. The sensitivity studies for the heat pipe failure case and no heat pipe case are performed and compared to its normal state. The heat transport capability of heat pipe is also obtained from these calculations.

타공 디스크에 의한 열적 성능 및 내구성 향상 연구 (Study on Improvement of Thermal Performance and Durability by Disk with Holes)

  • 한문식;조재웅
    • 한국기계가공학회지
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    • 제10권1호
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    • pp.62-66
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    • 2011
  • In this study, the thermal performance of disk can be compared with disk and disk with holes through numerical analysis. The capacity of thermal emission on general disk becomes more than on disk with holes at the distribution of temperature at first and the magnitude of equivalent stress on general disk becomes less than on disk with holes at the distribution of stress. The capacity of thermal emission or the magnitude of thermal deformation on disk with holes becomes less than that on general disk 30 minutes later. The disk with holes is worn less and more durable than general disk. The performance of cooling and braking force at disk and pad can be improved by installing the disk with holes.

냉장고 내벽의 비드가 열변형에 미치는 영향에 관한 연구 (The Study for Bead Effect in Inner Case on Thermal Deformation of Refrigerator)

  • 책건광;조종래;전우진;김주현
    • 한국정밀공학회지
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    • 제28권1호
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    • pp.96-101
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    • 2011
  • Under extreme test or operation condition, refrigerator endures complicated stresses state and thermal bowing deformation arises on the sidewall. Shelf rails designed in the inner case provide increased surface area to permit expansion without bowing, and also increase structural rigidity to resist bowing. In this study, we designed six different shelf patterns of refrigerator model and studied the bead on refrigerator deformation using finite element method (FEM). Analysis result shows that increasing the numbers of beads properly in refrigerator is more helpful to reduce thermal bowing deformation. In addition, the beads would decrease stress on refrigerator sidewall. However, vertical beads have no effect to reduce thermal deformation of the bowing.

철도 차량용 제동디스크의 열응력 해석 (Thermal Stress Analysis for a Ventilated Disk Brake of Railway Vehicles)

  • 이영민;박재실;석창성;이찬우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1617-1621
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    • 2005
  • In this study, as a basic research to improve braking efficiency of a ventilated disk brake, we carried out a thermal stress analysis. From analysis result, we knew that a maximum mechanical stress by braking pressure and friction force is applicable to 5 percent of yield strength and has no effect on a fatigue life's decrease for brake disk material. While, a maximum thermal stress by frictonal heat is applicable to 43 percent of yield strength and locates on a friction surface. So, we have found that a thermal stress is the primary factor of crack initiation on a friction surface of disk brake

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언더필이 적용된 $\mu$p BGA 솔더 접합부의 열피로특성 (Thermal Fatigue Characteristics of $\mu$ BGA Solder Joints with Underfill)

  • 고영욱;김종민;이준환;신영의
    • Journal of Welding and Joining
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    • 제21권4호
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    • pp.25-30
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    • 2003
  • There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

리튬이차전지 난연성 전해액 첨가제로서의 Tris(2,4,6-trimethoxyphenyl)Phosphine의 열적, 전기화학적 특성 (Thermal and Electrochemical Studies of Tris(2,4,6-trimethoxyphenyl)Phosphine as a Flame Retardant Additive for Li-ion Battery)

  • 안세영;김기택;김현수
    • 한국전기전자재료학회논문지
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    • 제21권12호
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    • pp.1130-1134
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    • 2008
  • Thermal and electrochemical properties were discussed with tris(2,4,6-trimethoxyphenyl)Phosphine (TTMPP) as a flame retradant additive for Li-ion battery. TTMPP showed excellent thermal stability with charged cathodes. Addition of 1 wt.% of the additive to the electrolyte improved the thermal stability without damaging the performance of the battery. The oxygne evolution reaction delayed nearly by $60^{\circ}C$. The capacity retention ratio in cycle life tests of the battery with 1 wt.% TTMPP was slightly improved comparing to the no additive cells.

YBCO-Ag 초전도체의 기계적 성질 및 열충격 내성에 대한 평가 (Evaluation of Mechanical Properties and Resistance to Thermal Shock of YBCO-Ag Superconductors)

  • 주진호
    • 한국분말재료학회지
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    • 제5권2호
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    • pp.139-144
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    • 1998
  • We have evaluated the role of Ag additions on the strength, fracture toughness, elastic modulus and resistance to thermal shock of $YBa_2Cu_3O_{7-x}$(YBCO) superconductor. Addition of 10 vol.% Ag improved strength and fracture toughness, whereas, decreased elastic modulus of YBCO. In addition, YBCO-Ag composites improved resistance to thermal shock probably due to enhanced strength, fracture toughness and thermal conductivity as a result of Ag addition. It is to be noted that YBCO-Ag made by mixing with $AgNO_3$ solution showed slightly higher strength, fracture toughness and resistance to thermal shock, compared to that made by mixing with metallic Ag powder. These improvements are believed to be due to the microstructure of more finely and uniformly distributed Ag particles.

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Improvement of stability for organic light emitting devices by thermal and electrical treatment

  • Jung, Jae-Hoon;Lee, Sung-Soo;Choi, Ji-hye;Choi, Joon-Hoo;Chung, Kyu-ha
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.998-1001
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    • 2006
  • Highly stable organic electroluminescent devices have been achieved by treatment of thermal and electrical annealing. We investigate here the performance of theses devices at temperatures and pulse aging. We also demonstrate improved device stability due to thermal and electrical treatment, and the brightness decays at no treatment, thermal only, electrical only and thermal/electrical treatment were 86.6%, 89.5%, 93.0%, and 96.7%, respectively, in the after 150 h of operation driven with an initial luminance of $1,000\;cd/m^2$.

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