• Applied Chemistry for Engineering
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• v.20 no.6
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• pp.622-627
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• 2009

Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.228-230
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• 2005

Sn-8wt%Zn-3wt%Bi (이하, Sn-8Zn-3Bi) 솔더의 장기 신뢰성을 평가하기 위하여 고용고습시험을 행하였다. 고온 고습 시험은 $85^{\circ}C$/85RH 조건에서 1000 시간 동안 하였다. 접합 기판으로는 각각 OSP (Organic Solderability Preservative), Sn 그리고 Ni/Au 처리를 한 PCB(Printed Circuit Board) 패드를 사용하였다. 접합에 사용한 부품은 1608Chip 으로 MLCC(Multi Layer Ceramic Capacitor 이하, 1608C) 와 Chip Resister(이하, 1608R)을 사용하였으며, 이 두 부품의 전극부위에 Sn-10wt%Pb(이하 Sn-l0PB), Sn을 각각 도금하였다. 솔더링 후 1608C 와 1608R의 전단 접합 강도와 솔더링부에서 Zn상의 변화를 관찰하였다. 측정결과, Sn-8Zn-3Bi 솔더의 초기 전단 접합 강도는 기판의 표면처리에 상관없이 약 40N 이었다. 그러나 고온 고습 시험 1000 시간 후에는 기판의 표면처리에 상관없이 약 30N 까지 감소하였다. 하지만 이는 reference인 Sn-37Pb 솔더의 강도값과 거의 유사하며, 이는 Sn-8Bi-3Zn 솔더의 고온 고습 시험 후 전단강도 특성은 기존 유연솔더와 비교하여 동등이상이라고 평가할 수 있다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.67-67
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• 2018

The 5xxx series aluminum alloys are recently used in not only marine system but also automotive area because of a low density material, good mechanical properties and better resistance to corrosion. However, Aluminum alloys are less resistant than the purest aluminum such as 1xxx aluminum alloy. Electrochemical anodization technique has attracted in the area of surface treatment because of a simple procedure, a low-cost efficiency than other techniques such as lithography and a large volume of productivity, and so on. Here, The relationship between the corrosion behavior and the thickness of aluminum anodic oxide have been studied. Prior to anodization, The 5052 aluminum sheets ($30{\times}20{\times}1mm$) were degreased by ultra-sonication in acetone and ethanol for 10 minutes and eletropolished in a mixture of perchloric acid and ethanol (1:4, volume ratio) under an applied potential of 20V for 60 seconds to obtain a regular surface. During anodization process, Aluminum alloy was used as a working electrode and a platinum was used as a counter electrode. The two electrodes were separated at a distance of 5cm. The applied voltage of anodization is conducted at 40V in a 0.3M oxalic acid solution at $0^{\circ}C$ with appropriate magnetic stirring. The surface morphology and the thickness of AAO films was observed with a Scanning Electron Microscopy (SEM). The corrosion behavior of all samples was evaluated by an open-circuit potential and potentio-dynamic polarization test in 3.5wt% NaCl solution. Thus, The corrosion resistance of 5052 aluminum alloy is improved by the formation of an anodized oxide film as function of increase anodization time which artificially develops on the metal surface. The detailed electrochemical behavior of aluminum 5052 alloy will be discussed in view of the surface structures modified by anodization conditions such as applied voltages, concentration of electrolyte, and temperature of electrolyte.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.2
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• pp.73-83
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• 2014

Thanks to the development of diverse audio editing Technology, audio file can be easily revised. As a result, diverse social problems like forgery may be caused. Digital forensic technology is actively studied to solve these problems. In this paper, a hand-held device identification method, an area of digital forensic technology is proposed. It uses the noise features of devices caused by the design and the integrated circuit of each device but cannot be identified by the audience. Wiener filter is used to get the noise sounds of devices and their acoustic features are extracted via MIRtoolbox and then they are trained by multi-layer neural network. To evaluate the proposed method, we use 5-fold cross-validation for the recorded data collected from 6 mobile devices. The experiments show the performance 99.9%. We also perform some experiments to observe the noise features of mobile devices are still useful after the data are uploaded to UCC. The experiments show the performance of 99.8% for UCC data.

• Applied Microscopy
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• v.34 no.1
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• pp.51-59
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• 2004

The high acceleration voltage system used in scanning electron microscope were designed and manufactured to test its stability. The Cockcroft-Walton circuits are used both in the cathode voltage up to -30 kV and in the Wehnelt cylinder of -2 kV. The operating voltage of 6 V was applied to the heating of the filament. The wave forms which are formed in the second leg of the high voltage transformer were observed in the oscilloscope with 2 V of DC input. When the high voltages were in the range between 5 kV and 12 kV, the highest value of the stabilities of the generated voltages was obtained as 0.002%.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.7-13
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• 2011

In this paper, the IC(Integrated Circuit) for multi-channel synchronous communication was designed by using FPGA and VHDL language. The existing chips for synchronous communication that has been used commercially are composed for one to two channels. Therefore, when communication system with three channels or more is made, the cost becomes high and it becomes complicated for communication system to be realized and also has very little buffer, load that is placed into Microprocessor increases heavily in case of high speed communication or transmission of high-capacity data. The designed IC was improved the function and performance of communication system and reduced costs by designing 8 synchronous communication channels with only one IC, and it has the size of transmitter/receiver buffer with 1024 bytes respectively and consequently high speed communication became possible. It was designed with a communication signal of a form various encoding. To detect errors of communications, the CRC-ITU-T logic and channel MUX logic was designed with hardware logics so that the malfunction can be prevented and errors can be detected more easily and input/output port regarding each communication channel can be used flexibly and consequently the reliability of system was improved. In order to show the performance of designed IC, the test was conducted successfully in Quartus simulation and experiment and the excellence was compared with the 85C3016VSC of ZILOG company that are used widely as chips for synchronous communication.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.2
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• pp.101-109
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• 2005

The purpose of this study is to investigate the performance of outdoor heat exchanger for heat pump using carbon dioxide. Two types of fin and tube heat exchangers (2 rows for type A and 3 rows for B) are tested. Both heat exchangers have counter-cross flow and 1-circuit arrangement. Test results such as heat transfer rate, pressure drop characteristics and temperature distribution in the heat exchanger are shown with respect to mass flow rate of refrigerant and frontal air velocity For cooling mode, the minimum temperature difference between air and refrigerant of type B is smaller than that of type A by $1^{circ}C$, but the pressure loss of air side is much higher for type B by $29\%$. It is found that a large temperature gradient of carbon dioxide during gas cooling Process Promotes thermal conduction through tube wall and fins which results in degradation of heat transfer performance. For heating mode operation, type B heat exchanger shows higher heat transfer performance compared to type A. However, because pressure loss of refrigerant side of type B is much greater than that of type A, the refrigerant outlet pressure of type B becomes lower than that of type A.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.528-535
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• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.