Browse > Article
http://dx.doi.org/10.3740/MRSK.2005.15.8.528

Polarization Behaviors of SnCu Pb-Free Solder Depending on the P, Ni, Addition  

Hong Won Sik (Department of Materials Engineering, Hankuk Aviation University, Reliability and Failure Analysis Center, Korea Electronics Technology Institute)
Kim Whee Sung (Department of Materials Engineering, Hankuk Aviation University)
Park Sung Hun (Department of Materials Engineering, Hankuk Aviation University)
Kim Kwang-Bae (Department of Materials Engineering, Hankuk Aviation University)
Publication Information
Korean Journal of Materials Research / v.15, no.8, 2005 , pp. 528-535 More about this Journal
Abstract
It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.
Keywords
SnCu; intermetallic compound; polarization; corrosion rate;
Citations & Related Records
연도 인용수 순위
  • Reference
1 K. S. Kim, S. H. Huh and K. Suganuma, Int. Conf. on Electronics Packaging, JIEP, p. 89 (2002)
2 Directive 2002/95/EC of the European Parliament and of the Council, Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, EU (2003)
3 D. A. Jones, Principles and Prevention of Corrosion, Macmillan Pub. Company, New York, (1992)
4 M. G. Fontama, Corrosion Eng., 3rd ed., McGraw-Hill Int. Ed., New York (1988)
5 S. Ganesan and M. Pecht, Lead-free Eledtronics, 2004 ed., p. 197, CALCE ESPC Press, Maryland (2004)
6 R. Strauss, SMT Soldering Handbook, 2nd ed., p. 148, Newnes, Oxford (1998)
7 K. Suganuma, Lead free soldering in electronics, Marcel Dekker Inc. New York (2004)
8 J. S. Hwang, Environment-friendly electronics: lead-free tech., Electrochemical Pub. LTD (2001)
9 Lead free soldering project final report, JEITA, Tokyo (2000)
10 JEITA, Lead Free Soldering Tech., Corona Pub. Co. Ltd., Tokyo (2003)
11 C. Wagner, W. Traund and Z. Electrochem., 44, 391 (1938)