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Fabrication of Photosensitive Polymer Resistor Paste and Formation of Finely-Patterned Thick Film Resistors  

Kim, Dong-Kook (Department of Chemistry & Applied Chemistry, Hanyang University)
Park, Seong-Dae (Department of Chemistry & Applied Chemistry, Hanyang University,Korea Electronics Technology Institute)
Yoo, Myong-Jae (Korea Electronics Technology Institute)
Sim, Sung-Hoon (Korea Electronics Technology Institute)
Kyoung, Jin-Bum (Department of Chemistry & Applied Chemistry, Hanyang University)
Publication Information
Applied Chemistry for Engineering / v.20, no.6, 2009 , pp. 622-627 More about this Journal
Abstract
Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.
Keywords
photosensitive paste; thick film resistor; ultraviolet; carbon black; photo solder resist;
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