• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.93-98
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• 2008

We investigated the effect of process temperature on removal rate and non-uniformity based on single head kinematics in oxide CMP. Generally, it has been known that the temperature profile directly transfers to the non~uniformity of removal rate on the wafer, which has similar tendency with the sliding distance of wafer. Experimental results show that platen velocity is a dominant factor in removal rate as well as average temperature. However, the non-uniformity does not coincide between process temperature and removal rate, due to slurry accumulation and low deviation of temperature. Resultantly, the removal rate is strongly dependent on the rotational speed of platen, and its non -uniformity is controlled by the rotational speed of polishing head. It means lower WIWNU (With-in-wafer-non-uniformity) can be achieved in the region of higher head speed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.387-390
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• 2000

The life of transformer is significantly dependent on the thermal behavior in windings. To analyse winding temperature rise, many transformer designer have calculated temperature distribution and hot spot point by finite element method(FEM). Recently, numerical analyses of transformer are studied for optimum design, that is electric field analysis, magnetic field, potential vibration, thermal distribution and thermal stress. Therefore design time and design cost are decreased by numerical analysis. In this paper, the temperature distribution and thermal stress analysis of 50kVA pole cast resin transformer for power distribution are investigated by FEM program. The temperature change according to load rates of transformer also have been investigated. We have carried out temperature rise test and test results are compared with simulation data.

• Advances in nano research
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• v.10 no.1
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• pp.43-57
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• 2021

In this study, thermally induced bifurcation buckling of shallow composite cylindrical panels reinforced with aligned single-walled carbon nanotubes is investigated. Distribution of carbon nanotubes across the thickness of the cylindrical panel as reinforcements may be either uniform or functionally graded. Thermo-mechanical properties of the matrix and reinforcements are considered to be temperature dependent. Properties of the cylindrical panel are obtained using a refined micromechanical approach which introduces the auxiliary parameters into the rule of mixtures. The governing equations are obtained by using the static version of the Hamilton principle based on the first-order shear deformation theory and considering the linear strain-displacement relation. An energy-based Ritz method and an iterative process are used to obtain the critical buckling temperature of composite cylindrical panel with temperature dependent material properties. In addition, the effect of various parameters such as the boundary conditions, different geometrical conditions, distribution pattern of CNTs across the thickness and their volume fraction are studied on the critical buckling temperature and buckled pattern of cylindrical panels. It is shown that FG-X type of CNT dispersion is the most influential type in thermal stability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.8
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• pp.759-765
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• 2005

In this paper, developed isolator for gap filler is analyzed and designed using the simulation tool. Using the designed parameters, isolator is fabricated and tested in gap filler band. Temperature characteristics of isolator depend on magnet, YIG ferrite, and conductor etc. These require temperature stability and possible method of compensation for the temperature dependent effects. The temperature stabilization tries to use Ni-alloy. Developed isolator that compare with room temperature and high temperature characteristics has change fewer than 20 MHz. Implemented isolator shows more than 20 dB isolation characteristic at center frequency(2,650 MHz) and has 0.2 dB insertion loss in overall 100 MHz operating bandwidth. Return losses of input and output port are measured below -20 dB.

• KIEAE Journal
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• v.14 no.2
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• pp.29-36
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• 2014

The ground source heat pump (GSHP) system has attracted much of attention, because of its stability of heat production and the high efficiency of the system. Performance of the heat exchanger is dependent on the soil temperature, the ground thermal conductivity, the operation schedule, the pipe placement and the design temperature. However, in spite of the many variables of these systems, there have been few research on the effect of the systems on system performance. In this study, analysis of the heat exchange rate according to soil temperature and grout material was conducted by numerical simulation. Furthermore, the heat distribution around the ground heat exchanger was presented on the different conditions of grout and underground temperature by the simulation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.29-32
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• 2000

In this paper, an analytical model for I-V characteristics of a HEMTs is Proposed. The developed model takes into account the temperature dependence of drain current. In high-speed ICs for optical communication systems and mobile communication systems, temperature variation affects performance; for example the gain, efficiency in analog circuits and the delay time, power consumption and noise mrgin in digital circuits. To design such a circuit taking into account the temperature dependence of the current-voltage characteristic is indispensible. This model based on the analytical relation between surface carrier density and Fermi potential including temperature dependent coefficients.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.558-563
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• 1996

We fabricated high voltage hydrogenerated amorphous silicon thin film transistors (a Si:H HVTFT) and investigated its temperature dependent characteristics of from 303 K to 363 K. The results show that the drain current was decreased at low gate voltage and increased at high gate voltage exponentially. According to the increasing the thickness of a Si layer, drain current increased. Difference of drain current at 363 K was increasd at the lower gate voltage and decreased at the higher gate voltage. When the drain and gate voltage of 100 V applied, the drain current increased linearly with rise temperature.

• Wind and Structures
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• v.25 no.4
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• pp.381-395
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• 2017

Nonlinear vibration and instability of cylindrical shell conveying fluid-nanoparticles mixture flow are studied in this article. The surrounding elastic medium is modeled by Pasternak foundation. Mixture rule is used for obtaining the effective viscosity and density of the fluid-nanoparticles mixture flow. The material properties of the elastic medium and cylindrical shell are assumed temperature-dependent. Employing first order shear deformation theory (FSDT), the motion equations are derived using energy method and Hamilton's principal. Differential quadrature method (DQM) is used for obtaining the frequency and critical fluid velocity. The effects of different parameters such as volume percent of nanoparticles, boundary conditions, geometrical parameters of cylindrical shell, temperature change, elastic foundation and fluid velocity are shown on the frequency and critical fluid velocity of the structure. Results show that with increasing volume percent of nanoparticles in the fluid, the frequency and critical fluid velocity will be increases.

• Transactions of Materials Processing
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• v.21 no.4
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• pp.221-227
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• 2012

The automotive and electronic industries have seriously considered the use of magnesium alloys because of their excellent properties such as strength to weight ratio, EMI shielding capability, etc. However, it is difficult to form magnesium alloys at room temperature because of the mechanical deformation related to twinning. Hence, magnesium alloys are normally formed at elevated temperatures. In this study, a temperature dependent constitutive model, the C-H/V model, for the magnesium alloy AZ31B sheet is proposed. A hardening law based on nonlinear kinematic and H/V(Hollomon/Voce) hardening model is used to properly characterize the Bauschinger effect and the stabilization of the flow stress. Material parameters were determined from a series of uni-axial cyclic experiments(C-T-C) with the temperature ranging between 150 and $250^{\circ}C$. The developed models are fit to experimental data and a comparison is made.