• 대한기계학회논문집
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• 제6권4호
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• pp.341-345
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• 1982

The interpolator is usually built in hardware (logic circuitry), and the interpolator fabricated in a single LSI chip is recently made use of in most NC controllers, making the system more compact. However, the LSI interpolator not only has the technical difficulties but also requires high cost, in its fabrication. To solve these problems, we tried to find the method of interpolation by software, and succeeded in developing a program which, executed by INTEL's 8085 microprocessor, can distribute the input pulses of up to 4.0 [Kpps] for the linear interpolation and 3.0 [Kpps] for the circular interpolation. This paper presents the algorithm used to reduce the execution time and the flow chart of the interpolation program, and also shows the possibility of software interpolation. The interpolation program designed in assembly language is presented in the appendix.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.384-387
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• 1995

Two axes lateral-shearing interferometer(LSI) specially devised for production line inspection lenses is presented. The interferometer composed with four prisms and a dove prism can test the lens performance including asymmetric aspheric lens. The dove prism which rotates the input image with respect to optical axis makes it possible. The wavefront passing through the test lens is reconstsucted by the phase derivative obtained form the two axes LSI system. Zernike-polynomials fitting of this wavefront is presented for determinating quantitative aberration of aspherical lenses.

• 상하수도학회지
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• 제22권4호
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• pp.421-427
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• 2008

UV disinfection is widely used in water treatment facilities and wastewater treatment plant because of its effectiveness to removal of pathogen and Giardia which is resistant to traditional chemical disinfection. As a design and performance tool of UV disinfection system, 3 dimensional UV intensity models were composed and simulated to compare each other and to find affecting factors in this study. Reflection, refraction and absorption are important parameters in UV intensity model and MPSS and MSSS model can reflect these parameters while LSI model can not. Absorption is the most important parameters among the reflection, refraction, absorption and shadowing so, this should not be neglect. Based on this simulation, shadowing effect is negligible when the number of installed lamp is a few but, this effect can not be neglectable when the number of installed lamp is quite a few. The errors according to shadowing effect is increased as the number of lamp installed increased.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2003년도 somma/kms meeting
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• pp.195-195
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• 2003

• Bulletin of the Korean Chemical Society
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• 제34권9호
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• pp.2563-2564
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• 2013

• 산업공학
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• 제17권1호
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• pp.1-12
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• 2004

In a modern semiconductor device manufacturing industry, statistical bin limits on wafer level test bin data are used for minimizing value added to defective product as well as protecting end customers from potential quality and reliability excursion. Most wafer level test bin data show skewed distributions. By Monte Carlo simulation, this paper evaluates methods and sample size effect regarding determination of statistical bin limits. In the simulation, it is assumed that wafer level test bin data follow the Poisson distribution. Hence, typical shapes of the data distribution can be specified in terms of the distribution's parameter. This study examines three different methods; 1) percentile based methodology; 2) data transformation; and 3) Poisson model fitting. The mean square error is adopted as a performance measure for each simulation scenario. Then, a case study is presented. Results show that the percentile and transformation based methods give more stable statistical bin limits associated with the real dataset. However, with highly skewed distributions, the transformation based method should be used with caution in determining statistical bin limits. When the data are well fitted to a certain probability distribution, the model fitting approach can be used in the determination. As for the sample size effect, the mean square error seems to reduce exponentially according to the sample size.

• 전력전자학회논문지
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• 제4권3호
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• pp.285-293
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• 1999

본 논문에서는 인버터를 사용하여 진행파형 초음파 모터를 구동할 때에 구동 주파수, 위상차 및 상간의 전압을 제어하기 위해 새로운 방식의 초음파 모터 구동용 디지털 제어기를 제안하였다. 제안된 디지털 제어기는 주파수 발생과 위상차 제어를 하기 위하여 기존의 제어기에서 사용한 디지털-아날로그 혼합 방식이 아닌 디지털 논리에 의하여 출력이 발생되며 이로 인하여 제어기의 구성이 대폭 단순해진 특징을 갖는다. 제안된 디지털 제어기는 두 가지 형태로 주파수와 위상만을 제어하기 위한 경우와 상간의 전압까지 제어하기 위한 경우로 분리하였다. 실험에서는 상용 LSI와 EPLD를 사용하여 구현된 단순화된 디지털 제어기의 성능을 평가하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• 전자공학회지
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• 제22권2호
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• pp.37-50
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• 1995

This paper reviews NTT Laboratories' research and development of x-ray lithography during the last ten years since the application of synchrotron orbital radiation(SOR). First, the historical background of x-ray lithograhpy research, NTT's research programs on synchrotron x-ray lithography(SOR lithography), and the current status of NTT's SOR lithography system are overviewed. Then, the key elements of SOR lithography system are reviewed, including the electron storage ring, the x-ray stepper, and the x-ray mask. Finally the appilcation of SOR lithography technology to device fabrication is reported.

• 대한공간정보학회지
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• 제25권1호
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• pp.19-27
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• 2017

본 연구의 목적은 인제읍을 대상으로 빈도비와 로지스틱 회귀분석 모델을 통합한 앙상블 모델을 이용하여 산사태 취약성을 분석하고, 예측 정확도를 비교하는 것이다. 산사태 위치는 산사태 발생 전 후에 촬영된 항공사진을 이용하여 추출되었다. 추출된 총 422개의 산사태는 산사태 취약성 분석을 위해 훈련용 (70%)과 검증용 (30%) 자료로 랜덤하게 분류되었다. 산사태 관련인자는 고도, 경사도, 경사향, 배수로부터의 거리, 토양수분지수, 하천강도지수, 토질, 유효토심, 영급, 경급, 밀도, 임상 등 총 12개의 인자를 이용하였다. 산사태 및 산사태 관련인자는 공간데이터베이스로 구축된 뒤 빈도비와 앙상블 모델을 이용하여 산사태와 산사태 관련 인자 간 상관관계를 분석하였다. 그 결과를 바탕으로 각 모델별 산사태 취약성 지도를 작성하였고, relative operating characteristics(ROC) 곡선을 이용하여 예측 정확도를 검증 및 비교하였다. 분석 결과, 앙상블 모델에 의해 작성된 산사태 취약성 지도는 75.2%의 예측 정확도를 보였고, 이 결과는 빈도비 모델에 의해 작성된 산사태 취약성 지도와 비교하여 예측 정확도가 약 2% 향상된 것으로 나타났다. 본 연구에서 작성된 산사태 취약성 지도는 향후 효과적인 토지이용 계획을 수립하고, 재난재해로 인한 피해를 경감시키는데 활용 가능할 것으로 판단된다.