• Title/Summary/Keyword: system LSI

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Linear and Circular Interpolation for 2-Dimensional Contouring Control (2次元 輪곽制御 를 위한 直線 및 圓통補間)

  • 이봉진
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.6 no.4
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    • pp.341-345
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    • 1982
  • The interpolator is usually built in hardware (logic circuitry), and the interpolator fabricated in a single LSI chip is recently made use of in most NC controllers, making the system more compact. However, the LSI interpolator not only has the technical difficulties but also requires high cost, in its fabrication. To solve these problems, we tried to find the method of interpolation by software, and succeeded in developing a program which, executed by INTEL's 8085 microprocessor, can distribute the input pulses of up to 4.0 [Kpps] for the linear interpolation and 3.0 [Kpps] for the circular interpolation. This paper presents the algorithm used to reduce the execution time and the flow chart of the interpolation program, and also shows the possibility of software interpolation. The interpolation program designed in assembly language is presented in the appendix.

Two-axis latera I-shearing interferometer for performance test of lenses using a Dove prism (도브 프리즘을 이용한 렌즈 성능평가용 2축 층밀리기 간섭계)

  • 김승우;이혁교;김병창
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.384-387
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    • 1995
  • Two axes lateral-shearing interferometer(LSI) specially devised for production line inspection lenses is presented. The interferometer composed with four prisms and a dove prism can test the lens performance including asymmetric aspheric lens. The dove prism which rotates the input image with respect to optical axis makes it possible. The wavefront passing through the test lens is reconstsucted by the phase derivative obtained form the two axes LSI system. Zernike-polynomials fitting of this wavefront is presented for determinating quantitative aberration of aspherical lenses.

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A Study on the UV Intensity Models and their Affecting Factors (자외선 강도 산정 모델과 영향 인자에 관한 연구)

  • Kim, Dooil;Choi, Younggyun;Kim, Sunghong
    • Journal of Korean Society of Water and Wastewater
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    • v.22 no.4
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    • pp.421-427
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    • 2008
  • UV disinfection is widely used in water treatment facilities and wastewater treatment plant because of its effectiveness to removal of pathogen and Giardia which is resistant to traditional chemical disinfection. As a design and performance tool of UV disinfection system, 3 dimensional UV intensity models were composed and simulated to compare each other and to find affecting factors in this study. Reflection, refraction and absorption are important parameters in UV intensity model and MPSS and MSSS model can reflect these parameters while LSI model can not. Absorption is the most important parameters among the reflection, refraction, absorption and shadowing so, this should not be neglect. Based on this simulation, shadowing effect is negligible when the number of installed lamp is a few but, this effect can not be neglectable when the number of installed lamp is quite a few. The errors according to shadowing effect is increased as the number of lamp installed increased.

Methods and Sample Size Effect Evaluation for Wafer Level Statistical Bin Limits Determination with Poisson Distributions (포아송 분포를 가정한 Wafer 수준 Statistical Bin Limits 결정방법과 표본크기 효과에 대한 평가)

  • Park, Sung-Min;Kim, Young-Sig
    • IE interfaces
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    • v.17 no.1
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    • pp.1-12
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    • 2004
  • In a modern semiconductor device manufacturing industry, statistical bin limits on wafer level test bin data are used for minimizing value added to defective product as well as protecting end customers from potential quality and reliability excursion. Most wafer level test bin data show skewed distributions. By Monte Carlo simulation, this paper evaluates methods and sample size effect regarding determination of statistical bin limits. In the simulation, it is assumed that wafer level test bin data follow the Poisson distribution. Hence, typical shapes of the data distribution can be specified in terms of the distribution's parameter. This study examines three different methods; 1) percentile based methodology; 2) data transformation; and 3) Poisson model fitting. The mean square error is adopted as a performance measure for each simulation scenario. Then, a case study is presented. Results show that the percentile and transformation based methods give more stable statistical bin limits associated with the real dataset. However, with highly skewed distributions, the transformation based method should be used with caution in determining statistical bin limits. When the data are well fitted to a certain probability distribution, the model fitting approach can be used in the determination. As for the sample size effect, the mean square error seems to reduce exponentially according to the sample size.

A Simplified Digital Frequency/Phase/Voltage Controller for the Traveling Wave Type Ultrasonic Motor Drive System (초음파 모터 구동을 위한 단순화된 디지털 주파수/위상차/전압 제어기)

  • 이을재;김영석
    • The Transactions of the Korean Institute of Power Electronics
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    • v.4 no.3
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    • pp.285-293
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    • 1999
  • In this paper, the novel digital frequency/phase controller, to control the invelter fed traveling wave type ultra-sonic m motor(USM) is proposed. This controller is used to control the drive frequency, phase difference and applied voltages of e each phase of the motor. Proposed digital controller has constructed with digital logic only, no more use digitallongleftarrowanalog h hybrid method of the conventional controller, in order to generate drive frequency and phase difference. Therefore, the c control system has become to velY simple structure. T\rvo types of controllers are designed, one is to control drive f frequency and phase difference, another has added voltage control function of each phase. Two full digital voltage/phase c controllers are implemented by using custom LSI and EPLD, the control pelformance and the simplicity ofthe proposed c controller is verified by expeJimental results.

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Technologies for 3D Assembly and Chip-level Stack

  • Bonkohara, Manabu
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.65-89
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    • 2003
  • Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

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The Development of SOR Lithography Technology

  • Ishihara, Sunao
    • The Magazine of the IEIE
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    • v.22 no.2
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    • pp.37-50
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    • 1995
  • This paper reviews NTT Laboratories' research and development of x-ray lithography during the last ten years since the application of synchrotron orbital radiation(SOR). First, the historical background of x-ray lithograhpy research, NTT's research programs on synchrotron x-ray lithography(SOR lithography), and the current status of NTT's SOR lithography system are overviewed. Then, the key elements of SOR lithography system are reviewed, including the electron storage ring, the x-ray stepper, and the x-ray mask. Finally the appilcation of SOR lithography technology to device fabrication is reported.

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Landslide Susceptibility Mapping Using Ensemble FR and LR models at the Inje Area, Korea (FR과 LR 앙상블 모형을 이용한 산사태 취약성 지도 제작 및 검증)

  • Kim, Jin Soo;Park, So Young
    • Journal of Korean Society for Geospatial Information Science
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    • v.25 no.1
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    • pp.19-27
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    • 2017
  • This research was aimed to analyze landslide susceptibility and compare the prediction accuracy using ensemble frequency ratio (FR) and logistic regression at the Inje area, Korea. The landslide locations were identified with the before and after aerial photographs of landslide occurrence that were randomly selected for training (70%) and validation (30%). The total twelve landslide-related factors were elevation, slope, aspect, distance to drainage, topographic wetness index, stream power index, soil texture, soil sickness, timber age, timber diameter, timber density, and timber type. The spatial relationship between landslide occurrence and landslide-related factors was analyzed using FR and ensemble model. The produced LSI maps were validated and compared using relative operating characteristics (ROC) curve. The prediction accuracy of produced ensemble LSI map was about 2% higher than FR LSI map. The LSI map produced in this research could be used to establish land use planning and mitigate the damages caused by disaster.