• 반도체디스플레이기술학회지
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• 제1권1호
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• pp.15-19
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• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• 반도체디스플레이기술학회지
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• 제1권1호
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• pp.9-13
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• 2002

A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.21-24
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• 2005

Ink-jetting characteristics of pulse width and pulse amplitude for a piezoelectric ink jet printer driver have been mapped with various polymer EL ink. In this study, the jetting characteristics have been classified into 4 regime; no Jetting, unstable jetting, stable jetting, and spraying, and the importance of fluid viscosity on the scope of the stable jetting regime has been emphasized. The relation between jetting speed and the width and amplitude of driving signal has also been investigated and the effect of the speed on the jetting characteristics has been discussed.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.107-111
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• 2011

Polypropylene(PP)/carbon fiber(CF)/multi-walled carbon nanotube(MWCNT) nanocomposites along with various CF and MWCNT contents were prepared in a Twin screw extruder. Electrical, mechanical property and morphology were investigated with a variation of CF and MWCNT contents. From the surface resistance of PP/CF/MWCNT composites, MWCNT can increase the conductivity of composites compared with PP/CF composites without MWCNT. It is suggested that MWCNT and CF can make the conductive network in the polymer matrix. Flexural modulus and Izod impact strength of the PP/CF/MWCNT composites were improved with the increase of CF contents. Morphology showed that length of CF in polymer matrix was shortened by torque during melt mixing with MWCNT. As a result of this phenomenon, the impact strength of composites was somewhat decreased.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.23-26
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• 2012

The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.

• 반도체디스플레이기술학회지
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• 제10권3호
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• pp.49-52
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• 2011

This paper shows the results of classical molecular dynamics modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 3-dimensional molecular dynamics simulations using the Morse potential functions for chemical mechanical polishing. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. The simulation concerning polishing pad, abrasive particles and the substrate has same results.

• 반도체디스플레이기술학회지
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• 제18권3호
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• pp.36-41
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• 2019

Hybrid-type transparent electrodes were fabricated by depositing carbon nanotubes (CNTs) via spray coating on polyethylene terephthalate (PET) substrates and then coating the CNTs with [poly(3,4-ethylenedioxythiophene)] (PEDOT) films via electro-polymerization. For all of the fabricated electrodes, their surface morphologies, electric sheet resistances, visible transmittances, and color properties (e.g., yellowness) were characterized as functions of the applied voltages and process times used in electro-polymerization. The sheet resistance of the CNTs was significantly reduced by the coating of PEDOT, while their visible transmittances slightly decreased. The yellowness values of the PEDOT-coated CNTs were observed to have substantially decreased via electro-polymerization. The experimental results confirmed that the fabricated hybrid electrodes had desirable properties for the application of transparent electrode in terms of the electrical resistance, optical transmittance, and chromaticity.

• 반도체디스플레이기술학회지
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• 제13권1호
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• pp.101-108
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• 2014

The battery pack in this research consists of dozens of a small battery for energy storage. And this battery pack charges and discharges repeatedly at high capacity (25 ~ 50 V, 25 ~ 100 A). The high temperature which can be generated in this process has a bad effect to the lifetime and efficiency of batteries. Moreover these factors are related with maintenance cost. Therefore, we need to assess the thermal performance of the battery pack in advance using the experimental or numerical analysis. In this research, we analyzed voltage and surface temperature of one cell battery to calculate heat transfer using the numerical analysis. And the temperature of the battery surfaces and inside of the pack was also analyzed. As a result, we found out the appropriate pack structure which stacked five modules.

• 반도체디스플레이기술학회지
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• 제15권3호
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• pp.72-77
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• 2016

As the semiconductor production technology has gradually developed and intra-market competition has grown fiercer, the caliber of Si Wafer for semiconductor production has increased as well. And semiconductors have become integrated with higher density. Presently the Si Wafer caliber has reached up to 450 mm and relevant production technology has been advanced together. Electrostatic chuck is an important device utilized not only for the Wafer transport and fixation but also for the heat treatment process based on plasma. To effectively control the high calories generated by plasma, it employs a refrigerant-based cooling method. Amid the enlarging Si Wafers and semiconductor device integration, effective temperature control is essential. Therefore, uniformed temperature distribution in the electrostatic chuck is a key factor determining its performance. In this study, the form of refrigerant flow channel will be investigated for uniformed temperature distribution in electrostatic chuck.

• 반도체디스플레이기술학회지
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• 제11권3호
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• pp.39-44
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• 2012

Electronics in modern lives have become more miniaturized and precise. Multi Layered Ceramic Capacitor (MLCC) occupies 50% of electronic components consisting of electronics. This high volume of the production needs high speed and more precise machine performances. The dominate parts of the production equipments are the module transporting components and the visual inspection module. Most visual inspection has been off-line because of the image processing time. In this paper, a new image processing method is proposed to reduce thousands of matrix calculation for image processing and realize on-line high speed inspection.