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A Study on Nanoscale Surface Polishing using Molecular Dynamics Simulations  

Kang, Jeong-Won (Department of Computer Engineering, Chungju National University)
Choi, Young-Gyu (Department of Computer Engineering, Chungju National University)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.3, 2011 , pp. 49-52 More about this Journal
Abstract
This paper shows the results of classical molecular dynamics modeling for the interaction between spherical nano abrasive and substrate in chemical mechanical polishing processes. Atomistic modeling was achieved from 3-dimensional molecular dynamics simulations using the Morse potential functions for chemical mechanical polishing. The abrasive dynamics was modeled by three cases, such as slipping, rolling, and rotating. Simulation results showed that the different dynamics of the abrasive results the different features of surfaces. The simulation concerning polishing pad, abrasive particles and the substrate has same results.
Keywords
Chemical Mechanical Polishing; Molecular Dynamics; Semiconductor Processes;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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