• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.31-34
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• 2004

We develop Mueller-matrix spectroscopic ellipsometry based on dual compensator configuration. This technique is very powerful for measuring surface anisotropy in nano-scale, especially when materials show depolarization. Dual-rotating compensator configuration is adopted with the rotational ratio of 5:3 originally developed by Collins et al[1]. The instrument can provide 250-point spectra over the wavelength range from 230 nm to 820 nm in one irradiance waveform with minimum acquisition time of Tc=10 s. In this work, the results obtained in transmission modes are presented for the initial attempt. We present calibration procedures to diagnose the system from the utilized data collected in transmission mode without sample. We expect that the instrument will have important applications in thin films and surfaces that have anisotropy and inhomogeneity.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.45-49
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• 2004

We examined large particles and filter size effects of Central Chemical Supplying (CCS) system for STI-CMP on Light Point Defects (LPDs) after polishing. As manufacturing process recently gets thinner below 0.1 um line width, it is very important to keep down post-CMP micro-scratch and LPDs in case of STI-CMP. Therefore, we must control the size distribution of large particles in a slurry. With optimization of final filter size, CCS system is one of the solutions for this issue. The oxide and nitride CMP tests were accomplished using nano-ceria slurries made by ourselves. The number of large particles in a slurry and the number of LPDs on the wafer surface after CMP were reduced with decrease of the final filter size. Oxide removal rates slightly changed according to the final filter size, showing the good performance of self-made nano ceria slurries.

• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.11-14
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• 2003

The high Q(quality factor) suspended spiral inductors were fabricated on the silicon substrate by 3D surface micromachined process. The integration of 2.4GHz VCO has been performed by fabricating suspended spiral inductor of the top of CMOS VCO circuit. The phase noise of VCO integrated MEMS inductor is 93.5 dBc/Hz at 100kHz of offset frequency.

• Journal of the Semiconductor & Display Technology
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• v.13 no.3
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• pp.51-55
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• 2014

Ni-CNT(Carbon Nanotubes) composite coating is often used for the surface treatment of mechanical/electronic devices to improve the properties of the Ni coating. For the Ni-CNT coating, the dispersion of CNT fibers is a critical process. In this study, ultrasonic treatment instead of the conventional ball milling was attempted as a dispersion method for the electroless Ni-CNT coating. SEM-EDX analysis was performed and contact angle, sheet resistance, and micro-hardness were measured. Results showed that the ultrasonic treatment was comparable to the ball milling, as a dispersion method, but the difference was negligible. However, combined ball milling and ultrasonic treatment(double treatment) showed much improved micro-hardness value, above 350Hv(close to the value obtained by the Ni-CNT electroplating). In addition, electroless Ni-CNT(double-treated) coatings formed on the thin Ni film deposited by the electroless plating(double coating) showed better mechanical properties. Thus, double treatment and double coating are suggested as an improved electroless Ni-CNT coating method.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.73-78
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• 2016

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.67-72
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• 2020

This study analyzes the method of adhesion and improvement between heat.er and RF filter in PE-CVD equipment through TRIZ method and proposes a solution. TRIZ Solution such as function analysis, 9-window matrix, ASIT, and Root cause analysis were used. The contact temperature between the heater and the RF filter was 20% and the surface temperature was lowered to 5.7℃, suggesting an improvement method for the thermal expansion of the PE-CVD equipment hot zone.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1398-1400
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• 2002

A new PLF-BLU (Plastic Light Fiber-Back Light Unit) using side glowing light fiber rods array for the 42" LCD TV display has been evelopedd. The light fibers were 14mm in diameter and 50cm long pure transparent acrylic rods of 1.49 refractive index. Fine seratees were made on the flat side of rod. extremely bright incandscent light from lamp fed into the fiber si scattered at scratches then emerges through the surface of rod. A typical PLF-BLU system consists of 24 PLFs produced side glow of brightness of 4,500cd/㎡ to 6,500cd/㎡. New PLF-BLU is proved to be a BLU of rigid, bright, no heat generation, and low power consumption, hence a prospective BLU system for very and/or ultra large size TVs. A new LED-PLF-BLU system considered to be a revolutionary to break-through of the BLU technologies has also been developed, and is decribed briefly.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.95-96
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• 2009

It is analyzed how the Plasma - MgO surface interaction, driving waveform and their inter-relation can cause misfiring. Developing of glow discharge mode during the ramp reset due to lack of priming particles was suggested as one of the important misfiring sources. It is also shown that simple modification of reset waveform can considerably reduce misfiring probability.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.937-939
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• 2007

Carbon nanotubes (CNTs) have used as an electron field emitter of the field emission display (FED) due to their characteristics of high-electron emission, rapid response and low power consumption. However, to commercialize the FED with CNT emitter, some fundamental problems regarding life time and emission efficiency have to be solved. In this study, we investigated the $TiO_2$ coated CNT as a field emitter. $TiO_2$ nanoparticles can coated on CNT surface by chemical solution method. $TiO_2$ nanoparticles had uniform size with the average size of about 2.4 nm to 3.1 nm. Field emission performance of CNT coated with $TiO_2$ nanoparticles was evaluated and discussed.

• Transactions on Electrical and Electronic Materials
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• v.10 no.6
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• pp.189-192
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• 2009

The leakage current in a CMOS image sensor (CIS) can have various origins. Leakage current investigations have focused on such things as cobalt-salicide, source and drain scheme, and shallow trench isolation (STI) profile. However, there have been few papers examining the effects on leakage current of nitride stringers that are formed by gate sidewall etching. So this study reports the results of a series of experiments on the effects of a nitride stringer on real display images. Different step heights were fabricated during a STI chemical mechanical polishing process to form different nitride stringer sizes, arsenic and boron were implanted in each fabricated photodiode, and the doping density profiles were analyzed. Electrons that moved onto the silicon surface caused the dark leakage current, which in turn brought up the speckle defect on the display image in the CIS.