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Contact Pressure Distribution Measurement of PVA Brush for Post CMP Cleaning  

Ryu, Sun-Joong (Dept. of Mechanical Engineering, Dongyang Mirae University)
Kim, Doeg Jung (BrushTek Co., Ltd.)
Publication Information
Journal of the Semiconductor & Display Technology / v.15, no.4, 2016 , pp. 73-78 More about this Journal
Abstract
Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.
Keywords
post CMP cleaning; PVA brush; contact pressure;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
연도 인용수 순위
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